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    SOT-57 Search Results

    SOT-57 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MKZ6V2 Toshiba Electronic Devices & Storage Corporation Zener Diode, 6.2 V, SOT-23 Visit Toshiba Electronic Devices & Storage Corporation
    MSZ6V8 Toshiba Electronic Devices & Storage Corporation Zener Diode, 6.8 V, SOT-346 Visit Toshiba Electronic Devices & Storage Corporation
    MUZ20V Toshiba Electronic Devices & Storage Corporation Zener Diode, 20 V, SOT-323 Visit Toshiba Electronic Devices & Storage Corporation
    MKZ6V8 Toshiba Electronic Devices & Storage Corporation Zener Diode, 6.8 V, SOT-23 Visit Toshiba Electronic Devices & Storage Corporation
    MSZ12V Toshiba Electronic Devices & Storage Corporation Zener Diode, 12 V, SOT-346 Visit Toshiba Electronic Devices & Storage Corporation

    SOT-57 Datasheets (14)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT570-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 180 balls Original PDF
    SOT570-1 NXP Semiconductors Footprint for reflow soldering SOT570-1 Original PDF
    SOT570-2 NXP Semiconductors Footprint for reflow soldering SOT570-2 Original PDF
    SOT570-2 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 180 balls Original PDF
    SOT570-3 NXP Semiconductors thin fine-pitch ball grid array package; 180 balls Original PDF
    SOT570-3 NXP Semiconductors Footprint for reflow soldering SOT570-3 Original PDF
    SOT572-1 NXP Semiconductors Plastic low profile quad flat package; 100 leads; body 12 x 12 x 1.4 mm Original PDF
    SOT573-1 NXP Semiconductors Plastic quad flat package; 144 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm Original PDF
    SOT573-1 NXP Semiconductors Footprint for reflow soldering SOT573-1 Original PDF
    SOT574-1 NXP Semiconductors Plastic thin quad flat package; 128 leads; body 14 x 14 x 1 mm Original PDF
    SOT576-1 NXP Semiconductors Plastic thermal enhanced quad flat package;160 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm; high stand-off height; heatsink Original PDF
    SOT577-2 NXP Semiconductors Plastic rectangular-DIL-bent-SIL power package; 17 leads (row spacing 2.54 mm) Original PDF
    SOT578-1 NXP Semiconductors Plastic Triple-bent-SIL power package; 13 leads (lead length 7.7 mm) Original PDF
    SOT579-1 NXP Semiconductors Footprint for reflow soldering SOT579-1 Original PDF