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    SZZA004

    Abstract: Alpha WS-609 EIA-638 solder paste alpha WS609 ic shelf life Alpha WS609 solder solder paste alpha WS609 TECHNICAL Alpha WS-609 solder VIP98A WS609
    Text: Steam-Age Evaluation of Nickel/Palladium Lead Finish for Integrated Circuits SZZA004 September 1998 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest


    Original     		PDF SZZA004 ANSI/J-STD-002 WS-609. ANSI/EIA-638, SZZA004 Alpha WS-609 EIA-638 solder paste alpha WS609 ic shelf life Alpha WS609 solder solder paste alpha WS609 TECHNICAL Alpha WS-609 solder VIP98A WS609

    ic shelf life

    Abstract: J-STD-002 J-STD-002B B827 SZZA002 IPC EIA J-STD-001 J-STD-001 SZZA046 um43a
    Text: Application Report SZZA046 - June 2004 Shelf-Life Evaluation of Lead-Free Component Finishes Douglas W. Romm, Donald C. Abbott, and Bernhard Lange ABSTRACT The integrated circuit IC industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time


    Original     		PDF SZZA046 ic shelf life J-STD-002 J-STD-002B B827 SZZA002 IPC EIA J-STD-001 J-STD-001 um43a