Untitled
Abstract: No abstract text available
Text: DCS/PCN-1134 PRODUCT CHANGE NOTICE Initial Final Contact Date: Implementation Date: Alert Category: Alert Type: PCN #: April 30, 2009 May 30, 2009 Material Change Mold compound/die attach change PCN #: 1134 TITLE Conversion of Sumitomo mold compound EME-6300H being discontinued by manufacturer to Sumitomo equivalent mold
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DCS/PCN-1134
EME-6300H
EME6600CSP
84-1LMISR4.
EME-6300CSP
EME-63000H.
EME-6600CSP
EME-6300H.
ad33K5L-13
AP1506-33K5L-U
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PCN0702
Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line
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PCN0702
PCN0702,
6300HJ
G700M
PCN0702
MP8000CH4
48hrs)
X10-5
UL-94
SUMITOMO G700
SUMITOMO G600
SUMITOMO EME G700
sumitomo 6300h mold compound
SUMITOMO EME G600
EME G600
material properties G600 mold compound
sumitomo G700 Tg
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Ablestik 84-1
Abstract: Ablestik Ablestik LMISR4 SUMITOMO g600 Ablestik 84-1 lmis-r4 LMISR4 G600 mold compound G600 mold compound unisem 6300h sumitomo 6300h mold compound
Text: October 26, 2009 CN-102609 Customer Notification M02045-2Y04-T and M02045G-2Y04-T Second Assembly Site Dear Valued Customer: This notification is for the purpose of informing you of a second assembly site for the M02045-2Y04-T and M02045G-2Y04-T, 16 pin SOIC package.
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CN-102609
M02045-2Y04-T
M02045G-2Y04-T
M02045G-2Y04-T,
Ablestik 84-1
Ablestik
Ablestik LMISR4
SUMITOMO g600
Ablestik 84-1 lmis-r4
LMISR4
G600 mold compound
G600 mold compound unisem
6300h
sumitomo 6300h mold compound
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mold compound
Abstract: DS5000 Compound
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: June 25, 1996 Subject: PRODUCT CHANGE NOTICE – E62801 Description: 80 Pin QFP Mold Compound Change Description of Change: The mold compound being used by one of our assembly subcontractors (Anam, Korea) is being
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E62801
6300HS
DS5000
DS5001
DS5002
mold compound
DS5000
Compound
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LMISR4
Abstract: J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
Text: 01/12/05 RELIABILITY REPORT FOR DS1685, Rev B2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : don.lipps@dalsemi.com
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DS1685,
LMISR4
J-STD20A
J-STD-20A
ablebond
copper bond wire
copper bond wire amkor
ti 9841
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J-STD-020
Abstract: S0309
Text: 08/02/2004 RELIABILITY REPORT FOR DS1267, Rev A2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1267,
J-STD-020
S0309
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Untitled
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS80C310, D2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS80C310,
JESD78,
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eftec
Abstract: Eftec 64t MLX90222 6300H eme 6300h
Text: • ■ ■ ■ ■ Chopper Stabilized Amplifier Stage New Miniature Package/Thin, High Reliability Package CMOS for Optimum Stability, Quality and Cost Low Power Consumption
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MLX90222
-40oC
MLX90222
6300H
254mm
04/Mar/99
eftec
Eftec 64t
6300H
eme 6300h
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MLX90222
Abstract: eme 6300h Temperature controller schematic
Text: MLX90222 Low Power Switch with Sleep Controller Features and Benefits Chopper Stabilized Amplifier Stage New Miniature Package/Thin, High Reliability Package CMOS for Optimum Stability, Quality and Cost Low Power Consumption On Chip Duty Cycle Controller Applications
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MLX90222
MLX90222
-40oC
6300H
254mm
04/Apr/01
eme 6300h
Temperature controller schematic
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9721
Abstract: ABLEBONd 84-1 JEDEC hast
Text: 03/24/2003 RELIABILITY REPORT FOR DS1005, Rev A2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1005,
reliabilit0037
9721
ABLEBONd 84-1
JEDEC hast
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CDA194
Abstract: 9731
Text: 02/25/2003 RELIABILITY REPORT FOR DS2404 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS2404
MIL-STD-883-2009
J-STD-020
CDA194
9731
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Untitled
Abstract: No abstract text available
Text: 0/;<3555# /RZ#3RZHU#6ZLWFK#ZLWK#6OHHS#&RQWUROOHU# HDWXUHV#DQG#%HQHILWV# # \ U D LQ LO P H U 3 Chopper Stabilized Amplifier Stage New Miniature Package/Thin, High Reliability Package CMOS for Optimum Stability, Quality and Cost Low Power Consumption On Chip Duty Cycle Controller
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MLX90222
-40oC
6300H
MLX90222
03/Oct/00
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Tamac4
Abstract: TAMAC-4 sumitomo epoxy 6300h tamac 4 2A VOLTAGE REGULATOR TO-220 6300H
Text: SS8046 3.3V 2A Low-Dropout Regulator with Disable Features General Description Dropout-voltage 0.5V @ I O = 2A Output current in excess of 2A Output voltage accuracy ±2.5% Quiescent current typically 5mA Internal short-circuit current limit Internal over-temperature protection
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SS8046
O-220
SS8046
Tamac4
TAMAC-4
sumitomo epoxy 6300h
tamac 4
2A VOLTAGE REGULATOR TO-220
6300H
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MLX90222
Abstract: No abstract text available
Text: 0/;<3555# /RZ#3RZHU#6ZLWFK#ZLWK#6OHHS#&RQWUROOHU# HDWXUHV#DQG#%HQHILWV# # \ U D LQ LO P H U 3 Chopper Stabilized Amplifier Stage New Miniature Package/Thin, High Reliability Package CMOS for Optimum Stability, Quality and Cost Low Power Consumption On Chip Duty Cycle Controller
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MLX90222
MLX90222
-40oC
6300H
254mm
14/Apr/00
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US1881
Abstract: UGN-3075
Text: US1881 CMOS Multi-Purpose Latch Features and Benefits## n n n n n Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 3.5V CMOS for optimum stability, quality and cost
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US1881
US1881
MLX1881
-20oC
-40oC
UGN-3075
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Eftec
Abstract: Eftec ra 310 SUMITOMO EME G
Text: MLX90223 Two Wire Switch# Features and Benefits • ■ ■ ■ # \ U D LQ LO P H U 3 Two wire operation CMOS for optimum stability, quality and cost New miniature package / thin, high reliability package Operation down to 3.5V Applications ■ ■ ■ Automotive reed switch replacement
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MLX90223
MLX90223ESO
MLX90223EUA
6300H.
OT-23
MLX90223
16/Decv/99
Eftec
Eftec ra 310
SUMITOMO EME G
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u28 sensor hall
Abstract: u28 hall UGN3132 UGN3132/33
Text: US2881/2882 CMOS High Sensitivity Latch Features and Benefits n n n n n n n Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 3.5V CMOS for optimum stability, quality, and cost
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US2881/2882
US2881
US2882
u28 sensor hall
u28 hall
UGN3132
UGN3132/33
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u28 sensor hall
Abstract: u28 hall UGN3132 hall u28 u28 127 hall US2881UA 22323 US2881SO u28 hall SENSOR sot transistor pinout
Text: US2881/2882 CMOS High Sensitivity Latch Features and Benefits • ■ ■ ■ ■ ■ ■ Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 3.5V CMOS for optimum stability, quality, and cost
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US2881/2882
US2881
US2882
u28 sensor hall
u28 hall
UGN3132
hall u28
u28 127 hall
US2881UA
22323
US2881SO
u28 hall SENSOR
sot transistor pinout
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ic 9022
Abstract: MLX90223ESO
Text: MLX90223 Two Wire Switch# Features and Benefits # \ U D LQ LO P H U 3 Two wire operation CMOS for optimum stability, quality and cost New miniature package / thin, high reliability package Operation down to 3.5V Applications Automotive reed switch replacement
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MLX90223
MLX90223ESO
MLX90223EUA
6300H.
OT-23
MLX90223
03/Oct/00
ic 9022
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marking 23ab
Abstract: eftec 6300H marking Z1 sot mlx 220 eme sot23
Text: 0/;<3556# 7ZR#:LUH#6ZLWFK# HDWXUHV#DQG#%HQHILWV# • ■ ■ ■ # \ U D LQ LO P H U 3 Two Wire operation CMOS for Optimum Stability, Quality and Cost New Miniature Package/Thin, High Reliability Package# Operation Down to 3.5V # $SSOLFDWLRQV# ■ ■ ■
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MLX90223
-40oC
MLX90223ESO
6300H
254mm
MLX90223
08/Nov/99
marking 23ab
eftec
6300H
marking Z1 sot
mlx 220
eme sot23
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ss41 hall effect sensor
Abstract: UGN3075 U38 HALL SOT23 hall ss41 hall hall effect sensor ugn3175 Bipolar Hall Hall Sensor 4-lead Transistor hall ss41 3 PIN hall effect sensor
Text: US3881 CMOS Low Voltage Hall Effect Latch Features and Benefits n n n n n Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 2.2V CMOS for optimum stability, quality, and cost
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US3881
MLX3881
6300H.
OT-23
US3881
ss41 hall effect sensor
UGN3075
U38 HALL
SOT23 hall
ss41 hall
hall effect sensor ugn3175
Bipolar Hall
Hall Sensor 4-lead
Transistor hall ss41
3 PIN hall effect sensor
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3 PIN hall effect sensor u58
Abstract: A3121 8 pin U58 Hall Effect US5881 equivalent SOT MARKING 213 6300H hall effect sensor u58 ic last digit of year Eftec 64t us5881ua
Text: US5881 CMOS Multi-Purpose Switch Features and Benefits n n n n Chopper stabilized amplifier stage New miniature package / thin, high reliability package Operation down to 3.5V CMOS for optimum stability, quality and cost Applications n n n n n Solid state switch
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US5881
US5881
MLX5881
-20oC
-40oC
3 PIN hall effect sensor u58
A3121 8 pin
U58 Hall Effect
US5881 equivalent
SOT MARKING 213
6300H
hall effect sensor u58
ic last digit of year
Eftec 64t
us5881ua
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Ablebond 84-1*SR4
Abstract: Ablebond 84-1LMISR4 ablebond epoxy 84-1LMISR4 MAX8211CPA lead frame cu C194 sumitomo silver epoxy 6300H C194 84-1lmisr4 sumitomo epoxy 6300h
Text: Environmental Management and Materials Information Product Content Information for: MAX8211CPA+ Yes Lead−Free Qualified Moisture Sensitivity Level L1 Package Code Package Type Body Size Package Option Pin Count P8+1 PDIP .300" Standard 8 Qualified Assembler
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MAX8211CPA+
UL-94
84-1LMISR4
Ablebond 84-1*SR4
Ablebond 84-1LMISR4
ablebond epoxy 84-1LMISR4
MAX8211CPA
lead frame cu C194
sumitomo silver epoxy
6300H
C194
84-1lmisr4
sumitomo epoxy 6300h
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UGN3075
Abstract: ss41 hall effect sensor US3881 HALL SOT-23 U38 HALL HAL105 HAL115 HAL125 US3881UA marking 866
Text: 866;4# &026#/RZ#9ROWDJH#+DOO# IIHFW#/DWFK#### HDWXUHV#DQG#%HQHILWV## • ■ ■ ■ ■ Chopper Stabilized Amplifier Stage Optimized for BDC Motor Applications New Miniature Package/Thin, High Reliability Package# Operation Down to 2.2V CMOS for Optimum Stability, Quality and Cost
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US3881
MLX3881
6300H
254mm
US3881
8/Nov/99
UGN3075
ss41 hall effect sensor
HALL SOT-23
U38 HALL
HAL105
HAL115
HAL125
US3881UA
marking 866
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