EME-7351
Abstract: Sumitomo 1000 sumitomo epoxy sumitomo silver epoxy Compound JESD22-A112 EME7351 mold compound SUMITOMO 140C
Text: Cypress Semiconductor Qualification Report QTP# 97351 VERSION 1.0 January, 1998 32 Ld TSOP Package - Sumitomo EME 7351 Mold Compound Anam, Korea Assembly Cypress Semiconductor Assembly: Anam, Korea Package: TSOP - Sumitomo EME-7351/S351 Mold Compound QTP# 97351, V. 1.0
|
Original
|
PDF
|
EME-7351/S351
EME-7351
30C/60
CY7C109-ZC
Sumitomo 1000
sumitomo epoxy
sumitomo silver epoxy
Compound
JESD22-A112
EME7351
mold compound
SUMITOMO
140C
|
P7060
Abstract: KMC188-1 KMC-188-1 plaskon TEXAS INSTRUMENTS, Mold 5262a 500 mold compound EME6250 EME6750
Text: TEXAS INSTRUMENTS Final Notification for PDIP/PLCC Package Mold Compound Change to Sumitomo EME6300HS September 20, 1996 Abstract Texas Instruments is making its final announcement of its implementation of the new mold compound material SUMITOMO EME6300HS in its manufacturing facility in TI Philippines, Inc.
|
Original
|
PDF
|
EME6300HS
EME6300HS)
P7060
KMC188-1
KMC-188-1
plaskon
TEXAS INSTRUMENTS, Mold
5262a
500 mold compound
EME6250
EME6750
|
sumitomo epoxy
Abstract: sumitomo EME-7351LS EME7351LS EME7351UT Compound EME-7351
Text: TO: ALL PERICOM CUSTOMERS SUBJECT: Sumitomo Epoxy Mold Compound Issue – EME7351UT Pericom’s current plastic encapsulated, Surface Mount Technology SMT packaged peripheral leaded products do not utilize Sumitomo’s EME7351UT mold compound. This epoxy uses a Particled Phosphorus Flame Retardant Agent, which was found by some
|
Original
|
PDF
|
EME7351UT
EME7351UT
EME7351US.
EME7351LS
sumitomo epoxy
sumitomo
EME-7351LS
Compound
EME-7351
|
Untitled
Abstract: No abstract text available
Text: DCS/PCN-1134 PRODUCT CHANGE NOTICE Initial Final Contact Date: Implementation Date: Alert Category: Alert Type: PCN #: April 30, 2009 May 30, 2009 Material Change Mold compound/die attach change PCN #: 1134 TITLE Conversion of Sumitomo mold compound EME-6300H being discontinued by manufacturer to Sumitomo equivalent mold
|
Original
|
PDF
|
DCS/PCN-1134
EME-6300H
EME6600CSP
84-1LMISR4.
EME-6300CSP
EME-63000H.
EME-6600CSP
EME-6300H.
ad33K5L-13
AP1506-33K5L-U
|
sumitomo 6600
Abstract: sumitomo epoxy 6600 4835 sumitomo EME 6600 sumitomo epoxy 8361H CY74FCT2245ATQC CY74FCT2646ATQC CY7C199-12VC JESD22
Text: Cypress Semiconductor Qualification Report QTP# 99101 VERSION 1.0 May, 1999 Sumitomo EME 6600CR Molding Compound Cypress Philippines CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Cypress Semiconductor Quality and Reliability Department Cypress Semiconductor
|
Original
|
PDF
|
6600CR
6600CR
85C/85%
CY7C63101A-OC
CY74FCT2646ATQC
CY74FCT2245ATQC
619903565M1
CY7C1399-VC
CY62256V-VC
sumitomo 6600
sumitomo epoxy 6600
4835
sumitomo EME 6600
sumitomo epoxy
8361H
CY74FCT2245ATQC
CY74FCT2646ATQC
CY7C199-12VC
JESD22
|
sumitomo epoxy
Abstract: 7C109A CY7C109 EME TI
Text: Qualification Report January 1997 QTP# 95483, Version 1.0 SUMITOMO EME-9300 Low Alpha Molding Compound PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part
|
Original
|
PDF
|
EME-9300
CY7C109
32-pin,
400-mil
CY7C109)
7C109A
PassivaY7C109-VC
CY7C109-VC
sumitomo epoxy
7C109A
CY7C109
EME TI
|
EME 7320
Abstract: Ablestik Ablestik 8361 7320 a144g SUMITOMO EME G A100A CY7C09579V-AC JESD22 ASE Cypress
Text: Cypress Semiconductor Mold Compound Qualification Report QTP# 002403 VERSION 1.0 January, 2001 Sumitomo EME 7320 Mold Compound, MSL3 for DCD-Thin Quad Flat Pack, TQFP ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director
|
Original
|
PDF
|
160-lead
CY7C375I-AC
EME 7320
Ablestik
Ablestik 8361
7320
a144g
SUMITOMO EME G
A100A
CY7C09579V-AC
JESD22
ASE Cypress
|
sumitomo epoxy
Abstract: EME 7320 7320 8361H CY7C375-AC JESD22
Text: Cypress Semiconductor Package Qualification Report QTP# 000303 VERSION 1.1 March, 2000 Up to160 Lead Thin Quad Flat Pack Sumitomo EME 7320 Mold Compound ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069
|
Original
|
PDF
|
to160
CY7C375-AC
sumitomo epoxy
EME 7320
7320
8361H
CY7C375-AC
JESD22
|
QMI 509 epoxy
Abstract: SUMITOMO eme-6600hr 6600HR SOJ package MSL QMI 509 epoxy datasheet CY7C63001A-SC JESD22 EME6600HR mold compound EME 6600HR
Text: Cypress Semiconductor Package Qualification Report QTP# 023401 VERSION 2.0 GI July, 2004 32-lead SOIC package using Sumitomo EME 6600HR Mold Compound, MSL1 Cypress Philippines CML-R CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Principal Reliability Engineer
|
Original
|
PDF
|
32-lead
6600HR
28-44lead
635mils
01BLL-SI
610221877M
CY62128BLL-SI
QMI 509 epoxy
SUMITOMO eme-6600hr
SOJ package MSL
QMI 509 epoxy datasheet
CY7C63001A-SC
JESD22
EME6600HR
mold compound
EME 6600HR
|
EME-7351
Abstract: 140C 8361H JESD22 sumitomo silver epoxy
Text: Cypress Semiconductor Qualification Report QTP# 97514 VERSION 1.0 July, 1998 28 Ld TSOP Package Sumitomo EME-7351 Molding Compound Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: 28 Ld TSOP QTP# 97514, V. 1.0 Page 2 of 4
|
Original
|
PDF
|
EME-7351
EME-7351
8361H
JESD22-A112
CY7C199-ZC
140C
8361H
JESD22
sumitomo silver epoxy
|
SUMITOMO EME6600
Abstract: EME6600 Compound 6600cs 3818 MIL-STD-883c-method 1010 6600CS
Text: Cypress Semiconductor Package Qualification Report QTP# 99234 VERSION 1.1 September 2000 52-208-pin Plastic Quad Flatpack Package PQFP Sumitomo 6600CS molding Compound ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director
|
Original
|
PDF
|
52-208-pin
6600CS
52-208-Lead
N52D/N208L
52/208-pin
CY82C693-NC
619909669B
SUMITOMO EME6600
EME6600
Compound 6600cs
3818
MIL-STD-883c-method 1010
|
PCN0310
Abstract: EME-6300 MP-8000 MP8000 Nitto MP 7000 ASE QFP 8000 Series mold compound EME6300 Nitto MP 8000
Text: PROCESS CHANGE NOTICE PCN0310 MOLD COMPOUND CHANGE FOR 100 LEAD QFP PACKAGE Change Description: ASE Malaysia will be extending the use of Nitto’s MP-8000 series mold compound to Altera’s 100 lead Quad Flat Package. Currently this package is using Sumitomo’s EME-6300 series
|
Original
|
PDF
|
PCN0310
MP-8000
EME-6300
MP8000
PCN0310
Nitto MP 7000
ASE QFP
8000 Series
mold compound
EME6300
Nitto MP 8000
|
SUMITOMO EME-1100H
Abstract: mold compound SUMITOMO Compound DS2400 1100-H 1100H CARSEM DS1233 DS1410D
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: March 6, 1997 Subject: PRODUCT CHANGE NOTICE – B70601 Description: Qual of 6710S Mold Compound at Carsem for SOT 233 Packages Description of Change: SOT 223 packages are currently assembled with SUMITOMO EME 1100H mold compound. Proposed
|
Original
|
PDF
|
B70601
6710S
1100H
6710S.
DS1233
DS2401
DS2223
DS2224
DS24S01
SUMITOMO EME-1100H
mold compound
SUMITOMO
Compound
DS2400
1100-H
CARSEM
DS1233
DS1410D
|
PCN0404
Abstract: SUMITOMO g700l sumitomo EME G700L G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700
Text: PROCESS CHANGE NOTICE PCN0404 ADDITIONAL MOLD COMPOUND FOR TQFP 144 PACKAGE Change Description: The Sumitomo G700L mold compound is being added as additional mold compound choice for selected Altera devices in thin quad flat pack TQFP 144 lead packages assembled by
|
Original
|
PDF
|
PCN0404
G700L
PCN0404
SUMITOMO g700l
sumitomo EME G700L
TQFP 144 PACKAGE
Compound
SUMITOMO
mold compound
TQFP 144 PACKAGE altera
G700
|
|
|
sumitomo crm
Abstract: CRM-501 SUMITOMO CDC2582 CDC2586 CDC582 CDC586 SN74ABT32316 SN74ABT32318 CEL-X-9000
Text: TEXAS INSTRUMENTS Notification of the Planned Qualification for Certain ASL TQFP Packages at the Hiji, Japan Assembly Site January 19, 1996 Abstract Texas Instruments Advanced System Logic ASL is consolidating the manufacture of certain TQFP packaged devices. The affected devices, currently being built in TI’s Philippines and Sherman, Texas
|
Original
|
PDF
|
|
en4065
Abstract: EN-4065 SUMITOMO eme Sumitomo 1000 SN74FB1650 SN74FB1651 TNETA1611 TEXAS INSTRUMENTS, Mold Compound sumitomo hitachi en 4065
Text: TEXAS INSTRUMENTS Notification for the Planned Qualification for the 100 Pin PCA and 120 Pin PCB Packages at the Hiji, Japan Assembly Site Initial Notification of Planned Qualification for the 100 Pin PCA and 120 Pin PCB Packages at the Hiji, Japan Assembly Site
|
Original
|
PDF
|
|
sumitomo
Abstract: en4065 SUMITOMO eme 5274A 50C24 hitachi trace code hitachi assembly date code Sumitomo 1000 SN74FB1650 SN74FB1651
Text: TEXAS INSTRUMENTS Final Notification of Qualification for the 100 Pin PCA and 120 Pin PCB Packages at the Hiji, Japan Assembly Site February 5, 1997 Abstract Texas Instruments Standard Linear and Logic SLL is adding Hiji as a qualified assembly site for
|
Original
|
PDF
|
|
PCN0702
Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line
|
Original
|
PDF
|
PCN0702
PCN0702,
6300HJ
G700M
PCN0702
MP8000CH4
48hrs)
X10-5
UL-94
SUMITOMO G700
SUMITOMO G600
SUMITOMO EME G700
sumitomo 6300h mold compound
SUMITOMO EME G600
EME G600
material properties G600 mold compound
sumitomo G700 Tg
|
sumitomo epoxy 6300h
Abstract: sumitomo epoxy wafer LTO CY74FCT16244T EME-6300H hysol sumitomo 6300h mold compound
Text: Qualification Report March, 1995 QTP# 94432/94434 Version 1.0 16-Bit Buffers/Line Drivers/Transceiver CYPRESS SEMICONDUCTOR PAGE 3 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part
|
Original
|
PDF
|
16-Bit
CY74FCT16244T
7C7144A
March/1995
200mA
sumitomo epoxy 6300h
sumitomo epoxy
wafer LTO
CY74FCT16244T
EME-6300H
hysol
sumitomo 6300h mold compound
|
74CT573
Abstract: MALAYSIA CDIP28 TSOC 6 socket 74FCT191 74FCT543 hysol sumitomo epoxy sumitomo epoxy 6300h TSOC
Text: Qualification Report January, 1995 QTP# 94048 Version 1.3 FAB3 0.65 µm FCT-T PRODUCTS CYPRESS SEMICONDUCTOR PAGE 3 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part
|
Original
|
PDF
|
CY54/74CT573T
FT573A
Feb/1994
74CT573
MALAYSIA
CDIP28
TSOC 6 socket
74FCT191
74FCT543
hysol
sumitomo epoxy
sumitomo epoxy 6300h
TSOC
|
CY7C190
Abstract: cy7c189 sumitomo silver epoxy 7C189 EME-6300H UL-94V0 lc 245a CY27S07 dynamic ram cmos 16pin 7C190
Text: Qualification Report January 1992 QTP 90313 64 Bit Static RAM Family MARKETING PART NBR DEVICE DESCRIPTION CY7C189 Inverted R/W CY7C190 R/W Version 1.1 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part
|
Original
|
PDF
|
CY7C189
CY7C190
7C189B
200mA
64-bit
CY7C190
cy7c189
sumitomo silver epoxy
7C189
EME-6300H
UL-94V0
lc 245a
CY27S07
dynamic ram cmos 16pin
7C190
|
8361J
Abstract: mp8000ch4 Ablestik sumitomo crm EME-G700L g700l R6786-24 sumitomo EME G700L SUMITOMO g700l EME-G700
Text: February 24, 2005 CN 022405 Customer Notification Assembly Subcontractor Change for QFP and PLCC Packaged Devices Dear Valued Customer: This notification is for the purpose of informing you of a change by Mindspeed Technologies in the packages used for the following devices:
|
Original
|
PDF
|
CX28392-25
CX28394-25
CX28342-11
CX28343-11
CX28344-11
R6786-24
28XXX-PCN-002-A
8361J
mp8000ch4
Ablestik
sumitomo crm
EME-G700L
g700l
R6786-24
sumitomo EME G700L
SUMITOMO g700l
EME-G700
|
sumitomo epoxy
Abstract: CY74FCT16543T EME-6300H O5611 MANUFACTURER AND SUPPLIER LOCATION INFORMATION
Text: Qualification Report July, 1995 QTP# 94431 Version 1.0 56-Pins SSOP package CYPRESS SEMICONDUCTOR PAGE 3 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part
|
Original
|
PDF
|
56-Pins
CY74FCT16543T
7C7144A
July/1995
CY74FCT16543TPVC
56-pin
sumitomo epoxy
CY74FCT16543T
EME-6300H
O5611
MANUFACTURER AND SUPPLIER LOCATION INFORMATION
|
CY7C128A 16k sram
Abstract: CY7C128A SRAM CY7C128A CY7C167A CY7C168A CY7C169A CY7C170A CY7C171A CY7C172A EME-6300H
Text: Qualification Report June, 1994, QTP# 91423/93201 Version 1.1 16K Chop Redesign MARKETING PART NUMBER DEVICE DESCRIPTION CY7C128A 2K x 8 Static R/W RAM CY7C167A 16K x 1 Static R/W RAM CY7C168A 4K x 4 Static RAM CY7C169A 4K x 4 Static RAM CY7C170A 4K x 4 Static RAM
|
Original
|
PDF
|
CY7C128A
CY7C167A
CY7C168A
CY7C169A
CY7C170A
CY7C171A
CY7C172A
200mA
CY7C128A 16k sram
CY7C128A SRAM
CY7C128A
CY7C167A
CY7C168A
CY7C169A
CY7C170A
CY7C171A
CY7C172A
EME-6300H
|