smema
Abstract: land pattern for TSOP ultrasonic bond tensile-strength soft solder die bonding IPC-SM-780 TO metal package aluminum kovar dual beam laser land pattern for SOP material composition of chip capacitors
Text: CHAPTER 13 GLOSSARY A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.
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CERAMIC PIN GRID ARRAY wire lead frame
Abstract: IPC-SM-780 nickel corrosion electroplating
Text: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.
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CERAMIC PIN GRID ARRAY wire lead frame
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nickel corrosion electroplating
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IPC-SM-780
Abstract: No abstract text available
Text: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.
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Abstract: No abstract text available
Text: 2 Glossary 1/17/97 11:08 AM GLOSSARY.DOC INTEL CONFIDENTIAL until publication date 2 GLOSSARY A Access hole: A hole or series of holes in successive layers of a multilayer board that provide(s) access to the surface of the land in one or more layers of the board.
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ECF564A
Abstract: H20E TS0300W3 TS0300 TS0500W3 diode wb1 84-1LMI MIL-F-14256 Ablestik 84-1LMI paste resistor thick film
Text: Application Note 006 Wrapped Chip Device Mounting Instructions Page 1 of 4 Application Note #006 Wrapped Chip Device Mounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back metallization and platinum gold input/output
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Technical Brochure
Abstract: Catalytic capacitors coefficient of thermal expansion Kester sn62 tinning SN62 Ceramic Dielectric Axial Capacitors Glass Encapsulated CERAMICS CAPACITORS 0402 88Au novacap epoxy silver
Text: NOVACAP TECHNICAL BROCHURE O. CHIP USER GUIDELINES Multilayer ceramic capacitors are sold as chip leadless components, or as encapsulated leaded devices. Traditionally, the chip version has been used in densely packed hybrid and delay line circuits, while the
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TS0300
Abstract: H20E TS0500 84-1LMI MIL-F-14256 TS050
Text: Application Note 005 Chip Device Mounting Instructions Page 1 of 4 Application Note #005 Chip Device Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used
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surface mount circuit board "bond pad" conductor
Abstract: No abstract text available
Text: AT C H I G H P O W E R R E S I S T I V E P R O D U C T S Attachment Recommendations for Leaded Resistors and Terminations When mounting chips, the solder interface to the mounting surface has a crucial bearing on performance. Even with very careful soldering technique,
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Abstract: No abstract text available
Text: High Power Resistive Products Resistors and Terminations: Mounting and Attachment Recommendations CHIP ATTACHMENT AND PC BOARD RECOMMENDATIONS For the mounting of chip or leaded devices, it is important to obtain a good solder joint between the device’s ground plane and
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jb smd
Abstract: HERMETIC SMD pd smd smd transistor 2x smd resistors mechanical dimension FR4 substrate with dielectric constant 4 smd package variety SMD Devices TO-25X CLCC 64 pins footprint
Text: The Hermetic Surface Mount Device SMD , Its Advantages and Solutions to Assembly Integration Tiva Bussarakons International Rectifier, Inc. El Segundo, California Introduction Hermetic surface mount packages have been in existence for more than 15 years. While the leaded
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jb smd
HERMETIC SMD
pd smd
smd transistor 2x
smd resistors mechanical dimension
FR4 substrate with dielectric constant 4
smd package variety
SMD Devices
TO-25X
CLCC 64 pins footprint
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tm 1628 smd
Abstract: AN598 78610 3002 ic equivalent cte table epoxy IC 3004 200B hear HEINEMANN
Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of
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tm 1628 smd
AN598
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3002 ic equivalent
cte table epoxy
IC 3004
200B
hear
HEINEMANN
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WLCSP smt
Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None
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WLCSP smt
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Cu OSP and Cu SOP
qfn tray pocket size 5 x 6
SUF1577-15
WLCSP stencil design
without underfill
SAC396
cte table flip chip substrate
SAC 2.3 Ag bump composition
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jb smd
Abstract: smd transistor 2x 2x smd Capacitors 10-16 L smd smd resistors packages 2X smd transistor HERMETIC SMD SMD Devices
Text: Application Note AN-1016 Hermetic Surface Mount Device SMD , Its Advantages and Solutions to Assembly Integration by Tiva Bussarakons International Rectifier, Inc. El Segundo, California Introduction Hermetic surface mount packages have been in existence for more than 15 years. While the leaded
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smd transistor 2x
2x smd
Capacitors 10-16 L smd
smd resistors packages
2X smd transistor
HERMETIC SMD
SMD Devices
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200B
Abstract: AN598 DK-2750 RG41 popcorn defect analysis to-220
Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of
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DK-2750
RG41
popcorn
defect analysis to-220
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Moisture Sensitivity Levels MICROCHIP PIC Package
Abstract: 78610 delamination leadframe barber excursion AN598
Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of
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78610
delamination leadframe
barber excursion
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IRf 447 MOSFET
Abstract: TO-25X smd diode IF
Text: Application Note AN-1016 Hermetic Surface-Mount Discrete Semiconductor, Solutions to Assembly Integration By Tiva Bussarakons Table of Contents Page Introduction . …….2
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smd diode IF
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84-1LMI epoxy adhesive
Abstract: TS0300W3 TS0500W3
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold wrap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold w rap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
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schematic WELDER
Abstract: gold melting furnace ultrasonic bond
Text: Bonding and Handling Procedures for Chip Devices DISCUSSION Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last few years. Today's circuit designer is faced with a multiplicity of alter natives in the selection of diodes and packaging with each
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OT-23
schematic WELDER
gold melting furnace
ultrasonic bond
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Untitled
Abstract: No abstract text available
Text: A pplication N ote 004 Wrapped Chip D evice M ounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back m etallization and platinum gold input / output terminations.
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Ablestik 84-1LMI
Abstract: gold melting furnace 84-1LMI epoxy adhesive
Text: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with
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SMD Hall sensors
Abstract: surface mount circuit board "bond pad" conductor
Text: OPTEK TECHNOLOGY INC 4ÔE D M ^ÔSÔO 0DD12fll CHb • OT* - T 'H Z S I OPTO HYBRID FEATURES Chip-on-board design can provide several advantages: SIZE: Used where the function cannot be accomplished with conventional through hole, leaded components. Space savings can be as much as 80% as compared with discrete packaged parts.
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84-1LM
Abstract: ECF564A
Text: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are com m only used in RF and microwave applications. Some of these chips are offered with
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