Untitled
Abstract: No abstract text available
Text: SRAM AS8S128K32 128K x 32 SRAM GENERAL 21, 28, 39 are no connects PN 66 DESCRIPTION Lead PGA- Pins 8, SRAM MEMORY ARRAY The AS8S128K32 is a 4 Megabit CMOS SRAM Module organized as 128Kx32-bits and user configurable to 256Kx16 or 512Kx8. The AS8S128K32 achieves high speed access, low
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AS8S128K32
AS8S128K32
128Kx32-bits
256Kx16
512Kx8.
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68S16000
Abstract: AB-020
Text: 512K x 32 SRAM MODULE PUMA 68S16000/AB-020/025/35/45 Issue 5.0 : May 2001 • User Configurable as 8 / 16 / 32 bit wide output. • Operating Power : • Standby Power : CMOS • Single 5V±10% Power supply. 512K x 8 SRAM 512K x 8 SRAM 512K x 8 SRAM CS1
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68S16000/AB-020/025/35/45
220mW
68S16000
16Mbit
200pcs
183OC
225OC
219OC
AB-020
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3524CP
Abstract: 2MX40 RAM128KX8 DIP HM624256 HM62832 16Mbit FRAM Dram 168 pin EDO 8Mx8 hm62256 flash 32 Pin PLCC 16mbit HN27C1024
Text: Memory Shortform, May '97 Memory Products Fast Page Mode DRAM DRAM EDO DRAM Synchronous DRAM SRAM Low Power SRAM Fast SRAM Non Volatile EPROM & OTPROM Memories EEPROM FRAM Fast Page Mode DRAM Modules EDO DRAM Modules SDRAM Modules FLASH Memory FLASH FLASH CARDS
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HB56U132
HB56H132
HB56U232
HB56H232
HN62W454B
512kx8
256kx16
HN62W4416N
16Mbit
1Mx16
3524CP
2MX40
RAM128KX8 DIP
HM624256
HM62832
16Mbit FRAM
Dram 168 pin EDO 8Mx8
hm62256
flash 32 Pin PLCC 16mbit
HN27C1024
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs WED8L24513V Asynchronous SRAM, 3.3V, 512Kx24 FEATURES DESCRIPTION 512Kx24 bit CMOS Static Random Access Memory Array The WED8L24513VxxBC is a 3.3V, twelve megabit SRAM constructed with three 512Kx8 die mounted on a multi-layer
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512Kx24
512Kx24
MO-163)
14mmx22mm
WED8L24513V
WED8L24513VxxBC
512Kx8
WED8L24513V
DSP5630x
2106XL
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2048x2048
Abstract: No abstract text available
Text: HY62UF8400/ HY62QF8400/ HY62EF8400/ HY62SF8400 Series 512Kx8bit full CMOS SRAM PRELIMINARY DESCRIPTION FEATURES The HY62UF8400 / HY62QF8400 / HY62EF8400 / HY62SF8400 is a high speed and super low power 4Mbit full CMOS SRAM organized as 524,288 words by 8 bits. The HY62UF8400 /
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HY62UF8400/
HY62QF8400/
HY62EF8400/
HY62SF8400
512Kx8bit
HY62UF8400
HY62QF8400
HY62EF8400
2048x2048
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EDI88512
Abstract: No abstract text available
Text: EDI88512CA-XMXG WPS512K8X-XRJXG White Electronic Designs 512Kx8 Plastic Monolithic SRAM CMOS WEDC's ruggedized plastic 512Kx8 SRAM that allows the user to capitalize on the cost advantage of using a plastic component while not sacrificing all of the reliability
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512Kx8
EDI88512CA-XMXG
WPS512K8X-XRJXG
EDI88512
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smd code F18
Abstract: No abstract text available
Text: ACT–SF2816 High Speed 128Kx16 SRAM / 512Kx16 FLASH Multichip Module CIRCUIT TECHNOLOGY www.aeroflex.com FEATURES 2 – 128K x 8 SRAMs & 2 – 512K x 8 Flash Die in One MCM • Access Times of 25ns SRAM and 60ns (Flash) or 35ns (SRAM) and 70 or 90ns (Flash)
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SF2816
128Kx16
512Kx16
512KX8
MIL-PRF-38534
MIL-STD-883
SCD3853
smd code F18
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making A10
Abstract: No abstract text available
Text: L-51001-0E MITSUBISHI ELECTRIC Mitsubishi Fast SRAM Technical Direction Large Capacity 1M 4M Low Power Vcc 5V High Speed Fast SRAM Multi Bit x1, x4 x8 x16 0.25um CMOS Special Wide Temperature Version Fast SRAM 0.4um Super CMOS 3.3V Return to Contents L-51008-0D
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L-51001-0E
L-51008-0D
L-51010-0C
25ical,
making A10
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VDR 0047
Abstract: No abstract text available
Text: HY62U8400A Series 512Kx8bit CMOS SRAM Document Title 512K x8 bit 3.0V Low Power CMOS slow SRAM Revision History Revision No History Draft Date 04 Revision History Insert Revised - Insert 70ns Part - Improved standby current Isb1 : 30uA ¡ æ20uA Jul.26.2000
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HY62U8400A
512Kx8bit
15ns/20ns
HY62U8400A
100ns
VDR 0047
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BLF 272
Abstract: bq4842 bq4852Y BD-962
Text: bq4852Y RTC Module With 512Kx8 NVSRAM Features General Description ➤ Integrated SRAM, real-time clock, CPU supervisor, crystal, power-fail control circuit, and battery The bq4852Y RTC Module is a nonvolatile 4,194,304-bit SRAM organized as 524,288 words by 8 bits
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bq4852Y
512Kx8
304-bit
BLF 272
bq4842
BD-962
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Untitled
Abstract: No abstract text available
Text: Preliminary CMOS SRAM KM68V4000BZ, KM68U4000BZ Family Document Title 512Kx8 Low Voltage & Low Power SRAM Data Sheets for 48-CSP Revision History Rev. No. History Draft Data Remark Rev. 0.0 - 1′st edition - Package Dimension Finalized Feb. 4′th, 1997 Preliminary
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KM68V4000BZ,
KM68U4000BZ
512Kx8
48-CSP
55/Typ.
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VDR 0047
Abstract: No abstract text available
Text: HY62V8400A Series 512Kx8bit CMOS SRAM Document Title 512K x8 bit 3.3V Low Power CMOS slow SRAM Revision History Revision No History Draft Date 03 Revision History Insert Revised - Improved standby current Isb1 : 30uA ¡ æ20uA Jul.06.2000 Final 04 Revised
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HY62V8400A
512Kx8bit
HY62V8400A
VDR 0047
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MR2A08A
Abstract: MARK W1 TSOP zd 409 MR2A08AYS35 MR2A08AMA35 MR2A08
Text: MR2A08A FEATURES 512K x 8 MRAM Memory • Fast 35ns Read/Write Cycle • SRAM Compatible Timing, Uses Existing SRAM Controllers Without Redesign • Unlimited Read & Write Endurance • Data Always Non-volatile for >20-years at Temperature • One Memory Replaces Flash, SRAM, EEPROM and BBSRAM in
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MR2A08A
20-years
MR2A08A
304-bit
EST00170
MR2A08A,
MARK W1 TSOP
zd 409
MR2A08AYS35
MR2A08AMA35
MR2A08
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Untitled
Abstract: No abstract text available
Text: MR2A08A 512K x 8 MRAM Memory FEATURES • Fast 35ns Read/Write Cycle • SRAM Compatible Timing, Uses Existing SRAM Controllers Without Redesign • Unlimited Read & Write Endurance • Data Always Non-volatile for >20 years at Temperature • One Memory Replaces Flash, SRAM, EEPROM and BBSRAM in
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MR2A08A
AEC-Q100
MR2A08A
EST00170
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DPS512X8MKN3
Abstract: No abstract text available
Text: 512Kx8, 20 - 45ns, STACK/DIP 30A129-11 D 4 Megabit High Speed CMOS SRAM DPS512X8MKN3 PRELIMINARY DESCRIPTION: The DPS512X8MKN3 High Speed SRAM ‘’STACK’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable
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512Kx8,
30A129-11
DPS512X8MKN3
DPS512X8MKN3
600-mil-wide,
32-pin
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EDI88512
Abstract: No abstract text available
Text: EDI88512CA-XMXG WPS512K8X-XRJXG White Electronic Designs 512Kx8 Plastic Monolithic SRAM CMOS WEDC's ruggedized plastic 512Kx8 SRAM that allows the user to capitalize on the cost advantage of using a plastic component while not sacrificing all of the reliability
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512Kx8
EDI88512CA-XMXG
WPS512K8X-XRJXG
EDI88512
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MR2A08AMYS35
Abstract: AECQ-100 MR2A08AYS35 BGA 8 x 8 tray MR2A08A
Text: MR2A08A FEATURES 512K x 8 MRAM Memory • Fast 35ns Read/Write Cycle • SRAM Compatible Timing, Uses Existing SRAM Controllers Without Redesign • Unlimited Read & Write Endurance • Data Always Non-volatile for >20-years at Temperature • One Memory Replaces Flash, SRAM, EEPROM and BBSRAM in
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MR2A08A
20-years
AEC-Q100
MR2A08A
304-bit
1-877-347-MRAM
EST170
MR2A08AMYS35
AECQ-100
MR2A08AYS35
BGA 8 x 8 tray
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Untitled
Abstract: No abstract text available
Text: EDI88512CA-XMXG WPS512K8X-XRJXG 512Kx8 Plastic Monolithic SRAM CMOS FEATURES WEDC's ruggedized plastic 512Kx8 SRAM that allows the user to capitalize on the cost advantage of using a plastic component while not sacrificing all of the reliability available in a full military device.
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EDI88512CA-XMXG
WPS512K8X-XRJXG
512Kx8
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EPROM retention
Abstract: BLF 272 bq4842 bq4852Y BQ4852YMC-85
Text: bq4852Y RTC Module With 512Kx8 NVSRAM Features General Description ➤ Integrated SRAM, real-time clock, CPU supervisor, crystal, power-fail control circuit, and battery The bq4852Y RTC Module is a nonvolatile 4,194,304-bit SRAM organized as 524,288 words by 8 bits with
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bq4852Y
512Kx8
304-bit
10-year
EPROM retention
BLF 272
bq4842
BQ4852YMC-85
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AS5C4008DJ
Abstract: No abstract text available
Text: AS5C4008DJ 512Kx 8 SRAM AUSTIN SEMICONDUCTOR, INC. SRAM 512Kx8 SRAM ULTRA HIGH SPEED-PLASTIC SRAM REVOLUTIONARY PINOUT M IL IT A R Y TEMPERATURE OPERATING RANGE-55°C to +125°C PIN ASSIGNMENT Top View 36-Pin PSOJ FEATURES • Ultra High Speed, 83MHz Asynchronous Operation
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AS5C4008DJ
512Kx
RANGE-55
83MHz
DS000043
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Untitled
Abstract: No abstract text available
Text: A Ç l AUSTIN SEM ICONDUCTOR, INC. SRAM AS5C512K8 512KX8SRAM 512K X 8 SRAM HIGH SPEED SRAM with REVOLUTIONARY PINOUT AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View) 36-Pin SO J/LC C SMD 5962-95600 MIL-STD-883 FEATURES Ultra High Speed Asynchronous Operation
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AS5C512K8
512KX8SRAM
36-Pin
MIL-STD-883
Range-55Â
DS000043
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synchronous sram
Abstract: 4Kx1 DRAM SRAM 6T SRAM DRAM 64kx16 edi8832
Text: ^EDI_ Electronic DMlgrw Inc. ^ by Part Number _ _ _ Part No. Tvoe Density Ora EDH816H64C EDI2018QC EDI20181C EDI20182C EDI20183C EDI20184C EDI20185C EDI2040C EDI2041C EDI2042C SRAM Module Synchronous SRAM, Latched I/O, 1CLK Synchronous SRAM, Registered I/O, 1CLK
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EDH816H64C
EDI2018QC
EDI20181C
EDI20182C
EDI20183C
EDI20184C
EDI20185C
EDI2040C
EDI2041C
EDI2042C
synchronous sram
4Kx1 DRAM
SRAM 6T
SRAM
DRAM 64kx16
edi8832
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256Kx16bit
Abstract: 128KX16 HY628100B 512kx16bit SRAM SRAM 256kx16
Text: TABLE OF CONTENTS 1. TABLE OF CONTENTS Index 2. PRODUCT QUICK REFERENCE GUIDE Ordering Information 9 Quick Reference Guide 11 3. SRAM DATA SHEETS Low Power Dissipation SRAM 5.0V/3.3V/3.0V Operation 256K -b it SRAM GM76C256C 32Kx8-bit, 5.0V 19 GM76V256C 32Kx8-bit, 3.3V
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GM76C256C
GM76V256C
GM76U256C
GM76C256CW
HY62CT08081E
HY62WT08081E
HY62K
T08081E
32Kx8-bit,
256Kx16bit
128KX16
HY628100B
512kx16bit
SRAM
SRAM 256kx16
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Untitled
Abstract: No abstract text available
Text: BENCHMARQ_ bq4015/bq4015Y 512Kx8 Nonvolatile SRAM Features General Description >• Data retention in the absence of power >- Automatic write-protection during power-up/power-down cycles >• Industry-standard 32-pin 512K x 8 pinout >- Conventional SRAM operation;
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bq4015/bq4015Y
512Kx8
32-pin
bq4015
304-bit
bq4015
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