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    SOT549-1 Search Results

    SOT549-1 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT549-1 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad Original PDF
    SOT549-1 NXP Semiconductors Footprint for reflow soldering SOT549-1 Original PDF