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    SOT-74 Search Results

    SOT-74 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TC75S102F Toshiba Electronic Devices & Storage Corporation Operational Amplifier, 1.5V to 5.5V, I/O Rail to Rail, IDD=0.27μA, SOT-25 Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TCR2EF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation
    TCR2LF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation

    SOT-74 Datasheets (16)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT740-1 NXP Semiconductors Footprint for reflow soldering SOT740-1 Original PDF
    SOT740-1 NXP Semiconductors Plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1.05 mm Original PDF
    SOT740-2 NXP Semiconductors Plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm Original PDF
    SOT741-1 NXP Semiconductors Footprint for reflow soldering SOT741-1 Original PDF
    SOT741-1 NXP Semiconductors Plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm Original PDF
    SOT744-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.9 mm Original PDF
    SOT745-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm Original PDF
    SOT745-1 NXP Semiconductors Footprint for reflow soldering SOT745-1 Original PDF
    SOT746-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.7 mm Original PDF
    SOT746-1 NXP Semiconductors Footprint for reflow soldering SOT746-1 Original PDF
    SOT747-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.7 mm Original PDF
    SOT747-1 NXP Semiconductors Footprint for reflow soldering SOT747-1 Original PDF
    SOT748-1 NXP Semiconductors Plastic chip on foil package; 35 mm wide tape Original PDF
    SOT748-2 NXP Semiconductors Plastic chip on foil package; 35 mm wide tape Original PDF
    SOT748-3 NXP Semiconductors Plastic chip on foil package; 48 mm wide tape Original PDF
    SOT748-4 NXP Semiconductors Plastic chip on foil package; 48 mm wide tape Original PDF