SOT600-1 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.8 mm |
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SOT601-1 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 280 balls; body 16 x 16 x 0.8 mm |
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SOT602-1 |
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NXP Semiconductors
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Plastic thermal enhanced ball grid array package; 256 balls; body 27 x 27 x 0.9 mm; heatsink |
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SOT603-1 |
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NXP Semiconductors
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Plastic thermal enhanced ball grid array package; 420 balls; body 35 x 35 x 0.9 mm; heatsink |
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SOT604-1 |
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NXP Semiconductors
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Plastic thermal enhanced ball grid array package; 504 balls; body 35 x 35 x 0.9 mm; heatsink |
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SOT605-1 |
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NXP Semiconductors
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Plastic thermal enhanced ball grid array package; 600 balls; body 40 x 40 x 0.9 mm; heatsink |
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Original |
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SOT607-1 |
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NXP Semiconductors
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Plastic thin shrink small outline package; 30 leads; body width 4.4 mm; lead pitch 0.5 mm |
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Original |
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SOT608a |
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NXP Semiconductors
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Flanged ceramic package; 2 mounting holes; 2 leads |
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SOT608A_112 |
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NXP Semiconductors
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CDFM2; blister pack; standard product orientation 12NC ending 112 |
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SOT608B |
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NXP Semiconductors
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ceramic earless flanged package; 2 leads |
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Original |
PDF
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SOT610-1 |
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NXP Semiconductors
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Plastic thermal enhanced ball grid array package; 456 balls; body 35 x 35 x 1.8 mm; heatsink |
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Original |
PDF
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SOT611-1 |
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NXP Semiconductors
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Plastic ball grid array package; 329 balls; body 31 x 31 x 1.75 mm |
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Original |
PDF
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SOT611-2 |
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NXP Semiconductors
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Plastic ball grid array package; 329 balls; body 31 x 31 x 1.75 mm |
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Original |
PDF
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SOT612-2 |
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NXP Semiconductors
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Plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad |
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Original |
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SOT612-3 |
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NXP Semiconductors
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Plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad |
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Original |
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SOT612-4 |
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NXP Semiconductors
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Plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad |
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Original |
PDF
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SOT616-1_115 |
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NXP Semiconductors
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HVQFN24; Reel pack; SMD, 7"Q1/T1 Standard product orientationOrderable part number ending ,115 or XOrdering code (12NC) ending 115 |
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PDF
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SOT616-3 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm |
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Original |
PDF
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SOT616-3_118 |
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NXP Semiconductors
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HVQFN24; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
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Original |
PDF
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SOT616-3_128 |
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NXP Semiconductors
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HVQFN24; Reel pack; SMD, 13", Turned Q2/T3 Standard product orientation Orderable part number ending ,128 or HP Ordering code (12NC) ending 128 |
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