SOP JEDEC TRAY Search Results

SOP JEDEC TRAY Result Highlights (5)

Part	Manufacturer	Description
TPH9R00CQH	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)
TPH9R00CQ5	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N)
TPH1R306PL	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N)
TPHR8504PL	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N)
TPH2R408QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance

SOP JEDEC TRAY Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
SOP 812 Abstract: No abstract text available Text: Packing Magazine Name MM525-02A LB-066 Mounting Pad JEDEC Tray 32P SOP 32 pin SOP 525 mil 32 17 +7° 1 3° –3° detail of lead end 16 A J E K F G H I N C D L B M M P32GW-50-525A NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at	Original	MM525-02A LB-066 P32GW-50-525A SOP 812	PDF
jrc 2100 audio amplifier Abstract: HA13166 HA17324A LM324 HA13165 M51995AFP M51995P ha13168 HA17555 equivalent HA13164A IC ha17555 Text: 2004.4 Management Linear ICs/ Renesas Standard Linear ICs Power Multi-Purpose Linear ICs Status List Topic 1—Series of Small Multi-Purpose Linear ICs for Low-Voltage Operation •··················································2	Original	M62249FP HA17431UPA M5295AP M51945AL M51945BL M51952AL M51952BL M51955AL M51955BL M51958AL jrc 2100 audio amplifier HA13166 HA17324A LM324 HA13165 M51995AFP M51995P ha13168 HA17555 equivalent HA13164A IC ha17555	PDF
tray datasheet bga Abstract: fujitsu ic trays sol Text: Packing for Shipment • Packing form The packaging used to deliver products consits of tubes, trays, tapes, inner boxes, and an outer box. See Figures 1 to 7. The tubes, trays, and tapes are designed to protect the products from damage. After unpacking	Original	DB81-10008-2E DB81-10005-1E tray datasheet bga fujitsu ic trays sol	PDF
high speed solid state relay Abstract: solid state mini relay MM74 Fairchild single HIGH SPEED POWER MOSFET NC7WV16 Solid State Relay CMOS Logic Family Specifications 74F675 4000 series CMOS Logic ICs 74VHC4040 Text: Fairchild PSG.book Page i Wednesday, July 28, 2004 11:12 AM Fairchild Semiconductor Product Catalog Rev. 1 Analog & Mixed Signal Discrete Power Interface & Logic Microcontrollers Optoelectronics RF Power Front Matter.fm Page ii Monday, August 2, 2004 10:09 AM	Original	TS-16949 ISO-14001, high speed solid state relay solid state mini relay MM74 Fairchild single HIGH SPEED POWER MOSFET NC7WV16 Solid State Relay CMOS Logic Family Specifications 74F675 4000 series CMOS Logic ICs 74VHC4040	PDF
land pattern for TSOP 2-44 Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions	Original		PDF
SSOP12 Abstract: SOP package tray SOP JEDEC tray SSOP12 Package h740 JEDEC TRAY DIMENSIONS SSOP-12 Text: TRAY CONTAINER NEC 119.9 5.86 135° CMAX. 10.90 SSOP12.3 x 6.1A 8.00 135.9 PPE 12 × 20=240 UNIT : mm 12.70 15.50 10.25 294.5 315.0 322.6 SECTION A-A' 5.27 (6.35) 7.62 12.70 Applied Package 38-pin • Plastic Shrink SOP Quantity (pcs) 240 MAX. SSOP12.3 × 6.1A	Original	SSOP12 38-pin SSD-A-H7409 SOP package tray SOP JEDEC tray SSOP12 Package h740 JEDEC TRAY DIMENSIONS SSOP-12	PDF
JEDEC TRAY DIMENSIONS ssop Abstract: H649 JEDEC TRAY DIMENSIONS JEDEC TRAY ssop SOP JEDEC tray JEDEC tray standard Text: TRAY CONTAINER UNIT : mm HEAT PROOF PPE 7 105.0 NEC 10.3 135°C MAX. 15.00 15.45 375mil48p SSOP A' 15.75 22.00 14.50 286.0 315.0 322.6 SECTION A – A' 5.27 (6.35) 15.75 7.62 135.9 8x14=112 A Applied Package Quantity (pcs) 48-pin • Plastic Shrink SOP (1.7 mm thick)	Original	375mil48p 48-pin 375mil48pSSOP SSD-A-H6495-1 JEDEC TRAY DIMENSIONS ssop H649 JEDEC TRAY DIMENSIONS JEDEC TRAY ssop SOP JEDEC tray JEDEC tray standard	PDF
TSOP-48 pcb LAYOUT Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010 Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions	Original		PDF
JEDEC TRAY DIMENSIONS ssop Abstract: SOP package tray JEDEC tray standard 20pin SOP SOP JEDEC tray JEDEC TRAY DIMENSIONS JEDEC TRAY ssop TRAY DIMENSIONS JEDEC TRAY DIMENSIONS ssop 20 JEDEC tray standard H645 Text: TRAY CONTAINER UNIT : mm HEAT PROOF 7 PPE NEC 135°C MAX. A' 8.4 12.75 135.9 300mil20p SSOP 10.58 114.75 10x24=240 A 6.4 12.20 17.20 280.6 315.0 322.6 SECTION A – A' 5.27 7.62 (6.35) 6.40 Applied Package Quantity (pcs) 20-pin • Plastic Shrink SOP (1.2 mm thick)	Original	300mil20p 20-pin 300mil20pSSOP SSD-A-H6455-1 JEDEC TRAY DIMENSIONS ssop SOP package tray JEDEC tray standard 20pin SOP SOP JEDEC tray JEDEC TRAY DIMENSIONS JEDEC TRAY ssop TRAY DIMENSIONS JEDEC TRAY DIMENSIONS ssop 20 JEDEC tray standard H645	PDF
H7665 Abstract: SOP package tray SSOP36 SOP JEDEC tray H7665 DATA SHEET JEDEC TRAY DIMENSIONS JEDEC tray standard 490 Text: TRAY CONTAINER UNIT : mm 120.9 14 x 35=490 135° C MAX. 3.9 8.85 7.05 6.8 NEC A' 9.30 7.50 SSOP3.6 × 4.4A 135.9 PPE A 300.9 315.0 322.6 SECTION A-A' 5.92 6.35 7.62 3.90 Applied Package 10-pin Plastic Shrink SOP Quantity (pcs) 490 MAX. Tray SSOP3.6×4.4A	Original	10-pin SSD-A-H7665 H7665 SOP package tray SSOP36 SOP JEDEC tray H7665 DATA SHEET JEDEC TRAY DIMENSIONS JEDEC tray standard 490	PDF
JEDEC TRAY DIMENSIONS Abstract: JEDEC tray standard SOP JEDEC tray ssop300mil10 SOP package tray tray container dimensions TRAY DIMENSIONS TRAY CONTAINER SSD-A-H6451-2 H645 Text: TRAY CONTAINER UNIT : mm PPE 7 HEAT PROOF 114.75 NEC 135° MAX. A' 8.4 10.58 12.75 SSOP300MIL10 135.9 10x21=210 A 9.6 14.75 10.00 295.0 315.0 322.6 SECTION A – A' 5.27 7.62 (6.35) 9.60 Applied Package Quantity (pcs) 30-pin • Plastic Shrink SOP (1.2 mm, 1.7 mm thick)	Original	SSOP300MIL10 30-pin SSD-A-H6451-2 JEDEC TRAY DIMENSIONS JEDEC tray standard SOP JEDEC tray ssop300mil10 SOP package tray tray container dimensions TRAY DIMENSIONS TRAY CONTAINER SSD-A-H6451-2 H645	PDF
pioneer PAL 007 A Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions	Original		PDF
PAL 007 pioneer Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56 Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions	Original		PDF
IC179-44 Abstract: IC179 1610c D 1651 IC179-28 Text: SOP Oversized Footprint SMT IC179 Series Ordering Information IC179- * - 11 * Characteristics Current Rating: Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Mating Cycles: Socket Series No. of Contacts Row Spacing Mil	Original	IC179 IC179- 10mA/20mV Thermoplastic-UL94V-0 IC179-28450-50* IC179-32525-50* IC179-44600-50* IC179-44 1610c D 1651 IC179-28	PDF

IC179 Abstract: IC179-44600 Text: SOP Oversized Footprint SMT IC179 Series Ordering Information IC179- * - 11 * Characteristics Current Rating: Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Mating Cycles: Socket Series No. of Contacts Row Spacing Mil	Original	IC179 IC179- 10mA/20mV Thermoplastic-UL94V-0 IC179-28450-50* IC179-32525-50* IC179-44600-50* IC179-44600	PDF
sop package tray Abstract: 29754* intel weight of SOP package SOP JEDEC tray Text: SMALL OUTLINE PACKAGE GUIDE OVERVIEW Intent This overview provides a quick reference for the Small Outline Package Guide, Intel literature order number 296514. Contents The table below details, in outline form, the type of information that can be found in the guide.	Original		PDF
SJ 38 Abstract: qsc 1110 MicroPak-10 dqfn8 SJ38 mac010a M14D M16D jedec sot-23 6 lead MTC14 Text: Revised February 2004 Logic and Switch Products Ordering Information Ordering Information TinyLogic is a trademark of Fairchild Semiconductor Corporation. CROSSVOLT, FACT, FACT Quiet Series, FAST, FASTr, and MicroPak are trademarks of Fairchild Semiconductor Corporation.	Original	MS012540 SJ 38 qsc 1110 MicroPak-10 dqfn8 SJ38 mac010a M14D M16D jedec sot-23 6 lead MTC14	PDF
IC179-28375-301 Abstract: IC179 SOP JEDEC tray Text: SOP SMT IC179 SERIES ORDERING INFORMATION IC179- * * - 31 * * Socket Series No. of Contacts Characteristics Current Rating: Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Mating Cycles: Row Spacing Mil Materials and Finish	Original	IC179 IC179- 10mA/20mV Thermoplastic-UL94V-0 IC179-28375-301 SOP JEDEC tray	PDF
c9013 Abstract: 84 pin PBGA oscilloscope MTBF TSMC retention memory dc 8069 IS61C1024 IC Data-book Q-16 car radio 14x20 TSOP 8638 Text: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Quality System Manual QUALITY Reliabilty Report 1997-1998 RELIABILITY Integrated Silicon Solution, Inc. An ISO 9001 Company 1997 Integrated Silicon Solution, Inc.	Original	R-118 c9013 84 pin PBGA oscilloscope MTBF TSMC retention memory dc 8069 IS61C1024 IC Data-book Q-16 car radio 14x20 TSOP 8638	PDF
70241k Abstract: d5611 61c256 ic 9022 61c64 RELIABILITY REPORT ISSI vacuum tubes CMS 2015 S/TRANSISTOR J 5804 EQUIVALENT 28F010P Text: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Reliability Report 1997-1998 An ISO 9001 Company 1997 Integrated Silicon Solution, Inc. Integrated Silicon Solution, Inc. • 2231 Lawson Lane • Santa Clara, CA 95054	Original	R-118 70241k d5611 61c256 ic 9022 61c64 RELIABILITY REPORT ISSI vacuum tubes CMS 2015 S/TRANSISTOR J 5804 EQUIVALENT 28F010P	PDF
IPC-J-STD-001 Abstract: TRAY DAEWON TSOP 6n1 tube IPC-JSTD-001 VHH10-6N1 Intel Corporation esd flash small outline package guide DAEWON tray 48 optical Pick-Up head venturi meter R08-01-FOGO Text: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.5 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Process Procedures	Original		PDF
IC sj 4558 Abstract: OF 8 pin DIP IC 1251 SJ 1848 SOT-23 HP M5194 sj 4558 HA1631 Text: Product Numbers Product Numbers 1 Product Numbers 2 Renesas New Package Code Destination Standard Logic Part No. Composition P R DP 0008 A F - A HD74HC T 1G 04 CM E • Auxiliary appearance code 1 alphanumeric character; sequential *No general common rules; this code is used to identify lead shape and the like.	Original	HD74HC R18CS0003EJ0200 IC sj 4558 OF 8 pin DIP IC 1251 SJ 1848 SOT-23 HP M5194 sj 4558 HA1631	PDF
DAEWON tray tsop 48LD Abstract: nikon v12B 6n1 tube IPC-J-STD-001 nikon GRAINGER TRAY TSOP 56LD daewon TRAY DAEWON TSOP venturi meter Text: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.4 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Procedures	Original		PDF
IC 50061 Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1 Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing	Original		PDF

SOP JEDEC TRAY Search Results

SOP JEDEC TRAY Result Highlights (5)

SOP JEDEC TRAY Datasheets Context Search

SOP 812

jrc 2100 audio amplifier

tray datasheet bga

high speed solid state relay

land pattern for TSOP 2-44

SSOP12

JEDEC TRAY DIMENSIONS ssop

TSOP-48 pcb LAYOUT

JEDEC TRAY DIMENSIONS ssop

H7665

JEDEC TRAY DIMENSIONS

pioneer PAL 007 A

PAL 007 pioneer

IC179-44

IC179

sop package tray

SJ 38

IC179-28375-301

c9013

70241k

IPC-J-STD-001

IC sj 4558

DAEWON tray tsop 48LD

IC 50061