RTAX1000SL
Abstract: RTAX1000S RTAX1000S-SL RTAX250SL RTAX2000SL RTAX2000S RTAX250S RTAX4000S 56 pin edac connector
Text: RTAX-S/SL RadTolerant FPGAs Detailed Specifications Table 2-1 • I/O Features Comparison I/O Assignment 3.3 V LVTTL Clamp Diode Hot Insertion / Cold Sparing 1 Yes 5V Tolerance Input Buffer Output Buffer No 1 Yes Enabled/Disabled Enabled/Disabled 3.3 V PCI
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JESD8-11)
RTAX1000SL
RTAX1000S
RTAX1000S-SL
RTAX250SL
RTAX2000SL
RTAX2000S
RTAX250S
RTAX4000S
56 pin edac connector
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GDDR5 pinout
Abstract: coprocessor
Text: Intel Xeon Phi Coprocessor Datasheet April 2014 Document ID Number: 328209 003EN By using this document, in addition to any agreements you have with Intel, you accept the terms set forth below. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel
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003EN
GDDR5 pinout
coprocessor
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CAT16-LV4F12
Abstract: PAC10 a3pe3000 JESD8-8 TBD 234 V12
Text: 2 – ProASIC3E DC and Switching Characteristics General Specifications DC and switching characteristics for –F speed grade targets are based only on simulation. The characteristics provided for the –F speed grade are subject to change after establishing FPGA
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CAT16-LV4F12
Abstract: PAC10 RAM512X18
Text: 2 – ProASIC3E DC and Switching Characteristics General Specifications DC and switching characteristics for –F speed grade targets are based only on simulation. The characteristics provided for the –F speed grade are subject to change after establishing FPGA
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D25000
Abstract: PCI Express x1 SMT Receptacle
Text: Datasheet Page 1 of 2 Register INDUSTRIES CONTACT US Product Type NEWS & EVENTS ABOUT US INVESTORS Search: Product Name Login CAREERS Enter Part No. or Keyword All Site Content Go Cross-Reference Home Products I/O Connectors Datasheet Switch Language English
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PS-45499-002
SD-74150-001
D25000
PCI Express x1 SMT Receptacle
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A3P060
Abstract: A3P1000 A3P125 A3P250 PAC10
Text: Automotive ProASIC3 DC and Switching Characteristics 2 – Automotive ProASIC3 DC and Switching Characteristics General Specifications Operating Conditions Stresses beyond those listed in Table 2-1 may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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GTL33
Abstract: CAT16-LV4F12 PAC10 JESD8-12A
Text: 2 – IGLOOe DC and Switching Characteristics General Specifications DC and switching characteristics for –F speed grade targets are based only on simulation. The characteristics provided for the –F speed grade are subject to change after establishing FPGA
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GTL33
Abstract: RT3PE600L CAT16-LV4F12 PAC10 RT3PE3000L
Text: 2 – Radiation-Tolerant ProASIC3 DC and Switching Characteristics General Specifications Operating Conditions Stresses beyond those listed in Table 2-1 may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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A3PE600L
Abstract: PAC10 A3P1000 A3PE3000L PQ208
Text: 2 – Military ProASIC3/EL DC and Switching Characteristics General Specifications Operating Conditions Stresses beyond those listed in Table 2-1 may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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AGL015
Abstract: AGL400 PAC10
Text: 2 – IGLOO DC and Switching Characteristics General Specifications DC and switching characteristics for –F speed grade targets are based only on simulation. The characteristics provided for the –F speed grade are subject to change after establishing FPGA
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PAC10
Abstract: No abstract text available
Text: 2 – IGLOOe DC and Switching Characteristics General Specifications Operating Conditions Stresses beyond those listed in Table 2-1 may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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AGL1000-FG484
Abstract: AGL400
Text: 2 – IGLOO DC and Switching Characteristics General Specifications Operating Conditions Stresses beyond those listed in Table 2-1 may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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A3PE3000L
Abstract: PAC10
Text: 2 – ProASIC3L DC and Switching Characteristics General Specifications Operating Conditions Stresses beyond those listed in Table 2-1 may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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Untitled
Abstract: No abstract text available
Text: TS-S12D161A November, 2012 10Gb/s XFP Optical Transceiver Module SXP3104EX-M 10GBASE-ER/EW, 1550nm EML, PIN-PD Features Æ 10Gb/s Serial Optical Interface Æ High quality and reliability optical device and sub-assemblies Æ 1550nm EML for up to 40km over single mode
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TS-S12D161A
10Gb/s
SXP3104EX-M
10GBASE-ER/EW,
1550nm
1550nm
SXP3104
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Untitled
Abstract: No abstract text available
Text: TS-S12D087A July, 2012 10Gb/s XFP Optical Transceiver Module SXP3104SV-W IR-2/S-64.2b, 10GBASE-ER/EW, 1550nm EML, PIN-PD Features Æ 10Gb/s Serial Optical Interface Æ High quality and reliability optical device and sub-assemblies Æ 1550nm EML laser for up to 40km over single
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TS-S12D087A
10Gb/s
SXP3104SV-W
IR-2/S-64
10GBASE-ER/EW,
1550nm
1550nm
SXP3104
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ProASIC3 A3P250
Abstract: A3P600 A3P030 A3P060 A3P1000 A3P125 A3P250 A3P400 PAC10
Text: 2 – ProASIC3 DC and Switching Characteristics General Specifications Operating Conditions Stresses beyond those listed in Table 2-1 may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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A3P030
Abstract: A3P060 A3P1000 A3P125 A3P250 A3P400 A3P600 PAC10 NET 1672
Text: 2 – ProASIC3 DC and Switching Characteristics General Specifications DC and switching characteristics for –F speed grade targets are based only on simulation. The characteristics provided for the –F speed grade are subject to change after establishing FPGA
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SXP3101SV-03-M
Abstract: SXP3101SV
Text: TS-S12D029B July, 2012 10Gb/s XFP Optical Transceiver Module SXP3104SV IR-2/S-64.2b, 10GBASE-ER/EW, 1550nm EML, PIN-PD Features Æ 10Gb/s Serial Optical Interface Æ High quality and reliability optical device and sub-assemblies Æ 1550nm N PA JA EML laser for up to 40km over single
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TS-S12D029B
10Gb/s
SXP3104SV
IR-2/S-64
10GBASE-ER/EW,
1550nm
1550nm
SXP3104
SXP3101SV-03-M
SXP3101SV
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FBGA 896
Abstract: AX125 AX2000 CS180 IDTQS32X2384 Silicon Sculptor II Axcelerator Family FPGAs
Text: Axcelerator Family FPGAs Detailed Specifications Operating Conditions Table 2-1 lists the absolute maximum ratings of Axcelerator devices. Stresses beyond the ratings may cause permanent damage to the device. Exposure to Absolute Maximum rated conditions for extended periods may affect device
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18-channel
FBGA 896
AX125
AX2000
CS180
IDTQS32X2384
Silicon Sculptor II
Axcelerator Family FPGAs
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AX125
Abstract: AX2000 CS180 IDTQS32X2384 Silicon Sculptor II Axcelerator FPGAs Axcelerator Family FPGAs
Text: Axcelerator Family FPGAs Detailed Specifications Operating Conditions Table 2-1 lists the absolute maximum ratings of Axcelerator devices. Stresses beyond the ratings may cause permanent damage to the device. Exposure to Absolute Maximum rated conditions for extended periods may affect device
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18-channel
AX125
AX2000
CS180
IDTQS32X2384
Silicon Sculptor II
Axcelerator FPGAs
Axcelerator Family FPGAs
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RT3PE3000L
Abstract: LG484 RT3PE600L fpga radiation AES-128 CQ256 PAC10
Text: Advance v0.2 Radiation-Tolerant ProASIC3 Low-Power SpaceFlight Flash FPGAs with Flash*Freeze Technology Features and Benefits • High-Performance, Low-Skew Global Network • Architecture Supports Ultra-High Utilization MIL-STD-883 Class B Qualified Packaging
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MIL-STD-883
RT3PE3000L
LG484
RT3PE600L
fpga radiation
AES-128
CQ256
PAC10
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RT3PE3000L CQ256
Abstract: CG484 RT3PE3000L LG484 CCGA CCGA 472 CCGA 472 mechanical drawing RT3PE600L IO30PDB1V1 IO283PDB7V1
Text: Revision 5 Radiation-Tolerant ProASIC3 Low Power Spaceflight Flash FPGAs with Flash*Freeze Technology Features and Benefits MIL-STD-883 Class B Qualified Packaging • Ceramic Column Grid Array with Six Sigma Copper-Wrapped Lead-Tin Columns • Land Grid Array
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MIL-STD-883
RT3PE3000L CQ256
CG484
RT3PE3000L
LG484
CCGA
CCGA 472
CCGA 472 mechanical drawing
RT3PE600L
IO30PDB1V1
IO283PDB7V1
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FG256
Abstract: FG324 FG484 FG676 M1A3PE3000 PQ208 A3PE600
Text: v1.1 ProASIC3E Flash Family FPGAs with Optional Soft ARM® Support Features and Benefits High Capacity • 600 k to 3 Million System Gates • 108 to 504 kbits of True Dual-Port SRAM • Up to 620 User I/Os Reprogrammable Flash Technology • • • •
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130-nm,
64-Bit
128-Bit
FG256
FG324
FG484
FG676
M1A3PE3000
PQ208
A3PE600
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RT3PE600L
Abstract: RT3PE3000L AES-128 PAC10 LG484 ProASICPLUS Flash Family FPGAs Advanced v0.1
Text: Advance v0.1 Radiation-Tolerant ProASIC3 Low-Power SpaceFlight Flash FPGAs with Flash*Freeze Technology Features and Benefits • High-Performance, Low-Skew Global Network • Architecture Supports Ultra-High Utilization MIL-STD-883 Class B Qualified Packaging
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MIL-STD-883
RT3PE600L
RT3PE3000L
AES-128
PAC10
LG484
ProASICPLUS Flash Family FPGAs Advanced v0.1
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