| SOT617-1 |
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NXP Semiconductors
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Footprint information for reflow soldering of HVQFN32 package |
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Original |
PDF
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| SOT617-1 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm |
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Original |
PDF
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| SOT617-11 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals |
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Original |
PDF
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| SOT617-1_115 |
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NXP Semiconductors
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HVQFN32; Reel pack; SMD, 7"; standard product orientationOrderable part number ending, 115 or XOrdering code (12NC) ending 115 |
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Original |
PDF
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| SOT617-1_118 |
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NXP Semiconductors
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HVQFN32; Standard product orientation 12NC ending 118 |
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Original |
PDF
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| SOT617-1_128 |
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NXP Semiconductors
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HVQFN24; Reel pack; SMD, 13", TurnedQ2/T3 Standard product orientationOrderable part number ending ,128 or HPOrdering code (12NC) ending 128 |
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Original |
PDF
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