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    TB389. Price and Stock

    Cooper Crouse-Hinds LTB3890

    Conduit Gland, 90Deg, Insulated, Iron, 0.375"; Conduit Configuration:90 Degree; Trade Size:3/8"; Conduit Material:Malleable Iron; Conduit Colour:Metallic - Zinc Electroplate; External Length:-; Ip/Nema Rating:- Rohs Compliant: Yes |Crouse-Hinds LTB3890
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    Newark LTB3890 Bulk 50
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    • 100 $11.68
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    Master Electronics LTB3890 5
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    • 10 $20.53
    • 100 $17.11
    • 1000 $16.68
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    TB389. Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    TB389 Intersil PRISM 2.5 PCB Land Pattern Design and Surface Mount Guidelines for MLFP Packages Original PDF

    TB389. Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    J-STD-005

    Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently


    Original     		PDF TB389 J-STD-005 nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 XQFN

    J-STD-005

    Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently


    Original     		PDF TB389 J-STD-005 land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389

    J-STD-005

    Abstract: nozzle heater paste profile qfn 10mm land pattern J-STD-001C solder joint IPC-SM-782 MO-220 TB389 MARK RAY QFN
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN MLFP Packages Technical Brief March 2004 TB389.2 Authors: Jim Benson, Mark Kwoka, Ray Claudio Introduction General Design Guidelines Intersil’s Quad Flat No Lead (QFN), Micro Lead Frame Plastic (MLFP) package is a relatively new packaging


    Original     		PDF TB389 J-STD-005 nozzle heater paste profile qfn 10mm land pattern J-STD-001C solder joint IPC-SM-782 MO-220 MARK RAY QFN