"Solid State Relay"
Abstract: No abstract text available
Text: • Solid State Relay : Lead-free part soldering conditions DIP6pin SMD / DIP8pin(SMD) ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time.
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Abstract: No abstract text available
Text: Soldering Profile à Soldering Typocal Performance Characteristics • Profile Reflow Soldering Pre-heating Soldering Cooling 230 5 250 200 150 100 60 sec. min 10 sec. max 60 sec. min Flow Soldering Pre-heating Soldering Cooling 230 5 250 200 150 100 60 sec. min
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phototriac
Abstract: No abstract text available
Text: • Phototriaccoupler : Lead-free part soldering conditions SOP4pin ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice.
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SOP4
Abstract: No abstract text available
Text: • Photocoupler : Lead-free part soldering conditions DIP4pin SMD / DIP6pin(SMD) / DIP8pin(SMD) / DIP16pin(SMD) ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time.
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DIP16pin
SOP4
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Abstract: No abstract text available
Text: MULTILAYER VARISTORS Soldering Profile REFLOW SOLDERING PROFILE Peak 230°C Soldering 10 sec. max. 230°C REFLOW SOLDERING PROFILE(Peak 250°C) Cooling 60 sec. min. Soldering 10 sec. max. 250°C 220°C 200°C 190°C 60 sec. max. 180°C 20 sec. max. 150°C
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Abstract: No abstract text available
Text: RECOMMENDED MOUNTING METHOD RECOMMENDED MOUNTING METHOD 1. Soldering Methods The recommended soldering methods for each package are shown in the following table. 1 Soldering Temperature Profile of Reflow Recommended reflow soldering temperature profile is in the following.
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Abstract: No abstract text available
Text: RECOMMENDED MOUNTING METHOD RECOMMENDED MOUNTING METHOD 1. Soldering Methods The recommended soldering methods. 1 Soldering Temperature Profile of Reflow Recommended reflow soldering temperature profile is in the following. a: Temperature ramping rate b: Pre-heating Temperature
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60-120s
28kHz
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Abstract: No abstract text available
Text: Quartz Crystal Units n Precautions for Use [Manual Soldering Heat Resistance] 3. Reflow Soldering The figure below shows the standards for reflow soldering Use condition: Apply 400 °C soldering iron to product terminal temperature profiles of surface-mount type crystal units.
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Abstract: No abstract text available
Text: Soldering Temperature Profiles Wave soldering Temperature characteristic at component terminal with dual wave soldering Temperature Normal curve 235°C . 260°C 2nd wave Limit curves 1st wave approx. 200 K/s 100°C . 130°C Forced cooling Time Infrared-reflow soldering
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B463-P6311-X-X-7600
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Abstract: No abstract text available
Text: VISHAY SEMICONDUCTORS www.vishay.com Rectifiers Application Note Soldering Process Notes WAVE SOLDERING THROUGH HOLE ONLY Sn-Pb Wave Soldering Profile Lead (Pb)-free Wave Soldering Profile 235 °C to 260 °C wave temperature 250 300 Maximum temperature can not exceed 265 °C
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19-Oct-11
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AT350
Abstract: No abstract text available
Text: See page 89. -95- http://www.dailywell.com -96- http://www.dailywell.com SOLDERING PROCESSES MANUAL SOLDERING Use soldering iron of 30 watts, controlled at 350 approximately 5 seconds while applying solder. WAVE SOLDERING Recommended Soldering Temperature:260 5
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SOLDERing
Abstract: No abstract text available
Text: See Page 115. See Page 115. -129- http://www.dailywell.com -131- http://www.dailywell.com SOLDERING PROCESSES MANUAL SOLDERING Use soldering iron of 30 watts, controlled at 350 approximately 5 seconds while applying solder. WAVE SOLDERING Recommended Soldering Temperature:260 5
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pine alpha st-100s arakawa chemical
Abstract: 2SB1051K tssop8 package 750H ST-100S
Text: Soldering conditions Surface mount type Transistors Condition of soldering for Surface mount type Transistors Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/4 Recommended condition of flow soldering 2/4 Condition of hand soldering
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Abstract: No abstract text available
Text: KOA SPEER ELECTRONICS, INC. KOA Pb-Free Components Recommended Soldering Information and Profile Reflow Profile 3 cycle Max. Flow Soldering Maximum Solder Temperature – 260oC Maximum Time in Solder – 10 Seconds Hand Soldering A pencil type soldering of 30 walls maximum and with a diameter of 3 mm maximum
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260oC
300oC
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Photo Relays
Abstract: FL 210 FL 210 transistor Photo MOS Relay
Text: WORLD PRODUCTS INC. ELECTRONIC COMPONENT SOLUTIONS RECOMMENDED SOLDERING CONDITIONS ISOCOUPLER PHOTO COUPLER Recommended Temperature Profile of Infrared Reflow Package Surface Temperature T °C Infrared Reflow Soldering Peak reflow soldering: 235°C
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Abstract: No abstract text available
Text: TAP Technical Summary and Application Guidelines SECTION 4: APPLICATION GUIDELINES FOR TANTALUM CAPACITORS 4.1 SOLDERING CONDITIONS AND BOARD ATTACHMENT 4.2 RECOMMENDED SOLDERING PROFILES The soldering temperature and time should be the minimum for a good connection.
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Aluminum Electrolytic Capacitors
Abstract: No abstract text available
Text: Soldering of aluminum electrolytic capacitors Hand soldering soldering iron 1. When soldering aluminum electrolytic capacitors with a soldering iron the exposure should be limited to 260°C for 10 seconds or 350°C for 3 seconds. 2. At no time should the soldering iron come in contact with the capacitor body. Contact with the body can cause
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ssop24 footprint
Abstract: PowerMos transistors TO220 package SSOP16 SSOP24 SSOP24 300 1 footprint sot89 stencil
Text: DISCRETE SEMICONDUCTORS Mounting and soldering PowerMOS transistors 1998 Dec 02 Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION LEADED DEVICES Handling Soldering GENERAL DATA AND INSTRUCTIONS FOR THE
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OT186A;
OT263;
220AB
MLC747
SSOP16
OT338-1)
SSOP24
OT340-1)
OT338-1
ssop24 footprint
PowerMos transistors TO220 package
SSOP16
SSOP24
SSOP24 300 1 footprint
sot89 stencil
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Untitled
Abstract: No abstract text available
Text: Kingbright APPLICATION NOTES Soldering 6. Lamp Wave Soldering Profile. Wave Soldering Pay Attention 1. We recommend manual solder operations only for repair. If a soldering iron is used, the maximum power consumption should be limited to 30W and soldering temperature
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Abstract: No abstract text available
Text: RECOMMENDED SOLDERING METHODS <§ 1. SOLDERING METHOD There are two methods for SMD, flow soldering dipping into the solder bath and reflow soldering. RECOMMENDED SOLDERING METHODS Package -> SC K-Pack T-Pack X X Methods i Flow Soldering Reflow Soldering
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electrolytic capacitor
Abstract: dip electrolytic capacitor
Text: ALUMINUM ELECTROLYTIC CAPACITORS Reflow soldering method for the chip aluminum electrolytic capacitor 1. Recommended conditions for reflow soldering The chip aluminum electrolytic capacitor is subjected to soldering by reflow method. Temperature and time conditions of reflow soldering shall be set as per each temperature profile shown below
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Abstract: No abstract text available
Text: RECOMMENDED PATTERN Pattern Dimensions Unit: mm LL1005-FH and PTL1005-F Series • LL1608-FH/FS and PTL1608-F Series LL2012-FH and PTL2012-F Series R o w Soldering R eflow Soldering R o w Soldering R eflow Soldering Flow Soldering R eflow Soldering & 0 .3 - 0.5
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LL1005-FH
PTL1005-F
LL1608-FH/FS
PTL1608-F
LL2012-FH
PTL2012-F
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profile wave soldering
Abstract: No abstract text available
Text: yA V - y A TANTALUM CAPACITORS Soldering Methods SOLDERING METHODS Solid tantalum chip capacitors can be attached by wave soldering or reflow soldering methods. The reflow soldering method however has become more popular since this process has been developed specifically for SMT components. Hand soldering is not
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Abstract: No abstract text available
Text: Soldering Recommendations Vishay Vitramon Monolithic Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection: 5. Soldering Techniques: Follow the soldering curves shown on next page. A. Our tin plate nickel barrier termination Termination
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22-Sep-99
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