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    SOT1331-1 Search Results

    SOT1331-1 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT1331-1 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 38 leads; body with 4.4 mm; lead pitch 0.5 mm; exposed die pad Original PDF