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    SOT48 Price and Stock

    Nexperia

    Nexperia 74AVC16T245DGV,118

    Translation - Voltage Levels SOT480-1 DUAL SUPPLY TRANSCVR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74AVC16T245DGV,118 Reel 2,500
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    Nexperia 74AVC16T245DGV-Q1J

    Translation - Voltage Levels 1-to-4 fan-out buffer
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74AVC16T245DGV-Q1J Reel 2,500
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    Nexperia 74LVC16245ADGV-Q1J

    Bus Transceivers 16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74LVC16245ADGV-Q1J Reel 2,500
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    Nexperia 74LVCH16244ADGV-QJ

    Buffers & Line Drivers 16-bit buffer/line driver; 5 V input/output tolerant; 3-state
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74LVCH16244ADGV-QJ Reel 2,500
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    Nexperia 74LVC162244ADGVJ

    Buffers & Line Drivers 16-bit transceiver with direction pin; 30 Ohm series termination resistors;5 V tolerant input/output; 3-state
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74LVC162244ADGVJ Reel 2,500
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    SOT48 Datasheets (8)

    Part
    ECAD Model
    Manufacturer
    Description
    Curated
    Datasheet Type
    PDF
    SOT480-1 NXP Semiconductors Plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm Original PDF
    SOT481-2 NXP Semiconductors Plastic thin shrink small outline package; 56 leads; body width 4.4 mm Original PDF
    SOT482B NXP Semiconductors leadless surface mounted package; plastic cap; 4 terminations Original PDF
    SOT482C NXP Semiconductors leadless surface mounted package; plastic cap; 4 terminations Original PDF
    SOT486-1 NXP Semiconductors Plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm Original PDF
    SOT487-1 NXP Semiconductors Footprint for reflow soldering Original PDF
    SOT487-1 NXP Semiconductors Plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm Original PDF
    SOT489-1 NXP Semiconductors Plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm Original PDF

    SOT48 Datasheets Context Search

    Catalog Datasheet
    Type
    Document Tags
    PDF

    sot486

    Abstract: SOT486-1
    Text: PDF: 1999 Nov 03 Philips Semiconductors Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 c y X A 73 72 108 109 ZE e E HE A A2 A 3 A1 θ wM Lp bp L pin 1 index detail X 37 144 1 36 v M A ZD wM bp e


    Original     		LQFP144: OT486-1 OT486-1 MS-02 MS-026 sot486 SOT486-1 PDF

    sot488

    Abstract: No abstract text available
    Text: PDF: 1999 Jun 08 Philips Semiconductors Package outline LFBGA48: plastic low profile fine-pitch ball grid array package; 48 balls; body 5.5 x 5.5 x 1.05 mm SOT488-1 D ball A1 index area A2 A E A1 detail X A b ∅w M y v A ZD e ZE J H G e F E D C B A 1 2 3 4 5 6 7 8 9


    Original     		LFBGA48: OT488-1 sot488 PDF

    TSSOP32

    Abstract: TSSOP-32
    Text: PDF: 2000 Jan 05 Philips Semiconductors Package outline TSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm SOT487-1 E D A X c y HE v M A Z 17 32 A2 A 3 A A1 pin 1 index θ Lp L 1 detail X 16 w M bp e 2.5 5 mm


    Original     		TSSOP32: OT487-1 MO-153 TSSOP32 TSSOP-32 PDF

    1337k

    Abstract: No abstract text available
    Text: DISCRETE SEMICONDUCTORS BGY241 UHF amplifier module P relim inary specification Philips Semiconductors PHILIPS Philips Semiconductors Preliminary specification UHF amplifier module BGY241 FEATURES PINNING - SOT482B • 3.5 V nominal supply voltage PIN DESCRIPTION


    OCR Scan     		BGY241 OT482B BGY241 127107/00/02/pp7 1337k PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline Leadless surface-mounted package; plastic cap; 4 terminations e b 4x e1 e d b1 b2 b2 b3 SOT482B b3 1 2 3 L 4 L1 L2 D D1 c A 5 E1 E pin 1 index 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b b1 b2 b3 c D D1 d E E1 e e1


    Original     		OT482B PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A2 A 3 A1 pin 1 index A θ Lp L detail X 1 24 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		TSSOP48: OT480-1 MO-153 PDF

    BGA-292

    Abstract: BGA292 C BGA292 MS-034
    Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K


    Original     		BGA292: OT489-1 MS-034 BGA-292 BGA292 C BGA292 MS-034 PDF

    TSSOP48

    Abstract: SOT480-1
    Text: PDF: 2003 Apr 07 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 24 w M bp e 2.5


    Original     		TSSOP48: OT480-1 MO-153 TSSOP48 SOT480-1 PDF

    transistor D 1710

    Abstract: TRANSISTOR D 1785 BGY212A pn1999 BGY21
    Text: DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D373 BGY212A UHF amplifier module Preliminary specification 1999 Aug 23 Philips Semiconductors Preliminary specification UHF amplifier module BGY212A PINNING - SOT482C FEATURES • 3.5 V nominal supply voltage


    Original     		M3D373 BGY212A OT482C BGY212A OT482C cove825 budgetnum/printrun/ed/pp11 transistor D 1710 TRANSISTOR D 1785 pn1999 BGY21 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline TSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm SOT487-1 E D A X c y HE v M A Z 17 32 A2 A 3 A A1 pin 1 index θ Lp L 1 detail X 16 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		TSSOP32: OT487-1 MO-153 PDF

    LQFP144

    Abstract: MS-026 136E23
    Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 c y X A 73 72 108 109 ZE e E HE A A2 A 3 A1 θ wM Lp bp L pin 1 index detail X 37 144 1 36 v M A ZD wM bp e


    Original     		LQFP144: OT486-1 136E23 MS-026 LQFP144 MS-026 136E23 PDF

    sot480

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 24 w M bp e 2.5


    Original     		TSSOP48: OT480-1 OT480-1 MO-153 sot480 PDF

    MO-194

    Abstract: sot481
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 4.4 mm; lead pitch 0.4 mm SOT481-1 E D A X c y HE v M A Z 29 56 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 28 bp e w M 2.5


    Original     		TSSOP56: OT481-1 OT481-1 MO-194 sot481 PDF

    TSSOP32

    Abstract: TSSOP-32 sot487
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm SOT487-1 E D A X c y HE v M A Z 17 32 A2 A 3 A A1 pin 1 index θ Lp L 1 detail X 16 w M bp e 2.5 5 mm


    Original     		TSSOP32: OT487-1 OT487-1 MO-153 TSSOP32 TSSOP-32 sot487 PDF

    9.1 b3

    Abstract: sot482c
    Text: PDF: 1999 Aug 25 Philips Semiconductors Package outline Leadless surface mounted package; plastic cap; 4 terminations e b 4x e1 e d b1 b2 b2 b3 SOT482C b3 1 2 3 L 4 L1 L2 D D1 A c 5 E1 E pin 1 index 5 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		OT482C 9.1 b3 sot482c PDF

    MO-151

    Abstract: BGA292 transistor t 04 27 C BGA292
    Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K


    Original     		BGA292: OT489-1 MO-151 MO-151 BGA292 transistor t 04 27 C BGA292 PDF

    BGY241

    Abstract: pn1999
    Text: DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D373 BGY241 UHF amplifier module Product specification Supersedes data of 1999 May 01 1999 Sep 09 Philips Semiconductors Product specification UHF amplifier module BGY241 FEATURES PINNING - SOT482C • 3.5 V nominal supply voltage


    Original     		M3D373 BGY241 OT482C BGY241 125002/06/pp12 pn1999 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 c y X A 73 72 108 109 ZE e E HE A A2 A 3 A1 θ wM Lp bp L pin 1 index 144 detail X 37 1 36 v M A ZD wM bp e D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		LQFP144: OT486-1 136E23 MS-026 PDF

    TSSOP48

    Abstract: No abstract text available
    Text: PDF: 2000 Jan 05 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 24 w M bp e 2.5


    Original     		TSSOP48: OT480-1 MO-153 TSSOP48 PDF

    TSSOP32

    Abstract: TSSOP-32
    Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline TSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm SOT487-1 E D A X c y HE v M A Z 17 32 A2 A 3 A A1 pin 1 index θ Lp L 1 detail X 16 w M bp e 2.5 5 mm


    Original     		TSSOP32: OT487-1 MO-153 TSSOP32 TSSOP-32 PDF

    BGA292

    Abstract: sot489 C BGA292
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 D D1 ball A1 corner A2 A A1 E1 E detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P e N M L K J H G F E D C B A 2 1


    Original     		BGA292: OT489-1 BGA292 sot489 C BGA292 PDF

    BGA292

    Abstract: BGA-292
    Text: Philips Semiconductors Package outlines BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm 1998 May 06 1 SOT489-1


    Original     		BGA292: OT489-1 BGA292 BGA-292 PDF

    Untitled

    Abstract: No abstract text available
    Text: DISCRETE SEMICONDUCTORS BITÂ SIH]H T BGY241 UHF amplifier module P relim inary specification Philips Sem iconductors 1999 A p r 16 PHILIPS Philips Semiconductors Preliminary specification UHF amplifier module BGY241 FEATURES PINNING - SOT482B • 3.5 V nominal supply voltage


    OCR Scan     		BGY241 BGY241 OT482B SCA63 127107/00/02/pp11 PDF

    Untitled

    Abstract: No abstract text available
    Text: DISCRETE SEMICONDUCTORS BITÂ SIH]H T BGY241 UHF amplifier module P relim inary specification Philips Sem iconductors 1999 M ar 25 PHILIPS Philips Semiconductors Preliminary specification UHF amplifier module BGY241 FEATURES PINNING - SOT482B • 3.5 V nominal supply voltage


    OCR Scan     		BGY241 BGY241 OT482B SCA63 127107/00/02/pp11 PDF