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    SUMITOMO G770 DISSIPATION FACTOR Search Results

    SUMITOMO G770 DISSIPATION FACTOR Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-NBC0DSASLB-3DB Amphenol Cables on Demand Amphenol CS-NBC0DSASLB-3DB 4x External HD Mini-SAS Loopback Adapter Module for SFF-8644 Mini-SAS HD Port Testing - 3dB Attenuation & 0W Power Consumption [Copper+Optical Ready] Datasheet
    ML4800CP Rochester Electronics LLC ML4800 - Power Factor Controller With Post Regulator, Voltage-mode, 1A, 250kHz Switching Freq-Max, BICMOS, PDIP16 Visit Rochester Electronics LLC Buy
    Z926 Coilcraft Inc NOT RoHS. Power factor controller transformer for IR215 Visit Coilcraft Inc
    Z9264- Coilcraft Inc NOT RoHS. Power factor controller transformer for IR215 Visit Coilcraft Inc
    Z9265- Coilcraft Inc NOT RoHS. Power factor controller transformer for ST PFCL6561D Visit Coilcraft Inc

    SUMITOMO G770 DISSIPATION FACTOR Datasheets Context Search

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    PCN0516

    Abstract: G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo
    Text: PROCESS CHANGE NOTIFICATION PCN0516 MOLD COMPOUND CHANGE FOR PBGA PACKAGES Change Description: Altera is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic ball-grid array PBGA packaged devices. Devices in 225, 256, and 672 pin PBGA


    Original     		PCN0516 x10-5/C x102N/mm2 UL-94 1X10E12 PCN0516 G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo PDF

    PCN0515

    Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
    Text: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently


    Original     		PCN0515 HC-100 UL-94 1x1011 PCN0515 sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC PDF