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    SOT105 Datasheets (10)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT1050 NXP Semiconductors Plastic ultra thin small outline package; no leads; 6 terminals Original PDF
    SOT1051-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 273 balls Original PDF
    SOT1051-1 NXP Semiconductors Footprint for reflow soldering SOT1051-1 Original PDF
    SOT1052-1 NXP Semiconductors Plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.5 mm Original PDF
    SOT1054-1 NXP Semiconductors Footprint for reflow soldering SOT1054-1 Original PDF
    SOT1054-1 NXP Semiconductors Plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4 x 0.85 mm Original PDF
    SOT1055-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 41 terminals; body 7 x 7 x 0.85 mm Original PDF
    SOT1056-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 38 terminals; resin based; body 4 x 4 x 0.9 mm Original PDF
    SOT1058-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 136 balls Original PDF
    SOT1059-1 NXP Semiconductors Plastic extremely thin small outline package; no leads; 10 terminals; UTLP based; body 1 x 2.5 x 0.5 mm Original PDF

    SOT105 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    HVSON14

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint for reflow soldering of HVSON14 package SOT1054-1 4.200 pa + oa 3.500 0.500 oa 0.500 4.150 1.800 1.500 sr 0.800 0.250 2.350 3.200 3.900 pa + oa 0.500 0.800 2.100 3.200 sr 0.0150 3.500 solder land + solder paste


    Original     		PDF HVSON14 OT1054-1 OT1054-1 sot1054-1

    IP4282CZ6

    Abstract: "ESD Protection" IP4221CZ6-S IP4283CZ10 IP4280CZ10 IP4281CZ10 SOT1059
    Text: NXP high-speed ESD protection in ultra-thin leadless packages IP4221/42 < 1.0 pF and IP4281/2/3 (< 0.7 pF) Bring ESD protection closer to the data lines These integrated ESD protection devices, housed in leadless SOT886 and SOT1059 packages, simplify circuit design, reduce routing design times, and cut pick-and-place costs. They’re cost


    Original     		PDF IP4221/42 IP4281/2/3 OT886 OT1059 10-TB com/pip/IP4283CZ10 IP4282CZ6 "ESD Protection" IP4221CZ6-S IP4283CZ10 IP4280CZ10 IP4281CZ10 SOT1059

    Untitled

    Abstract: No abstract text available
    Text: Package outline HXSON8: plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.5 mm X b v M A B B D SOT1052-1 A A E A1 detail X terminal 1 index area C 1/2 e terminal 1 index area y1 C e 1 y 4 L 8x Eh 8 5 Dh


    Original     		PDF OT1052-1 MO229 MO-229 sot1052-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline TFBGA273: plastic thin fine-pitch ball grid array package; 273 balls A B D SOT1051-1 ball A1 index area E A2 A A1 detail X e1 ∅v ∅w b e W V U T R P N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9


    Original     		PDF TFBGA273: OT1051-1 MO-195

    Untitled

    Abstract: No abstract text available
    Text: Package outline USON6: plastic ultra thin small outline package; no leads; 6 terminals; body 1.5 x 2.1 x 0.55 mm SOT1050 X B D A E A A1 detail X terminal 1 index area b v M A B C y1 C e terminal 1 index area 1 y 3 L eE 6 4 1 2 mm scale DIMENSIONS mm are the original dimensions


    Original     		PDF OT1050

    Untitled

    Abstract: No abstract text available
    Text: Package outline XSON10U: plastic extremely thin small outline package; no leads; 10 terminals; UTLP based; body 1 x 2.5 x 0.5 mm SOT1059-1 B D A E A A1 terminal 1 index area detail X e1 e L1 v w b 1 5 M M C C A B C y1 C y L2 e2 L 10 6 X 0.5 1 mm scale DIMENSIONS mm are the original dimensions


    Original     		PDF XSON10U: OT1059-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN38R: plastic thermal enhanced very thin quad flat package; no leads; 38 terminals; resin based; body 4 x 4 x 0.9 mm B D SOT1056-1 A terminal 1 index area E A detail X e1 e L L1 D2 D5 1/2 e A7 B3 B6 v w b A12 M M C C A B C y1 C y D3 D6


    Original     		PDF HVQFN38R: OT1056-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA136: plastic low profile fine-pitch ball grid array package; 136 balls B D SOT1058-1 A ball A1 index area E A A2 A1 detail X e1 ∅v ∅w b e 1/2 e C C A B C M M y1 C y P N M L K J H G F E D C B A e e2 1/2 e ball A1 index area 1 2 3 4


    Original     		PDF LFBGA136: OT1058-1

    HVSON14

    Abstract: No abstract text available
    Text: Package outline HVSON14: plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4 x 0.85 mm SOT1054-1 X A B D E A A1 c detail X terminal 1 index area e1 terminal 1 index area e v w b 1 7 M M C C A B C y1 C y L Eh 14 8 Dh


    Original     		PDF HVSON14: OT1054-1 HVSON14

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA273 package SOT1051-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF TFBGA273 OT1051-1 OT1051-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN41: plastic thermal enhanced very thin quad flat package; no leads; 41 terminals; body 7 x 7 x 0.85 mm B D SOT1055-1 A terminal 1 index area E A A1 c detail X e1 e 1/2 e L v w b 2e 10 20 9 M M C C A B C y y1 C 21 Ej 2e e2 1/2 e Eh e 1


    Original     		PDF HVQFN41: OT1055-1

    prtr5v0u6s

    Abstract: csp1040 TSSOP20 FOOTPRINT ip4065cx11 smd transistor GY sot89 IP4065CX11/LF BV 9y transistor smd IP4058CX8/LF IP4280CZ10 smd transistor GY
    Text: Dark Green − NXP‘s transfer to halogen-free products Why Dark Green? We as NXP are deeply committed to developing eco-friendly products and integrating environmental safety aspects in all manufacturing processes. For our packaging technology this meant a shift to lead-free and halogen-free “Dark Green”, years


    Original     		PDF 2002/95/EC. PMBTA42 PMEG3005EL PMEG6010EP PMR780SN PTVS12VS1UR PZU13y PMBTA42DS PMEG3005ET PMEG6010ER prtr5v0u6s csp1040 TSSOP20 FOOTPRINT ip4065cx11 smd transistor GY sot89 IP4065CX11/LF BV 9y transistor smd IP4058CX8/LF IP4280CZ10 smd transistor GY

    IP4283CZ10

    Abstract: TSSOP10 XSON10U IP4220CZ6 SOT1059-1 sot552-1
    Text: IP4283CZ10 series ESD protection for ultra high-speed interfaces Rev. 2 — 27 August 2010 Product data sheet 1. Product profile 1.1 General description The devices are designed to protect high-speed interfaces such as High-Definition Multimedia Interface HDMI , DisplayPort, external Serial Advanced Technology


    Original     		PDF IP4283CZ10 XSON10U, XSON10 TSSOP10. TSSOP10 XSON10U IP4220CZ6 SOT1059-1 sot552-1

    SSM3J307T

    Abstract: SSM3J328R SSM3J334R
    Text: 2011-5 PRODUCT GUIDE General-Purpose Small-Signal Surface-Mount Devices Transistors, MOSFETs, ESD-Protection Diodes, Schottky Barrier Diodes, L-MOS 1- to 3-Gate Logic ICs , LDOs, Operational Amplifiers, Digital-Output Magnetic Sensors SEMICONDUCTOR h t t p : / / w w w . s e m i c o n . t o s h i b a . c o . j p / e n g


    Original     		PDF 200-mA BCE0030D SSM3J307T SSM3J328R SSM3J334R

    Arduino Mega2560

    Abstract: 13001 S 6D TRANSISTOR arduino uno rev 3 agilent optical encoder 9988 MZ 13001 TRANSISTOR arduino mega 2650 skiip 613 gb 123 ct arduino sound sensor module pic arduino nano mc34063l
    Text: ND3% BASE1 XXXX2108-0010-1-P 10 TSQ: 3001 CMS: CMS-USM TS host OP: NN COMP: 15-07-11 Hour: 13:07 TS:TS date TS time MCUS, MPUS, DSPS & DEVELOPMENT TOOLS Find Datasheets Online 8-BIT MCUS & DEVELOPMENT TOOLS 1 PSoC 3 DEVELOPMENT KITS ARDUINO MCU DEVLOPMENT PLATFORM


    Original     		PDF CY8C38 CY8C29 incl795 12T9797 12T9804 12T9803 12T9800 12T9802 12T9801 12T9805 Arduino Mega2560 13001 S 6D TRANSISTOR arduino uno rev 3 agilent optical encoder 9988 MZ 13001 TRANSISTOR arduino mega 2650 skiip 613 gb 123 ct arduino sound sensor module pic arduino nano mc34063l

    hwson8 footprint

    Abstract: SE97 1E70H JESD22-A114 JESD22-A115 JESD78 SE98 Diode BAW 62 SE98B
    Text: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 03 — 17 August 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the


    Original     		PDF SE98A SE98A JC-42 hwson8 footprint SE97 1E70H JESD22-A114 JESD22-A115 JESD78 SE98 Diode BAW 62 SE98B

    SE97A

    Abstract: SE97B DDR3 DIMM SE97 SE97PW jedec MO229 JESD22-A114 JESD22-A115 JESD78 SE97TK
    Text: SE97 DDR memory module temp sensor with integrated SPD, 3.3 V Rev. 04 — 30 January 2009 Product data sheet 1. General description The NXP Semiconductors SE97 measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C and also provide 256 bytes


    Original     		PDF JC-42 SE97A SE97B DDR3 DIMM SE97 SE97PW jedec MO229 JESD22-A114 JESD22-A115 JESD78 SE97TK

    IP4056

    Abstract: SIMCARD Schematic Hdmi to micro usb wiring diagram ip4065cx11 SD-Card MMC IP4826CX12 IP4056CX8 IP4058CX8 IP5002CX8 back2back diode
    Text: Integrated Discretes Interface conditioning and interface protection in mobile appliances Rev. 8.1 — 9 March 2011 Brochure Document information Info Content Keywords Integrated Discretes, EMI filter, ESD protection, chip scale package CSP , level shifting, memory card, SD memory card, MMC, T-flash,


    Original     		PDF

    Silicon Tuners

    Abstract: Temperature sensors TDA18272 tda18273 TDA20136 convert sata to usb cable diagram tda19997 usb to sata converter circuit diagram TDA20142 TDA19995
    Text: Application guide Flat-panel TV sets Contents Your partner for flat-panel TV sets 3 1. Power solutions 4 1.1 1.2 1.3 1.4 Primary AC/DC controllers Main power supply: secondary synchronous rectification ICs Standby power supply Discretes 2. RF reception stage


    Original     		PDF

    land pattern for sot109-1

    Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
    Text: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products


    Original     		PDF DO-35 DO-41 DO-34 OD80C OD123F HXSON12) OT983 land pattern for sot109-1 TSSOP-8 footprint and soldering sot-23 SOD87 footprint

    Untitled

    Abstract: No abstract text available
    Text: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 02 — 6 August 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the


    Original     		PDF SE98A SE98A JC-42

    AC128 transistor

    Abstract: bc649 BC646 AC188 ac187 BCS48 bc660 AC188 transistor transistor AC128 AC188 AC187
    Text: Transistors germanium low/medium power transistors Dwg. ref. O utline •b z -0 ?î book 1 parts 1 and 2 V CBO V V ceo (V) M axim um Ratings lCM IC(AV) (A ) (A) Ptot at 25PC (°C> <mW) Tj m in. at •c fT ty p . (m A i (MHz) 2.5 h FE max. Special Features


    OCR Scan     		PDF at25PC AC128 AC187 AC188 2N1303 2N1306 2N1307 2N1309 h--22-> crt6-25 AC128 transistor bc649 BC646 AC188 ac187 BCS48 bc660 AC188 transistor transistor AC128 AC188

    DIODO LN4148

    Abstract: A2 diodo zener diodo zener 5.1 B2 diodo 1n4148 diodo s4 diodo s4 81 6.8 B2 diodo a52 zener diode diodo 72 DIODO LED
    Text: Microminiature devices diodes book 1 part 3 Outline SO T-23 Type No. | | » Q £ BAV70 X4 BAW66 X5 BAV99 X6 Description Common cathode double diodo Common anode double diodo Two diodes i n series intended for high speed switching. Vrrm Ifrm Max. Reverse Recovery Time, t rr


    OCR Scan     		PDF OT-23 BAV70 BAV99 1N4148 200mW OT-23 BZX84 h--22-> crt6-25 DIODO LN4148 A2 diodo zener diodo zener 5.1 B2 diodo 1n4148 diodo s4 diodo s4 81 6.8 B2 diodo a52 zener diode diodo 72 DIODO LED

    RPY 86

    Abstract: valvo halbleiter RPY94 CQY 24 BV EI 30-20 3001 LDR 03 diode byx 64 600 valvo transistoren KP101A BAV99-1
    Text: Elektronik. Wir bauen die Elemente. v a i v D Halbleiterbauelemente Produktprogramm DH, April 1984 Elektronik. Wir bauen die Elemente Unser Arbeitsgebiet - besonders die Mikroelektronik - entwickelt sich immer rascher zum Motor für eine Vielzahl von Innovationen. Mit gründ­


    OCR Scan     		PDF