CuCrSiTi
Abstract: k75 leadframe "leadframe material" DIP 20 INFINEON cross reference FeNi42 solderability
Text: Solderability 06-June-03 Back Up Block 3 Solderability Solderability Source: STMicroelectronics 06-June-03 SO 8 Wetting force mN/mm No forced ageing Ageing : 16H150°C Good solderability of Sn coated components in SnPb Wetting balance test 235°C Zero cross time << 3 seconds
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06-June-03
16H150
10mN/mm
10seconds
06-Junitial
CuCrSiTi
k75 leadframe
"leadframe material" DIP 20
INFINEON cross reference
FeNi42
solderability
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Solderability Tests
Abstract: AN2036 AN-2036 an2036 st joint interfacial JESD22-B102 J-STD-002
Text: AN2036 APPLICATION NOTE Solderability Tests Lead-free devices, from STMicroelectronics, are warranted to pass the solderability tests, and to form a reliable solder joint with the base material of the circuit board, using Leaded Sn-Pb solder or Lead-free
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AN2036
2002/95/EU,
Solderability Tests
AN2036
AN-2036
an2036 st
joint interfacial
JESD22-B102
J-STD-002
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Solderability
Abstract: EIA-198-2-E EIA-198 EIA-198-2E
Text: 6/3/02 http:www.niccomp.com Technical Inquiries: tpmg@niccomp.com COMPONENT SOLDERABILITY PRODUCTS: SMT CERAMIC CHIP CAPACITORS & ARRAYS SERIES: NMC / NMC-E / NMC-L / NMC-H / NCA SOLDERABILITY SPECIFICATION >95% Coverage of terminal finish by new solder coat
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EIA-198-2-E
Solderability
EIA-198-2-E
EIA-198
EIA-198-2E
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Sn63Pb
Abstract: flux
Text: Point of note about solderability of lead free products attach “G” to package name Test Test condition Note Use of Sn-63Pb solder Bath Pass: Solder bath temperature = 230°C, Dipping time = 5 seconds solderability rate until forming The number of times = one, Use of R-type flux
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Sn-63Pb
Sn63Pb
flux
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Kester 182
Abstract: No abstract text available
Text: Technical Paper Solderability of Lead Free Electrodeposits in Tin/Lead Solder Dr. Robert D. Hilty & Marjorie K. Myers Tyco Electronics Harrisburg, PA Copyright Tyco Electronics, 2004 Publication 503-1001 Revision O 10NOV04 Solderability of Lead Free Electrodeposits in Tin/Lead Solder
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10NOV04
Kester 182
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MSQ1040
Abstract: 330UH SMD 330uH
Text: MINIATURE SQUARE SHIELDED SMD POWER INDUCTORS SERIES MSQ1040 FEATURES - 100% ferrite shielded. Very high current handling capacity. - Excellent solderability. High heat resistance. Low price ELECTRICAL SPECIFICATIONS - Inductance range - Test conditions 1.5uH -7uH
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MSQ1040
330uH)
330uH
25Vrms
100kHz
330mm
MSQ1040
330UH
SMD 330uH
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CviLux CONNECTOR
Abstract: 21/CviLux CONNECTOR
Text: FFC/FPC CONNECTORS CviLux CF SYSTEM CF Technical Specifications Testing Methods of Electronic Connectors Follow Below Military Standards: Dielectric Withstanding Voltage Contact Resistance Insulation Resistance Solderability - Per MIL-STD-1344A method 3001.1
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MIL-STD-1344A
MIL-STD-202F
CviLux CONNECTOR
21/CviLux CONNECTOR
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RJ11 jack dimension
Abstract: RJ45 jack low profile rj45 low profile RJ45 jack dimension RJ11 rj11 jack RJ11 pcb RJ11-6Z3 RJ45 dimension dimension RJ45
Text: Series Z Unfiltered low profile jack in RJ11 and RJ45 models. Shielded and unshielded models available. Specifications Contacts Material: Plating: Barrier underplating: Resistance: Initial: After durability testing 500 mating cycles : PCB Terminals Solderability
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1000VAC
RJ11-6Z
RJ11-6Z3
RJ11-6Z4
RJ45-8Z
RJ45-8Z3
RJ45-8Z4
RJ11 jack dimension
RJ45 jack low profile
rj45 low profile
RJ45 jack dimension
RJ11
rj11 jack
RJ11 pcb
RJ11-6Z3
RJ45 dimension
dimension RJ45
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Untitled
Abstract: No abstract text available
Text: Device Under Test: 90HBW08PT, 90HBW10PT, 90B08ST, 90B05ST, 90B10ST Environmental Test: Thermal Shock, Moisture resistance, Thermal aging, Resistance to Reflow Physical Test: Mechanical Life, Mechanical shock, Vibration Resistance, Terminal Strength Flammability, Solderability, Process seal
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90HBW08PT,
90HBW10PT,
90B08ST,
90B05ST,
90B10ST
SM04-17
SM04-17
MIL-STD-202,
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Untitled
Abstract: No abstract text available
Text: FHV Vishay Techno Thick Film Planar Resistors, Through-Hole, High Voltage FEATURES MECHANICAL SPECIFICATIONS Terminal Strength: 5 pound pull test Solderability: Continuous satisfactory coverage when tested in accordance with MIL-R-10509 MATERIAL SPECIFICATIONS
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2002/95/EC
MIL-R-10509
18-Jul-08
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Untitled
Abstract: No abstract text available
Text: Z Series Unfiltered low profile jack in RJ11 and RJ45 models. Shielded and unshielded models available. Specifications Contacts Material: Plating: Barrier underplating: Resistance: Initial: After durability testing 500 mating cycles : PCB Terminals Solderability
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1000VAC
RJ11-6Zating:
RJ11-6Z
RJ11-6Z3
RJ11-6Z4
RJ45-8Z
RJ45-8Z3
RJ45-8Z4
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Trichloroethane
Abstract: No abstract text available
Text: CLOCK OSCILLATOR GENERAL CHARACTERISTICS • MECHANICAL SPECIFICATIONS Gross Leak Test Hermetically Sealed Package Seal Strength Thru-Hole Bend Test (Pin Material) Solvent Resistance Marking Ink Solderability Maximum Soldering Temp. All units 100% leak tested.
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UMB01P050
Abstract: No abstract text available
Text: Industrial Microphotonics Company Unmounted 50W Pulsed Laser Diode Bar Part Number: UMB01P050 2.00 50.00 Optical Power W Electrical to Optical Efficiency (%) 40.00 Excellent Solderability Lot Tested Also Available from 915nm-980nm 1.50 30.00 1.00 20.00 0.50
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UMB01P050
915nm-980nm
laser2000
D-10/01
UMB01P050
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alcohol isopropylic
Abstract: No abstract text available
Text: Cermet Potentiometer Specifications TESTS Piher typical test results 95% LOTS R % Value DIN std 41450 R(%) Resistance to soldering heat < ±1% < ± 2% Solderability 95% of treated surface covered with solder Temperature cycling < ±2% Temperature coeficient
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Untitled
Abstract: No abstract text available
Text: CLOCK OSCILLATOR GENERAL CHARACTERISTICS MECHANICAL SPECIFICATIONS Gross Leak Test Hermetically Sealed Package Seal Strength Thru-Hole Bend Test (Pin Material) Solvent Resistance Marking Ink Solderability OSCILLATORS Maximum Soldering Temp. 44 All units 100% leak tested.
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posistor
Abstract: H60A
Text: Item Continuous Operating Temperature Resistance R25 Withstanding Voltage Tensil Strength of Lead Wire Terminal Bending Strength of Lead Wire Terminal Solderability Terminal Durability of Soldering Humidity Test Load Cycle Test at High Temperature Method of examination
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R/R25
posistor
H60A
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Untitled
Abstract: No abstract text available
Text: EMI Filters 4.1 to 4.7 4.1 - Production process flowchart 4.3 - Tests conducted during batch manufacture Standard products Multilayer ceramic part manufacture discoidal or planar array Solderability ● Voltage proof test DWV / Flash Solder assembly Cleaning process
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50Vdc
100Vdc
200Vdc
300Vdc
500Vdc
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208H
Abstract: No abstract text available
Text: Schematic: Notes: 1. Solderability: Leads shall meet MIL-STD-202G, Method 208H fo r solderability. 2. Flammability: UL94V-0 3. ASTM oxygen index: > 28% 4. Insulation System: Class F 155‘C. UL file E151556 5. Operating Temperature Range: All listed parameters
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MIL-STD-2026,
UL94V-0
E151556
102mm)
O-80-90-
10O-110-120-
SHIELD/77
300MHmensions:
12x00
XF10G02C-CTxul
208H
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208H
Abstract: No abstract text available
Text: Schematic: Notes: 1. Solderability: Leads shall meet M IL-STD-202G, Method 208H for solderability. 2. Flammability: U L94V-0 3. ASTM oxygen index: > 28% 4. Insulation System: Class F 155‘C. UL file E151556 5. Operating Temperature Range: All listed parameters
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MIL-STD-2026,
UL94V-0
E151556
102mm)
SHIELD/77
2MHz-50MHz
200MHz
400MHz
500MHz
12x00
208H
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208H
Abstract: VE1000
Text: 2 . Sch em atic: 1. M echanical D im ensions: PRI CO CM ° o ° o E h 2 1 HIPOT: 125Vrms, Wdg to Wdg t 1 Rated Voltage: 50Vdc Rated Current: 2A Notes: 1. Solderability: Leads shall meet MIL-STD-202G, Method 208H fo r solderability. 2. Flammabllity: UL94V—0
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XF0406
20M-300MHz
125Vrms,
50Vdc
MIL-STD-202G,
UL94V-0
E151556
102mm)
XF0406â
208H
VE1000
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Untitled
Abstract: No abstract text available
Text: 1. M echanical D im ensions: 1.28 Max A 2. Sch em atic: 3. E lectrical Specification s: 25°C OCL: 47uH ±20% I.O K H z 1.0V, OAdc OCL: 23.7uH±20% ®1KHz 1.0V, 11.8Adc DCR: 0.012 Ohms Max Notes: 1. Solderability: Leads shall meet M IL-STD -202, Method 208D for solderability.
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3XF0476â
MIL-STD-202,
UL94V-0
E151556
102mm)
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208H
Abstract: No abstract text available
Text: 1. M echanical D im ensions: X o -S m tn S - r \y CM co 0.004 0.638 Max 0.453 -ir 0.059 o to CO CD K CM O SUGGESTED PAD LAYOUT) Notes: 1. Solderability: Leads shall meet MIL—STD—202G, Method 208H fo r solderability. 2. Flammability: U L 94V -0 3. ASTM oxygen index: > 28%
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MIL-STD-202G,
UL94V-0
E151556
102mm)
10KHz
XFHCL01
208H
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W-S-6536
Abstract: WS6536 MIL-M38510 lead finish WS-6536
Text: Signetics SOW-2000 Solderability Acceptance Testing Statement of Work Military Products Reference Guide FEATURES • Complies with MIL-STD-2000 solderabllity requirements • Complies with WS6536E/I solderabllity requirements • Maximizes component “Shelf
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SOW-2000
MIL-STD-2000
WS6536E/I
MIL-STD-2000
WS6536E/I
MIL-STD-105,
MIL-M-38510/P3
MIL-STD-2000/P5
WS6536/P4
W-S-6536
WS6536
MIL-M38510 lead finish
WS-6536
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P1B14
Abstract: No abstract text available
Text: 2 1. M echanical Dim ensions: . Schem atic: XFMRS ► P YYWW O D 0 .1 2 5 Min Hi— pot: 0O.O2D±D.OO5 G » 0 .1 0 0 o o o o o o - 1 8 16 9 O D O O O D O o O - N o te s: 1. Solderability: Leads shall meet MIL— STD-Z0Z, Method 2 OSD fo r solderability.
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XF0013T13
1500Vac
100KHz
UL94V-0
E151556
P1B-14
P11-9
013T1
P1B14
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