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    SOT1172-3 Search Results

    SOT1172-3 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT1172-3 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad Original PDF