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    SSOP56 PACKAGE Search Results

    SSOP56 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    SSOP56 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    SSOP56

    Abstract: ssop-56 zif socket DIL48 28F160F3
    Text: DIL48/SSOP56 ZIF Flash-3 ord.no. 70-0120 special converter, assigned for Flash EPROMs in SSOP56 package (with Intel 28F160F3's pinout) operation (mechanical) life of ZIF socket - 10.000 actuations made in Slovakia Ord. no 70-0120 Socket ZIF SSOP56, ClamShell type


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    DIL48/SSOP56 SSOP56 28F160F3 SSOP56, 600mil SSOP56 ssop-56 zif socket DIL48 PDF

    SSOP56

    Abstract: adapter ssop56 adaptor ssop56 RE931-07 SSOP5 ssop-56
    Text: SSOP56 Adapter shrink small outline package RE931-07 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.635 (300 mil) - pins: 56 - hole dia 1.00 mm - size 37.5 x 29.5 mm


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    SSOP56 RE931-07 adapter ssop56 adaptor ssop56 RE931-07 SSOP5 ssop-56 PDF

    SSOP56

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm SOT371-1 D E A X c y HE v M A Z 29 56 Q A2 A1 A A 3 θ pin 1 index Lp L 28 1 bp e detail X w M 5 10 mm scale DIMENSIONS (mm are the original dimensions)


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    SSOP56: OT371-1 MO-118 SSOP56 PDF

    sot371

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm SOT371-1 D E A X c y HE v M A Z 29 56 Q A2 A1 A A 3 θ pin 1 index Lp L 28 1 bp e detail X w M 5 10 mm scale DIMENSIONS (mm are the original dimensions)


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    SSOP56: OT371-1 OT371-1 MO-118AB sot371 PDF

    SSOP56

    Abstract: jedec mo-118
    Text: PDF: 2000 Jan 05 Philips Semiconductors Package outline SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm SOT371-1 D E A X c y HE v M A Z 29 56 Q A2 A1 A A 3 θ pin 1 index Lp L 28 1 bp e detail X w M 5 10 mm scale DIMENSIONS (mm are the original dimensions)


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    SSOP56: OT371-1 MO-118 SSOP56 jedec mo-118 PDF

    TN80C196KC20

    Abstract: TE28F800B3TA120 N80C51FA1 TN80C196KB16 N80C31BH1 TE28F008B3T115 N80C196KC20 DT28F320S5-90 TE28F160F3T120 N80C3224
    Text: Product Change Notification Please respond to your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth in this attached PCN.


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    PLCC44 PLCC68 TN80C196KC20 TE28F800B3TA120 N80C51FA1 TN80C196KB16 N80C31BH1 TE28F008B3T115 N80C196KC20 DT28F320S5-90 TE28F160F3T120 N80C3224 PDF

    H9606

    Abstract: p9606 S 1854 L9545 1005 Ic Data 7217 74FCT161T L9606 data sheet IC 7217 Hyundai Semiconductor
    Text: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS JULY 1996 IDT QUALITY SERVICE QSP PERFORMANCE 2975 Stender Way, Santa Clara, CA 95054 TEL: 800 345-7015 FAX: (408) 492-8674 IDT QUALITY & RELIABILITY MONITOR REPORT July 1996 TABLE OF CONTENTS


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    74FCT162500T N9601 SSOP-56 74FCT162543T 74FCT163244 N9446 TSSOP-48 74FCT162244T H9606 p9606 S 1854 L9545 1005 Ic Data 7217 74FCT161T L9606 data sheet IC 7217 Hyundai Semiconductor PDF

    Z952

    Abstract: 1005 Ic Data MQUAD S 1854 JEDEC-STD-22 N9532 datasheet and application 7217 74FCT162244T 74FCT162543 A102
    Text: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS JULY 1996 IDT QUALITY SERVICE QSP PERFORMANCE 2975 Stender Way, Santa Clara, CA 95054 TEL: 800 345-7015 FAX: (408) 492-8674 IDT QUALITY & RELIABILITY MONITOR REPORT July 1996 TABLE OF CONTENTS


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    TecR3812 500cycle 1000cycle PLCC-84 79R4700 Y9619 MQUAD-208 79R3041 X9607 Z952 1005 Ic Data MQUAD S 1854 JEDEC-STD-22 N9532 datasheet and application 7217 74FCT162244T 74FCT162543 A102 PDF

    H9549

    Abstract: 74FCT273 74FCT374 A101 A102 A104 A106 A110 SSOP-56 H9607
    Text: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS January 1997 IDT QUALITY SERVICE QSP PERFORMANCE 2975 Stender Way, Santa Clara, CA 95054 TEL: 800 345-7015 FAX: (408) 492-8674 IDT QUALITY & RELIABILITY MONITOR REPORT January 1997 TABLE OF CONTENTS


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    DSOP-20 SSOP-20 SSOP-56 TSSOP-48 H9549 74FCT273 74FCT374 A101 A102 A104 A106 A110 SSOP-56 H9607 PDF

    v9452

    Abstract: p9506 N9514 74FCT163373 v945 54fct821 k952 Y9511 L9530 wh9513
    Text: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS January 1996 IDT QUALITY SERVICE QSP PERFORMANCE 3001 Stender Way, Santa Clara, CA 95054 TEL: 408 727-6116 FAX: (408) 492-8362 IDT QUALITY & RELIABILITY MONITOR REPORT January 1996 TABLE OF CONTENTS


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    PDIP-20 74FCT821 PDIP-24 YH9532 Z9530 PLCC68 74FCT805T P9534 QSOP-20 74FCT540 v9452 p9506 N9514 74FCT163373 v945 54fct821 k952 Y9511 L9530 wh9513 PDF

    soj16 package

    Abstract: adaptor ssop56 dip48 W9518 W9512 W9514 SOJ-20 W9524 soj16 soj18 package TSOP14 package
    Text: WINSLOW ADAPTICs - SOIC or SOJ Solder Pads to DIP Adapters SOIC or SOJ Solder Pads to DIP ADAPTICs how to order shipping costs terms & conditions These ADAPTICs have an array of SOP solder pads on the top and male pins on the underside to mate with a DIP socket or solder into a


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    W12109 W9594 W9501 DIP08, W9583 TSSOP10, DIP10, SSOP48, DIP48, W9570 soj16 package adaptor ssop56 dip48 W9518 W9512 W9514 SOJ-20 W9524 soj16 soj18 package TSOP14 package PDF

    H9549

    Abstract: X9642 h954 A101 A102 A104 A106 A110 SBGA-272 h9610
    Text: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS January 1997 IDT QUALITY SERVICE QSP PERFORMANCE 2975 Stender Way, Santa Clara, CA 95054 TEL: 800 345-7015 FAX: (408) 492-8674 IDT QUALITY & RELIABILITY MONITOR REPORT January 1997 TABLE OF CONTENTS


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    VII-15 H9549 X9642 h954 A101 A102 A104 A106 A110 SBGA-272 h9610 PDF

    data sheet IC 7217

    Abstract: 7217 IC malaysia IC MQUAD report on PLCC S 1854 transistor 9529 931 9535 9529 datasheet and application 7217
    Text: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS JULY 1996 IDT QUALITY SERVICE QSP PERFORMANCE 2975 Stender Way, Santa Clara, CA 95054 TEL: 800 345-7015 FAX: (408) 492-8674 IDT QUALITY & RELIABILITY MONITOR REPORT July 1996 TABLE OF CONTENTS


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    TecV256C SOJ-28 11V256C 11V256B 71024U SOJ-32 data sheet IC 7217 7217 IC malaysia IC MQUAD report on PLCC S 1854 transistor 9529 931 9535 9529 datasheet and application 7217 PDF

    H9549

    Abstract: h9627 h9540 K9549 H9607 idt 74fct244 die h9610 A101 A102 A106
    Text: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS July 1997 IDT QUALITY SERVICE QSP PERFORMANCE 2975 Stender Way, Santa Clara, CA 95054 TEL: 800 345-7015 FAX: (408) 492-8674 IDT QUALITY & RELIABILITY MONITOR REPORT July 1997 TABLE OF CONTENTS


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    TechnOP-20 SSOP-20 SSOP-56 TSSOP-48 SOIC-20 H9549 h9627 h9540 K9549 H9607 idt 74fct244 die h9610 A101 A102 A106 PDF

    power supply ic 9435

    Abstract: 9435 72 datasheet and application 7217 malaysia IC report on PLCC v9452 100A484 a106 diode MQUAD PDIP-48
    Text: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS January 1996 IDT QUALITY SERVICE QSP PERFORMANCE 3001 Stender Way, Santa Clara, CA 95054 TEL: 408 727-6116 FAX: (408) 492-8362 IDT QUALITY & RELIABILITY MONITOR REPORT January 1996 TABLE OF CONTENTS


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    SOJ-28 11256L 11V256C 71028T 71024T SOJ-32 power supply ic 9435 9435 72 datasheet and application 7217 malaysia IC report on PLCC v9452 100A484 a106 diode MQUAD PDIP-48 PDF

    EN4900GC

    Abstract: JESD22-A103 CEL9220HF JESD22-A113 CRM1076 Compound CEL9220HF cel-9220HF cel9220 JESD-22-A113 JESD22-A102
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1007-02 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 2-Aug-2010 MEANS OF DISTINGUISHING CHANGED DEVICES:


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    A1007-02 2-Aug-2010 SSOP-28) 2-Nov-2010 JESD22-A113 LDS6000PYGI LDS6000PYGI8 LDS6003PYGI LDS6003PYGI8 EN4900GC JESD22-A103 CEL9220HF CRM1076 Compound CEL9220HF cel-9220HF cel9220 JESD-22-A113 JESD22-A102 PDF

    bt165

    Abstract: diode SMD MARKING CODE dl
    Text: INTEGRATED CIRCUITS 74ABT16500C 74ABTH16500C 18-bit universal bus transceiver 3-State Product specification Supersedes data of 1997 Jun 12 IC23 Data Handbook Philips Semiconductors 1998 Feb 27 Philips Semiconductors Product specification 18-bit universal bus transceiver (3-State)


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    74ABT16500C 74ABTH16500C 18-bit 74ABTH16500C 64mA/-32mA 500mA bt165 diode SMD MARKING CODE dl PDF

    land pattern ssop28

    Abstract: SO18W IPC-SM-782 SSOP-20 land pattern so18w SSOP20 LAND PATTERN
    Text: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder


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    PDF

    diode SMD MARKING CODE dl

    Abstract: 1a6 SMD diode BT166
    Text: INTEGRATED CIRCUITS 74ABT16646 74ABTH16646 16-bit bus transceiver/register 3-State Product specification Supersedes data of 1995 Aug 17 IC23 Data Handbook Philips Semiconductors 1998 Feb 27 Philips Semiconductors Product specification 74ABT16646 74ABTH16646


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    74ABT16646 74ABTH16646 16-bit 74ABTH16646 500mA 01-Mar-98) diode SMD MARKING CODE dl 1a6 SMD diode BT166 PDF

    land pattern ssop28

    Abstract: land pattern for SSOP16 SBFA015A SSOP20 LAND PATTERN land pattern so18w SO18 TI smd sot 23/5 IPC-SM-782 so24w land pattern for SSOP56
    Text: Application Report SBFA015A - January 1998 - Revised May 2003 SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Cost and performance requirements continue to push the packaging of electronic systems into smaller and smaller spaces. At one time, the standard center-to-center pin spacing was 100 mils 0.1" on through-hole parts (DIPs).


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    SBFA015A land pattern ssop28 land pattern for SSOP16 SSOP20 LAND PATTERN land pattern so18w SO18 TI smd sot 23/5 IPC-SM-782 so24w land pattern for SSOP56 PDF

    12B2 Diode

    Abstract: JESD22-A114E HBM 10A1 10B1 CBT16212 CBT16212DGG CBT16212DL JESD22-A114E JESD78 SSOP56
    Text: CBT16212 24-bit bus exchange switch with 12-bit output enables Rev. 02 — 3 November 2008 Product data sheet 1. General description The CBT16212 provides 24 bits of high-speed TTL-compatible bus switching or exchanging. The low ON resistance of the switch allows connections to be made with


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    CBT16212 24-bit 12-bit CBT16212 JESD22-A114E JESD22-C101C 12B2 Diode JESD22-A114E HBM 10A1 10B1 CBT16212DGG CBT16212DL JESD78 SSOP56 PDF

    Untitled

    Abstract: No abstract text available
    Text: CBT16212 24-bit bus exchange switch with 12-bit output enables Rev. 02 — 3 November 2008 Product data sheet 1. General description The CBT16212 provides 24 bits of high-speed TTL-compatible bus switching or exchanging. The low ON resistance of the switch allows connections to be made with


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    CBT16212 24-bit 12-bit CBT16212 JESD22-A114E JESD22ons PDF

    land pattern ssop28

    Abstract: SO18W SSOP20 LAND PATTERN so24w SO20w package 11-365 land pattern for SSOP smd sot 23/5 IPC-SM-782 SSOP-20
    Text: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: INTEGRATED CIRCUITS 74ABT16899 74ABTH16899 18-bit latched transceiver with 16-bit parity generator/checker 3-State Product specification Supersedes data of 1997 Mar 28 IC23 Data Handbook Philips Semiconductors 1998 Feb 25 Philips Semiconductors Product specification


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    74ABT16899 74ABTH16899 18-bit 16-bit 74ABTH16899 74ABT/H16899 01-Mar-98) PDF