Untitled
Abstract: No abstract text available
Text: PLASTIC SILICON PHOTODARLINGTON OPTOELECTRONICS QSD733 PACKAGE DIMENSIONS DESCRIPTION The QSD733 is a silicon photodarlington encapsulated in an infrared transparent, black TO-18 package. U - .190 4.83 ^1 .178(4.62) V .235 (5.97) .218(5.54) T 0.030(0.76) NOM
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QSD733
QSD733
QED523
ST2147
100il
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Untitled
Abstract: No abstract text available
Text: EQ PLASTIC SILICON PHOTODARLINGTON OPTOELECTRONICS QSD733 PACKAGE DIMENSIONS DESCRIPTION The Q S D 733 is a silicon photodarlington encapsulated in an infrared transparent, black TO -18 package. FEATURES Steel lead fram es for im proved reliability in solder
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QSD733
QSD733
ST2147
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QED523
Abstract: QSD733
Text: r A\ j L£ll PLASTIC SILICON PHOTODARLINGTON OPTOELECTRONICS QSD733 PACKAGE DIMENSIONS DESCRIPTION The QSD733 is a silicon photodarlington encapsulated in an infrared transparent, black TO-18 package. FEATURES • Steel lead frames for improved reliability in solder
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QSD733
QSD733
QED523
100ft
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Untitled
Abstract: No abstract text available
Text: [sö PLASTIC SILICON PHOTODARLINGTON OPTOELECTRONICS QSD733 Th e Q S D 733 is a silicon photodarlington en capsulated in an infrared transparent, black T O -18 package. R E FER ENC E SURFACE FEA TU RES V .235 5.97 .218(5.54) OR A N G E STR IPE Steel lead fram es for im proved reliability in solder
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QSD733
ST2147
74bhflSl
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