AT350
Abstract: No abstract text available
Text: See page 89. -95- http://www.dailywell.com -96- http://www.dailywell.com SOLDERING PROCESSES MANUAL SOLDERING Use soldering iron of 30 watts, controlled at 350 approximately 5 seconds while applying solder. WAVE SOLDERING Recommended Soldering Temperature:260 5
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SOLDERing
Abstract: No abstract text available
Text: See Page 115. See Page 115. -129- http://www.dailywell.com -131- http://www.dailywell.com SOLDERING PROCESSES MANUAL SOLDERING Use soldering iron of 30 watts, controlled at 350 approximately 5 seconds while applying solder. WAVE SOLDERING Recommended Soldering Temperature:260 5
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profile wave soldering
Abstract: No abstract text available
Text: yA V - y A TANTALUM CAPACITORS Soldering Methods SOLDERING METHODS Solid tantalum chip capacitors can be attached by wave soldering or reflow soldering methods. The reflow soldering method however has become more popular since this process has been developed specifically for SMT components. Hand soldering is not
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SOD80 footprint
Abstract: SOD87 footprint land pattern sot346 SOD110 footprint SOD106 land pattern sod110 land do-41 footprint MSA435 DO-35 land pattern how epoxy can contribute to meniscus
Text: SECTION 17 MOUNTING AND SOLDERING contents page INTRODUCTION 17 - 2 AXIAL AND RADIAL LEADED DEVICES 17 - 2 Handling 17 - 2 Soldering 17 - 2 Mounting 17 - 3 SURFACE-MOUNT DEVICES 17 - 3 Reflow soldering process 17 - 3 Double-wave soldering process 17 - 7 Hand soldering of microminiature components
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MSB461
OT163-1)
MLC745
SOD80 footprint
SOD87 footprint
land pattern sot346
SOD110 footprint
SOD106 land pattern
sod110 land
do-41 footprint
MSA435
DO-35 land pattern
how epoxy can contribute to meniscus
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Untitled
Abstract: No abstract text available
Text: Fujrrsu Recommended Soldering Process Recommended Soldering Process: Soldering by hand: 350+/-10 degrees at the tip of the soldering iron for 3 seconds. Soldering dip: 260+/-5 degrees for 10+/-1 seconds. SMT mounting: Many mays can be used for SMT reflow. The most common is Vapor phase or infrared
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500grams.
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senju solder paste
Abstract: senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.3 SOLDER SUPPLY PROCESS 2.3.1 SOLDER PASTE 1 Material Composition Soldering paste is mainly made from soldering powder and flux. Soldering powder makes up approximately 80-95wt% of soldering paste
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80-95wt%
63Sn/37Pb)
62Sn/36Pb/2Ag)
senju solder paste
senju printing speed
Senju metal solder paste
viscometer
Rosin Flux Type RMA
Senju flux
Senju
soldering paste
solder powder
62Sn36Pb2Ag
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seam seal process
Abstract: No abstract text available
Text: Soldering Methodologies MEMSIC products are designed to withstand the temperature excursions experienced during hand soldering, reflow soldering, or wave soldering as the following procedures are followed. Manual Soldering. When soldering manually or repairing via soldering Iron or heat gun the time should be limited
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Untitled
Abstract: No abstract text available
Text: Recommended Soldering Conditions Surface mounting type 1. Mounting method with solder 1-1 Recommended reflow soldering condition In reflow soldering process, exact temperature-cycle management is essential. We recommend pre-heating before soldering, so that you can prevent not only package
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Untitled
Abstract: No abstract text available
Text: VISHAY SEMICONDUCTORS www.vishay.com Rectifiers Application Note Soldering Process Notes WAVE SOLDERING THROUGH HOLE ONLY Sn-Pb Wave Soldering Profile Lead (Pb)-free Wave Soldering Profile 235 °C to 260 °C wave temperature 250 300 Maximum temperature can not exceed 265 °C
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19-Oct-11
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Untitled
Abstract: No abstract text available
Text: Gl RECOMMENDED SOLDERING PROCESSING FOR SURFACE MOUNT AND AXIAL-LEADED COMPONENTS INFRARED REFLOW SOLDERING IR WAVE SOLDERING Soldering with IR has the highest yields due to controlled heating rates and solder liquidus times. Only the dwell time and peak temperature limitations
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Untitled
Abstract: No abstract text available
Text: RECOMMENDED PATTERN Pattern Dimensions Unit: mm LL1005-FH and PTL1005-F Series • LL1608-FH/FS and PTL1608-F Series LL2012-FH and PTL2012-F Series R o w Soldering R eflow Soldering R o w Soldering R eflow Soldering Flow Soldering R eflow Soldering & 0 .3 - 0.5
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LL1005-FH
PTL1005-F
LL1608-FH/FS
PTL1608-F
LL2012-FH
PTL2012-F
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Melf composition
Abstract: No abstract text available
Text: Recommended Soldering Techniques Recommended Soldering Techniques by David B. Hutchins, Senior Applications Engineer Introduction The soldering process is the means by which electronic components are mechanically and electrically connected into the circuit assembly. Adhering to good soldering practices will preserve the inherent reliability of the original
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IR35-207-2
Abstract: No abstract text available
Text: ¿{PD77C25, 77P25 NEC ★ 8. RECOMMENDED SOLDERING CONDITIONS When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
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uPD77C25
uPD77P25
C10535E)
/xPD77C25GW-xxx:
32-pin
P15-162-1
PD77C25C-xxx:
28-pin
PD77P25C:
IR35-207-2
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SN63-SRMAP
Abstract: M83519 NATIONAL AEROSPACE STANDARDS NAS1745 IST253-62 S0211L NAS-1745 S0103L S0102L S0203
Text: RADIALL offers a complete selection of MIL-S-83519, NAS-1745/1746 and wire-to-wire splicing Soldering sleeves. RADIALL Soldering Sleeves ensure high quality, long lasting electrical and mechanical performance. RADIALL Soldering Sleeves are an economical alternative to traditional interconnect processes, such as hand soldering and standard crimping.
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MIL-S-83519,
NAS-1745/1746
SN63-SRMAP
M83519
NATIONAL AEROSPACE STANDARDS
NAS1745
IST253-62
S0211L
NAS-1745
S0103L
S0102L
S0203
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Untitled
Abstract: No abstract text available
Text: www.eLED.com EM2520SECK09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SECK09 Recommended Soldering Pattern Units : mm
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EM2520SECK09
1000PCS
EA0130
EM2520SEK09-3/3
AUG/31/2001
EM2520SECK09
EM2520SEK09-1/3
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Untitled
Abstract: No abstract text available
Text: Soldering Conditions Recommended Pattern Pattern Dimensions Unit: mm LL2012-F Series a b c Flow Soldering 1.0-1.4 0.8 - 1.2 0.8 ~ 1.0 Reflow Soldering 1.0- 1.2 0 .6 - 1.0 0.8 - 1.2 LL1608-F/FH Series Flow Soldering 0.8 - 1.0 0.8 - 1.0 0.6 - 0.8 Reflow Soldering
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LL2012-F
LL1608-F/FH
LL1005-FH
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WS60-00-1
Abstract: Chlorine
Text: RECOMMENDED SOLDERING CONDITIONS OF WAVE SOLDERING WS60-00-1 The following is recommended soldering conditions of wave soldering Maximum temperature (Solder temperature) Time at maximum temperature Preheating temperature (Package’s surface temperature)
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WS60-00-1)
WS60-00-1SSD-A-M0034-4
WS60-00-1
Chlorine
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Untitled
Abstract: No abstract text available
Text: www.eLED.com EM2520SYC09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SYC09 Recommended Soldering Pattern Units : mm
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1000PCS
EA0133
EM2520SY09-3/3
AUG/31/2001
EM2520SYC09
EM2520SY09-1/3
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Untitled
Abstract: No abstract text available
Text: www.eLED.com EM2520SEC09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SEC09 Recommended Soldering Pattern Units : mm
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EM2520SEC09
1000PCS
EA0129
EM2520SE09-3/3
AUG/31/2001
EM2520SEC09
EM2520SE09-1/3
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Untitled
Abstract: No abstract text available
Text: Recommended Soldering Techniques Introduction The soldering process is the means by which electronic components are mechanically and electrically connected into the circuit assembly. Adhering to good soldering practices will preserve the inherent reliability of the original
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AP02014
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Untitled
Abstract: No abstract text available
Text: www.eLED.com EM2520SYCK09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SYCK09 Recommended Soldering Pattern Units : mm
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1000PCS
EA0135
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AUG/31/2001
EM2520SYCK09
EM2520SYK09-1/3
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Aluminum Electrolytic Capacitors
Abstract: No abstract text available
Text: Soldering of aluminum electrolytic capacitors Hand soldering soldering iron 1. When soldering aluminum electrolytic capacitors with a soldering iron the exposure should be limited to 260°C for 10 seconds or 350°C for 3 seconds. 2. At no time should the soldering iron come in contact with the capacitor body. Contact with the body can cause
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ssop24 footprint
Abstract: PowerMos transistors TO220 package SSOP16 SSOP24 SSOP24 300 1 footprint sot89 stencil
Text: DISCRETE SEMICONDUCTORS Mounting and soldering PowerMOS transistors 1998 Dec 02 Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION LEADED DEVICES Handling Soldering GENERAL DATA AND INSTRUCTIONS FOR THE
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OT186A;
OT263;
220AB
MLC747
SSOP16
OT338-1)
SSOP24
OT340-1)
OT338-1
ssop24 footprint
PowerMos transistors TO220 package
SSOP16
SSOP24
SSOP24 300 1 footprint
sot89 stencil
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Untitled
Abstract: No abstract text available
Text: 31 SMD Handling Precautions 1. S oldering T h ere are generally tw o types o f SM D soldering m ethods: reflow soldering and flow dip sodering. N ecessary precautions for these soldering m ethods are as follow s: 1.1 (1) Soldering M ethods R eflow Soldering
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