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    PCN0404

    Abstract: SUMITOMO g700l sumitomo EME G700L G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700
    Text: PROCESS CHANGE NOTICE PCN0404 ADDITIONAL MOLD COMPOUND FOR TQFP 144 PACKAGE Change Description: The Sumitomo G700L mold compound is being added as additional mold compound choice for selected Altera devices in thin quad flat pack TQFP 144 lead packages assembled by


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    PDF PCN0404 G700L PCN0404 SUMITOMO g700l sumitomo EME G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700

    HI-3584APQT

    Abstract: HI-8010Q HI-3583APQT-15 sumitomo G700lx HI-3584APQI G700LX HI-3585PQTF HI-3584APQI-15 HI-8582PQIF Hi-3582APQI
    Text: 52 & 44 Lead Quad Flat Pack QFP MSL Improvement Product Change Notice PCN1006 (v1.0) October 01, 2010 Overview This notice describes the changes to the 52 & 44 Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.


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    PDF PCN1006 6600CGL G700LX 84-1LMISR4 HI-3587PQTF HI-3587PQM HI-3587PQMF HI-3588PQI HI-3588PQIF HI-3588PQT HI-3584APQT HI-8010Q HI-3583APQT-15 sumitomo G700lx HI-3584APQI G700LX HI-3585PQTF HI-3584APQI-15 HI-8582PQIF Hi-3582APQI

    sumitomo EME G700L

    Abstract: SUMITOMO g700l g700l Loctite 536 EME-G700 EME G700L lead frame cu C194 ablestick tqfp upsd
    Text: 05/12/06 µPSD ATK Assembly Qualification Test Report The following report summarizes the qualification testing of the uPSD family of µPSD Microcontrollers additional assembly and test locations AMKOR Technology Korea. To meet the increased product demand, and to enable flexibility for


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