NAND FLASH BGA
Abstract: BGA NAND Flash BGA PACKAGE thermal profile BGA-56P-M01 MCP NAND FBGA56 FBGA69 32M X 32 MEMORY FLASH BGA FBGA71
Text: Stacked MCP Stacked Multi-Chip Package Stacked MCP is one of the most suitable chip scale packages for wireless applications. Its advantage is the compact stacked chip configuration. In the Flash memory and SRAM configuration, the pin layout can accomodate a 128 MB combination.Typical package construction
|
Original
|
FBGA69)
IR250
NAND FLASH BGA
BGA NAND Flash
BGA PACKAGE thermal profile
BGA-56P-M01
MCP NAND
FBGA56
FBGA69
32M X 32 MEMORY
FLASH BGA
FBGA71
|
PDF
|
lqfp 64 Shipping Trays
Abstract: DS310H
Text: LEADFRAME data sheet Multi-Chip & Stacked-Die Leadframe Packages Features: Multi-Chip Package MCP & Stacked-Die Leadframe Package Amkor's multi-chip package and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor. Leveraging
|
Original
|
|
PDF
|
internal block diagram of mobile phone
Abstract: 64M-BIT mobile phone circuit diagram stacked MCP 32M-BIT 32-Mbit
Text: 2 chip Stacked MCP 9mmx9mm Series New products A Combination of Flash Memory and Mobile FCRAM /SRAM− 2 chip Stacked MCP 9mm×9mm Series TM This double chip stacked MCP with two different configurations is stored in a common 9mm×9mm package. Compared to our existing MCPs with similar
|
Original
|
64M-bit
internal block diagram of mobile phone
mobile phone circuit diagram
stacked MCP
32M-BIT
32-Mbit
|
PDF
|
Untitled
Abstract: No abstract text available
Text: MITSUBISHI LSIs M6MGB/T162S4BVP 16,777,216-BIT 1,048,576 -WORD BY 16-BIT CMOS 3.3V-ONLY FLASH MEMORY & 4,194,304-BIT (524,288-WORD BY 8-BIT) CMOS SRAM Stacked-MCP (Multi Chip Package) DESCRIPTION FEATURES The MITSUBISHI M6MGB/T162S4BVP is a Stacked Multi
|
Original
|
M6MGB/T162S4BVP
216-BIT
16-BIT
304-BIT
288-WORD
M6MGB/T162S4BVP
16M-bits
48-pin
|
PDF
|
Untitled
Abstract: No abstract text available
Text: MITSUBISHI LSIs M6MGB/T162S2BVP 16,777,216-BIT 1,048,576 -WORD BY 16-BIT CMOS 3.3V-ONLY FLASH MEMORY & 2,097,152-BIT (262,144-WORD BY 8-BIT) CMOS SRAM Stacked-MCP (Multi Chip Package) DESCRIPTION FEATURES • Access time The MITSUBISHI M6MGB/T162S2BVP is a Stacked Multi
|
Original
|
M6MGB/T162S2BVP
216-BIT
16-BIT
152-BIT
144-WORD
M6MGB/T162S2BVP
16M-bits
48-pin
|
PDF
|
90000H-97FFFH
Abstract: No abstract text available
Text: MITSUBISHI LSIs M6MGB/T162S4BVP 16,777,216-BIT 1,048,576 -WORD BY 16-BIT CMOS 3.3V-ONLY FLASH MEMORY & 4,194,304-BIT (524,288-WORD BY 8-BIT) CMOS SRAM Stacked-MCP (Multi Chip Package) DESCRIPTION FEATURES The MITSUBISHI M6MGB/T162S4BVP is a Stacked Multi
|
Original
|
M6MGB/T162S4BVP
216-BIT
16-BIT
304-BIT
288-WORD
16M-bits
48-pin
90000H-97FFFH
|
PDF
|
Untitled
Abstract: No abstract text available
Text: MITSUBISHI LSIs M6MGB/T162S2BVP 16,777,216-BIT 1,048,576 -WORD BY 16-BIT CMOS 3.3V-ONLY FLASH MEMORY & 2,097,152-BIT (262,144-WORD BY 8-BIT) CMOS SRAM Stacked-MCP (Multi Chip Package) DESCRIPTION FEATURES • Access time The MITSUBISHI M6MGB/T162S2BVP is a Stacked Multi
|
Original
|
M6MGB/T162S2BVP
216-BIT
16-BIT
152-BIT
144-WORD
16M-bits
48-pin
|
PDF
|
S29WS256N
Abstract: S71WS512NE0BFWZZ
Text: S71WS512NE0BFWZZ Stacked Multi-Chip Product MCP Flash Memory and pSRAM CMOS 1.8 Volt, Simultaneous Operation, Burst Mode Flash Memory and Pseudo-Static RAM ADVANCE INFORMATION DISTINCTIVE CHARACTERISTICS GENERAL DESCRIPTION MCP Features The S71WS512 Series is a product line of stacked Multi-Chip
|
Original
|
S71WS512NE0BFWZZ
S71WS512
S29WS256N
54MHz
128Mb
96-ball
S71WS512NE0BFWZZ
S29WS256N
|
PDF
|
Untitled
Abstract: No abstract text available
Text: New products MB84VZ064A Stacked MCP Mounted with Two 64M-bit NOR-type Flash Memories, a 32M-bit Mobile FCRAMTM, and an 8M-bit SRAM MB84VZ064A A quadruple-stacked MCP with the world's largest memory density, mounted with two 64M-bit NOR-type flash memories,
|
Original
|
MB84VZ064A
64M-bit
32M-bit
MB84VZ064A,
40REF
80REF
|
PDF
|
A82DL3234UG-70IF
Abstract: No abstract text available
Text: A82DL32x4T U Series Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) Static RAM Document Title Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit
|
Original
|
A82DL32x4T
Bit/2Mx16
256Kx16
69-ball
MO-219
A82DL3234UG-70IF
|
PDF
|
Untitled
Abstract: No abstract text available
Text: A82DL16x4T U Series Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) Static RAM Preliminary Document Title Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit
|
Original
|
A82DL16x4T
Bit/1Mx16
256Kx16
MO-219
|
PDF
|
Untitled
Abstract: No abstract text available
Text: A82DL16x2T U Series Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash Memory and 2M (128Kx16 Bit) Static RAM Preliminary Document Title Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit
|
Original
|
A82DL16x2T
Bit/1Mx16
128Kx16
|
PDF
|
A29L800 Series
Abstract: No abstract text available
Text: A82DL32x16T U Series Stacked Multi-Chip Package (MCP) Flash Memory and SUPER RAM, A82DL32x16T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16M (1Mx16 Bit) SUPER RAM Preliminary Document Title Stacked Multi-Chip Package (MCP) Flash Memory and SUPER RAM, A82DL32x16T(U) 32
|
Original
|
A82DL32x16T
Bit/2Mx16
1Mx16
MO-219
A29L800 Series
|
PDF
|
Untitled
Abstract: No abstract text available
Text: A82DL16x4T U Series Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) Static RAM Preliminary Document Title Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit
|
Original
|
A82DL16x4T
Bit/1Mx16
256Kx16
MO-219
|
PDF
|
|
|
Untitled
Abstract: No abstract text available
Text: A82DL16x4T U Series Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) Static RAM Preliminary Document Title Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit
|
Original
|
A82DL16x4T
Bit/1Mx16
256Kx16
|
PDF
|
A82DL1632TG-70UF
Abstract: DL1632
Text: A82DL16x2T U Series Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 2M (128Kx16 Bit) Static RAM Preliminary Document Title Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit
|
Original
|
A82DL16x2T
Bit/1Mx16
128Kx16
MO-219
A82DL1632TG-70UF
DL1632
|
PDF
|
Untitled
Abstract: No abstract text available
Text: A82DL32x8T U Series Stacked Multi-Chip Package (MCP) Flash Memory and SUPER RAM, A82DL32x8T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 8M 512Kx16 Bit) SUPER RAM Preliminary Document Title Stacked Multi-Chip Package (MCP) Flash Memory and SUPER RAM, A82DL32x8T(U) 32
|
Original
|
A82DL32x8T
Bit/2Mx16
512Kx16
MO-219
|
PDF
|
Untitled
Abstract: No abstract text available
Text: A82DL32x8T U Series Stacked Multi-Chip Package (MCP) Flash Memory and SUPER RAM, A82DL32x8T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 8M 512Kx16 Bit) SUPER RAM Preliminary Document Title Stacked Multi-Chip Package (MCP) Flash Memory and SUPER RAM, A82DL32x8T(U) 32
|
Original
|
A82DL32x8T
Bit/2Mx16
512Kx16
MO-219
|
PDF
|
Untitled
Abstract: No abstract text available
Text: A82DL16x2T U Series Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 2M (128Kx16 Bit) Static RAM Preliminary Document Title Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit
|
Original
|
A82DL16x2T
Bit/1Mx16
128Kx16
MO-219
|
PDF
|
Untitled
Abstract: No abstract text available
Text: A82DL16x2T U Series Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash Memory and 2M (128Kx16 Bit) Static RAM Preliminary Document Title Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit
|
Original
|
A82DL16x2T
Bit/1Mx16
128Kx16
MO-219
|
PDF
|
free mobile phone circuit diagram
Abstract: mobile circuit diagram M6MGD137W34DWG MCE Semiconductor Mobile Phone Repeater repeater mobile circuit
Text: Renesas LSIs RENESAS CONFIDENTIAL M6MGD137W34DWG 134,217,728-BIT 8,388,608-WORD BY 16-BIT CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM Stacked-CSP ( Chip Scale Package) Description The M6MGD137W34DWG is a Stacked Chip Scale Package
|
Original
|
M6MGD137W34DWG
728-BIT
608-WORD
16-BIT)
432-BIT
152-WORD
M6MGD137W34DWG
128M-bit
32M-bit
free mobile phone circuit diagram
mobile circuit diagram
MCE Semiconductor
Mobile Phone Repeater
repeater mobile circuit
|
PDF
|
Untitled
Abstract: No abstract text available
Text: A82DL32x4T U Series Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) Static RAM Preliminary Document Title Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit
|
Original
|
A82DL32x4T
Bit/2Mx16
256Kx16
|
PDF
|
idq10
Abstract: No abstract text available
Text: MITSUBISHI LSIs M6MGB/T162S4BVP 16,777,216-BIT 1,048,576 -WORD BY 16-BIT CMOS 3.3V-ONLY FLASH MEMORY & 4,194,304-BIT (524,288-WORD BY 8-BIT) CMOS SRAM Stacked-MCP (Multi Chip Package) DESCRIPTION FEATURES The MITSUBISHI M6MGB/T162S4BVP is a Stacked Multi
|
OCR Scan
|
M6MGB/T162S4BVP
216-BIT
16-BIT
304-BIT
288-WORD
M6MGB/T162S4BVP
16M-bits
48-pin
262144words
idq10
|
PDF
|
a12z
Abstract: BLH load cell
Text: MITSUBISHI LSIs M6MGB/T162S2BVP 16,777,216-BIT 1,048,576 -WORD BY 16-BIT CMOS 3.3V-ONLY FLASH MEMORY & 2,097,152-BIT (262,144-WORD BY 8-BIT) CMOS SRAM Stacked-MCP (Multi Chip Package) DESCRIPTION FEATURES The MITSUBISHI M6MGB/T162S2BVP is a Stacked Multi
|
OCR Scan
|
M6MGB/T162S2BVP
216-BIT
16-BIT)
152-BIT
144-WORD
M6MGB/T162S2BVP
16M-bits
48-pin
262144bytes
a12z
BLH load cell
|
PDF
|
