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    SUMITOMO 7351 Search Results

    SUMITOMO 7351 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    95735-116LF Amphenol Communications Solutions Clincher™ Flex Connectors, Vertical Header, Single row, 16 Positions, 2.54mm (0.100in) Pitch Visit Amphenol Communications Solutions
    10137351-160000ALF Amphenol Communications Solutions HPCE VT Receptacle 16P Visit Amphenol Communications Solutions
    95735-106LF Amphenol Communications Solutions Clincher™ Flex Connectors, Vertical Header, Single row, 6 Positions, 2.54mm (0.100in) Pitch Visit Amphenol Communications Solutions
    RJSGE4887351 Amphenol Communications Solutions Modular Jack - 8P8C, Right Angle, Cat5e, Four Port, Stacked, 2x2, Shield With Top and Side EMI Tabs, With LEDs, Press-fit Contacts Visit Amphenol Communications Solutions
    95735-104LF Amphenol Communications Solutions Clincher™ Flex Connectors, Vertical Header, Single row, 4 Positions, 2.54mm (0.100in) Pitch Visit Amphenol Communications Solutions

    SUMITOMO 7351 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    EME-7351

    Abstract: Sumitomo 1000 sumitomo epoxy sumitomo silver epoxy Compound JESD22-A112 EME7351 mold compound SUMITOMO 140C
    Text: Cypress Semiconductor Qualification Report QTP# 97351 VERSION 1.0 January, 1998 32 Ld TSOP Package - Sumitomo EME 7351 Mold Compound Anam, Korea Assembly Cypress Semiconductor Assembly: Anam, Korea Package: TSOP - Sumitomo EME-7351/S351 Mold Compound QTP# 97351, V. 1.0


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    EME-7351/S351 EME-7351 30C/60 CY7C109-ZC Sumitomo 1000 sumitomo epoxy sumitomo silver epoxy Compound JESD22-A112 EME7351 mold compound SUMITOMO 140C PDF

    sumitomo epoxy

    Abstract: C7025 Compound c7025 heraeus 4851025 SUMITOMO 7351 140C 8361H JESD22 CF-2071 sumitomo
    Text: Cypress Semiconductor Qualification Report QTP# 99302 VERSION 1.0 November, 1999 32L Small Thin Small Outline Package Sumitomo 7351 Molding Compound Cypress Philippines CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069


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    7351LS C7025 85C/85% CY62128V-ZAIB sumitomo epoxy C7025 Compound c7025 heraeus 4851025 SUMITOMO 7351 140C 8361H JESD22 CF-2071 sumitomo PDF

    EME-7351

    Abstract: 140C 8361H JESD22 sumitomo silver epoxy
    Text: Cypress Semiconductor Qualification Report QTP# 97514 VERSION 1.0 July, 1998 28 Ld TSOP Package Sumitomo EME-7351 Molding Compound Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: 28 Ld TSOP QTP# 97514, V. 1.0 Page 2 of 4


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    EME-7351 EME-7351 8361H JESD22-A112 CY7C199-ZC 140C 8361H JESD22 sumitomo silver epoxy PDF

    8361J

    Abstract: mp8000ch4 Ablestik sumitomo crm EME-G700L g700l R6786-24 sumitomo EME G700L SUMITOMO g700l EME-G700
    Text: February 24, 2005 CN 022405 Customer Notification Assembly Subcontractor Change for QFP and PLCC Packaged Devices Dear Valued Customer: This notification is for the purpose of informing you of a change by Mindspeed Technologies in the packages used for the following devices:


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    CX28392-25 CX28394-25 CX28342-11 CX28343-11 CX28344-11 R6786-24 28XXX-PCN-002-A 8361J mp8000ch4 Ablestik sumitomo crm EME-G700L g700l R6786-24 sumitomo EME G700L SUMITOMO g700l EME-G700 PDF

    JEDEC JESD22-B116

    Abstract: SUMIKON EME EME7351-LP EME-7351 71V016H KMC-184 JESD22-B116 mold compound MIL-STD-883 shinetsu KMC-184
    Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: G-0110-06 Product Affected: Date Effective: DATE: 12/14/2001 Package Family TSSOP, TQFP, TSOP March 15, 2002 Contact: Geoffrey Cortes Manager, Corporate Quality & Reliability


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    G-0110-06 EME-7351LP EME-S351LP 4-10h JEDEC JESD22-B116 SUMIKON EME EME7351-LP EME-7351 71V016H KMC-184 JESD22-B116 mold compound MIL-STD-883 shinetsu KMC-184 PDF

    JEDEC JESD22-B116 free

    Abstract: SUMIKON EME-G700 EME-G700 ablebond 3230 SUMItomo EME-G700 Sumitomo EME-G700 material Ablebond 84-1*SR4 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time
    Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: SR-0212-02 DATE: 12/20/2002 Product Affected: TSOP package family (see attachment for affected part #s). Date Effective: 3/20/2003 Contact: George Snell


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    SR-0212-02 EME-G700 JEDEC JESD22-B116 free SUMIKON EME-G700 EME-G700 ablebond 3230 SUMItomo EME-G700 Sumitomo EME-G700 material Ablebond 84-1*SR4 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time PDF

    sumitomo G700

    Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound
    Text: 10/29/2004 PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


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    PDF

    HI-8010Q

    Abstract: HI3584PQI-10 HI3584PQT HI-3584PQT HI-3584PQTF-10 HI-3584PQI-10 HI-6110PQT 8583P 8010Q Moisture Sensitivity Level Rating
    Text: 52-Lead Quad Flat Pack QFP Package Transfer Product Change Notice PCN0805 (v1.0) September 12, 2008 Overview This notice describes the changes to the 52-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.


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    52-Lead PCN0805 7351LS, 6600CGL, JESD46-C, QR-8013 HI-8010Q HI3584PQI-10 HI3584PQT HI-3584PQT HI-3584PQTF-10 HI-3584PQI-10 HI-6110PQT 8583P 8010Q Moisture Sensitivity Level Rating PDF

    JESD78

    Abstract: Sumitomo 6730B Compound c7025 RH-1750
    Text: 05/04/2004 RELIABILITY REPORT FOR DS2770, Rev A4 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


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    DS2770, reliabilit50C JESD78 Sumitomo 6730B Compound c7025 RH-1750 PDF

    SUMITOMO EME G600

    Abstract: EME G600 Moisture Sensitivity Level Rating 8050P sumitomo lcd 1575P JESD46-C pc/SUMITOMO g600
    Text: 32 & 64-Lead Quad Flat Pack QFP Package Transfer Product Change Notice PCN0809 (v1.0) September 12, 2008 Overview This notice describes the changes to the 32-Lead & 64-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, Discrete to Digital and LCD Display Driver family of devices.


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    64-Lead 32-Lead PCN0809 7351LS, JESD46-C, QR-8036 SUMITOMO EME G600 EME G600 Moisture Sensitivity Level Rating 8050P sumitomo lcd 1575P JESD46-C pc/SUMITOMO g600 PDF

    CRM-1076DJ-G

    Abstract: SUMITOMO g600f G600F sumitomo crm 1076dj greatek SUMITOMO EME G CRM1076DJ 100-Lead-LQFP LQFP Package CRM*1076
    Text: 100-Lead Quad Flat Pack QFP Package Transfer Product Change Notice PCN1003 (v1.0) April 22, 2010 Overview This notice describes the changes to the 100-Lead Quad Flat Pack (QFP) Package for the HI-8045PQx LCD Display Driver family of devices. Description


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    100-Lead HI-8045PQx PCN1003 JESD46-C, QR-1003 CRM-1076DJ-G SUMITOMO g600f G600F sumitomo crm 1076dj greatek SUMITOMO EME G CRM1076DJ 100-Lead-LQFP LQFP Package CRM*1076 PDF

    LMISR4

    Abstract: J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
    Text: 01/12/05 RELIABILITY REPORT FOR DS1685, Rev B2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : don.lipps@dalsemi.com


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    DS1685, LMISR4 J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841 PDF

    J-STD-020

    Abstract: S0309
    Text: 08/02/2004 RELIABILITY REPORT FOR DS1267, Rev A2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


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    DS1267, J-STD-020 S0309 PDF

    leadframe C7025

    Abstract: Ablestik 84-1 EME7351T Ablestik 84-1 lmis-r4 74LCXR162245MTX Ablestik LMISR4 FSTUD16211MTDX Sumitomo 7351T Ablestik leadframe Cu C7025
    Text: Date Created: 4/21/2004 Date Issued: 5/3/2004 PCN # 20033907-B DESIGN/PROCESS CHANGE NOTIFICATION - FINAL This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence.


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    20033907-B epax02 6437211EXT 74VCXH16374MTDX 74VHC161284MTD FIN1108MTDX FIN1216MTD FIN1217MTDX FIN3383MTD FIN3385MTDX leadframe C7025 Ablestik 84-1 EME7351T Ablestik 84-1 lmis-r4 74LCXR162245MTX Ablestik LMISR4 FSTUD16211MTDX Sumitomo 7351T Ablestik leadframe Cu C7025 PDF

    EME-7351

    Abstract: Ablestik 8361 140C JESD22 JESD22-A112
    Text: Cypress Semiconductor Qualification Report QTP# 97098 VERSION 1.0 April, 1997 28 Ld Thin Small Outline Package TSOP Anam, Philippines Cypress Semiconductor Assembly: Anam, Philippines Package: TSOP QTP# 97098, V. 1.0 Page 2 of 4 April, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION


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    209mil JESD22-A11 85C/85 CY7C199-ZC EME-7351 Ablestik 8361 140C JESD22 JESD22-A112 PDF

    Sumitomo 7351T

    Abstract: 7351T 84-1lmis 140C JESD22
    Text: Cypress Semiconductor Qualification Report QTP# 97151, Version 1.0 December, 1997 16 Ld TSSOP Package Anam, Philippines Assembly Cypress Semiconductor Assembly: Anam, Philippines Package: 16 Ld TSSOP QTP# 97151, V. 1.0 2 of 4 December, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION


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    7351T 84-1LMISR4 JESD22-A112 85C/85 CY2308ZC Sumitomo 7351T 7351T 84-1lmis 140C JESD22 PDF

    9936

    Abstract: 9938 BPSG Ablebond 84-1 LMISR4 9626 Transistors mark 9936 b
    Text: 11/05/2003 RELIABILITY REPORT FOR DS1780, Rev A4, 24 TSSOP 4.4mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292


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    DS1780, 9936 9938 BPSG Ablebond 84-1 LMISR4 9626 Transistors mark 9936 b PDF

    TSOP 48 thermal resistance

    Abstract: 130C 8361H CY62148 CY62148V JESD22 tsop package MSL
    Text: Cypress Semiconductor Package Qualification Report QTP# 000805 VERSION 1.0 October 2000 32 Lead 400 mil TSOP type ll package and Moisture Level 3 Chip Pac Hyundai Korea CYPRESS TECHNICAL CONTACT FOR QUALITFICATION DATA: Ed Russell Reliability Director (408) 432–7069


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    CY62148 CY62148V R52LD-3) 30C/60 CY62148-ZSC TSOP 48 thermal resistance 130C 8361H CY62148 CY62148V JESD22 tsop package MSL PDF

    9732

    Abstract: No abstract text available
    Text: 02/24/2004 RELIABILITY REPORT FOR DS1306, Rev A2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


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    DS1306, 9732 PDF

    84-1lmis

    Abstract: Ablestik 84-1LMIS 8361H CY2212 JESD22 free energy circuit generator
    Text: Cypress Semiconductor Qualification Report QTP# 99141/99305 VERSION 1.0 October, 1999 Direct Rambus Clock Generator Lite CY2212 ® Direct Rambus is registered trademark of Rambus Inc. CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director


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    CY2212 R42LDHA 7C82121A/7C80800A) CY2212, CY7C1352-AC 30C/60 CY7C1350-AC 84-1lmis Ablestik 84-1LMIS 8361H CY2212 JESD22 free energy circuit generator PDF

    PSD834

    Abstract: PSD834F2 QRMS0201 uPSD3234A-40U6 QUALITY report die attach mcu
    Text: QRMS0201 QUALITY REPORT µPSD32XX STACKED DIE QUALIFICATION TEST RESULTS INTRODUCTION This report summarizes the qualification testing of the µPSD32XX family of devices which features a Flash-based Programmable System Device integrated with an 8032 microcontroller core in a stacked die


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    QRMS0201 PSD32XX uPSD3234A-40U6 PSD834F2 35micron T6X-U35 256KByte PSD834 QRMS0201 QUALITY report die attach mcu PDF

    Ablestik 84-1

    Abstract: KMC-184 sumitomo epoxy olin 7025 Sumitomo 7351T eme6600cs SUMITOMO EME6600cs 74std kmc184-7 megatest tester
    Text: TM Fairchild Semiconductor Salt Lake 3333 West 9000 South West Jordan, UT 84088-8838 Fax: 1.801.562.7500 CS100HEE MICROWIRE INTERFACE EEPROM QUALIFICATION PACKAGE 1.0um CMOS technology Advanced Semiconductor Manufacturing Corp. of Shanghai Product: .Serial EEPROM


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    CS100HEE CS100HEE 200mA 200mA) 200mA FM93C46EA FM93C56CA FM93C66BA FM93C86AA FM93CS46AA Ablestik 84-1 KMC-184 sumitomo epoxy olin 7025 Sumitomo 7351T eme6600cs SUMITOMO EME6600cs 74std kmc184-7 megatest tester PDF

    Untitled

    Abstract: No abstract text available
    Text: NEW 0.3mm Contact Pitch, 1.25mm above the board, Flexible Printed Circuit Connectors FH 23 Series ●Staggered termination configuration. Only 1.25 mm above the board. Leadless type Completely enclosed bottom surface Lead type 1.25mm •Features 1. FPC low insertion force and high holding force


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    conn1908 PDF

    Sumitomo CRM 1033B

    Abstract: sumitomo 1033B CRM1033B MOTOROLA POWER TRANSISTOR lc 945 sumitomo crm-1033B 8361J
    Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Reliability Information Motorola Reliability and Quality Assurance Reliability Motorola has a long standing reputation for manufacturing products of excellent Quality and Reliability since the introduction of the first car


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    BR1339 Sumitomo CRM 1033B sumitomo 1033B CRM1033B MOTOROLA POWER TRANSISTOR lc 945 sumitomo crm-1033B 8361J PDF