Untitled
Abstract: No abstract text available
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
130-nm
21x21mm,
400-Ball,
10-Gbps
3ae-2002
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Untitled
Abstract: No abstract text available
Text: TDP www.vishay.com Vishay Dale Thin Film Molded, Dual-In-Line Thin Film Resistor, Through Hole Network FEATURES Actual Size Vishay Dale Thin Film offers two standard circuits in a 14 pins and 16 pins molded dual-in-line over a 100 to 100 k resistance range. The networks feature ratio
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2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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TDP1603
Abstract: TDP1403
Text: TDP Vishay Thin Film Molded, Dual-In-Line Resistor, Through Hole Network FEATURES Actual Size Vishay Thin Film offers two standard circuits in a 14 pins and 16 pins molded dual-in-line over a 100 Ω to 100 kΩ resistance range. The networks feature ratio tolerance to
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2002/95/EC
18-Jul-08
TDP1603
TDP1403
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1601 resistor dale
Abstract: TDP-1401
Text: TDP www.vishay.com Vishay Dale Thin Film Molded, Dual-In-Line Thin Film Resistor, Through Hole Network FEATURES Actual Size Vishay Dale Thin Film offers two standard circuits in a 14 pins and 16 pins molded dual-in-line over a 100 to 100 k resistance range. The networks feature ratio
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2002/95/EC
11-Mar-11
1601 resistor dale
TDP-1401
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net eN8
Abstract: TDN01 crpa 8B10B P802 TLK3118 XGXS quad video processor
Text: TLK3118 Redundant XAUI Transceiver www.ti.com SLLS628C – DECEMBER 2004 – REVISED APRIL 2007 • • • • • • • • • • • Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0)
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TLK3118
SLLS628C
21x21mm,
400-Ball,
10-Gbps
3ae-2002
net eN8
TDN01
crpa
8B10B
P802
TLK3118
XGXS
quad video processor
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K297
Abstract: net eN8 TDN01
Text: TLK3118 Redundant XAUI Transceiver www.ti.com SLLS628C – DECEMBER 2004 – REVISED APRIL 2007 • • • • • • • • • • • Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0)
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TLK3118
SLLS628C
10-Gbps
3ae-2002
K297
net eN8
TDN01
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Untitled
Abstract: No abstract text available
Text: TDP www.vishay.com Vishay Dale Thin Film Molded, Dual-In-Line Thin Film Resistor, Through Hole Network FEATURES Actual Size Vishay Dale Thin Film offers two standard circuits in a 14 pins and 16 pins molded dual-in-line over a 100 to 100 k resistance range. The networks feature ratio
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Original
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PDF
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2002/95/EC
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
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8B10B
Abstract: P802 TLK3118 RXD17
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
130-nm
21x21mm,
400-Ball,
10-Gbps
3ae-2002
8B10B
P802
TLK3118
RXD17
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prbs parity checker and generator
Abstract: No abstract text available
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
SLLS628
10-Gbps
3ae-2002
prbs parity checker and generator
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tdp1603
Abstract: TDP1403 tdp1603 1002 TDPT
Text: TDP Vishay Thin Film Molded, Dual-In-Line Resistor Networks FEATURES • Lead Pb -free available • Standard Rugged, molded case construction (14 and 16 Pin) • Highly stable thin film (500 ppm at + 70 °C at 2000 hrs.) • Low temperature coefficient (± 25 ppm/°C)
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TDP01
08-Apr-05
tdp1603
TDP1403
tdp1603 1002
TDPT
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TTP-111V
Abstract: TTA-111AVT TTA-111AVR TTA-111AV rj45 female TDP414V TDP016 bnc male to rj45 TTP-444V TTP-414VD
Text: Passive Series Twisted Pair Transmission Active Series Twisted Pair Transmission Smart twisted pair transmission products are designed for CCTV signal transmission over unshielded twisted pair wire CAT 5 network cable . These smart cabling system transmission are an alternative solution to coaxial and fiber based systems,
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TTP-414V
TTP-414VH
TTP-414VD
TTP-444V
TTP-444VPD
RS422,
RS485
RJ-45
TDP414V
TDP111VRH
TTP-111V
TTA-111AVT
TTA-111AVR
TTA-111AV
rj45 female
TDP414V
TDP016
bnc male to rj45
TTP-444V
TTP-414VD
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tdp1603
Abstract: No abstract text available
Text: TDP Vishay Thin Film Molded, Dual-In-Line Resistor, Through Hole Network FEATURES Actual Size Vishay Thin Film offers two standard circuits in a 14 pins and 16 pins molded dual-in-line over a 100 Ω to 100 kΩ resistance range. The networks feature ratio tolerance to
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2002/95/EC
TDP01
TDP03
11-Mar-11
tdp1603
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TDP1603
Abstract: No abstract text available
Text: TDP Vishay Thin Film Molded, Dual-In-Line Resistor Networks FEATURES • Lead Pb -free available • Standard Rugged, molded case construction (14 and 16 Pin) • Highly stable thin film (500 ppm at + 70 °C at 2000 hours) • Low temperature coefficient (± 25 ppm/°C)
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TDP01
TDP03
18-Jul-08
TDP1603
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TDP1603
Abstract: No abstract text available
Text: TDP Vishay Thin Film Molded, Dual-In-Line Resistor Networks FEATURES • Standard Rugged, molded case construction 14 and 16 Pin • Highly stable thin film • Low temperature coefficient ± 25ppm/°C • Compatible with automatic insertion equipment Actual Size
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25ppm/
TDP01
TDP03
TDP-1401
TDP-1601
TDP-1403
TDP-1603
TDP1401
TDP16013
TDP14031001F:
TDP1603
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TDN01
Abstract: TDP01/TDN01 net eN8 acq2 RDN01 130nm CMOS
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
SLLS628B
10-Gbps
3ae-2002
TDN01
TDP01/TDN01
net eN8
acq2
RDN01
130nm CMOS
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Untitled
Abstract: No abstract text available
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
130-nm
21x21mm,
400-Ball,
10-Gbps
3ae-2002
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TDP01/TDN01
Abstract: TDN21 XAUI 8B10B P802 TLK3118 c20d10
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
130-nm
21x21mm,
400-Ball,
10-Gbps
3ae-2002
TDP01/TDN01
TDN21
XAUI
8B10B
P802
TLK3118
c20d10
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tdp1603
Abstract: TDP1403
Text: TDP Vishay Thin Film Molded, Dual-In-Line Resistor Networks FEATURES • Lead Pb -free available • Standard Rugged, molded case construction (14 and 16 Pin) • Highly stable thin film (500 ppm at + 70 °C at 2000 hours) • Low temperature coefficient (± 25 ppm/°C)
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TDP01
18-Jul-08
tdp1603
TDP1403
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TDP1403
Abstract: TDP1603 TDP-1403
Text: P R E C I S I O N T H I N F I L M T E C H N O L O G Y Molded, Dual-In-Line Resistor Networks TDP Series FEATURES • Standard Rugged, molded case construction 14 and 16 Pin • Highly stable thin film • Low temperature coefficient ±25 ppm/°C Actual Size
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TDP01
TDP03
TDP-1401
TDP14031001F:
TDP1403
TDP1603
TDP-1403
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Untitled
Abstract: No abstract text available
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
SLLS628B
10-Gbps
3ae-2002
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Untitled
Abstract: No abstract text available
Text: TDP Vishay Thin Film Molded, Dual-In-Line Resistor Networks FEATURES Actual Size • Lead Pb -Free available • Standard Rugged, molded case construction (14 and 16 Pin) • Highly stable thin film • Low temperature coefficient ± 25ppm/°C • Compatible with automatic insertion equipment
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25ppm/
TDP01
TDP03
TDP-1401
TDP-1601
TDP14031001F:
TDPTXX01XXXXA
12-May-05
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SERDES 10G
Abstract: TDN01
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
SLLS628B
10-Gbps
3ae-2002
SERDES 10G
TDN01
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Untitled
Abstract: No abstract text available
Text: STANDARD PRODUCTS A C O M P A N Y OF OHMTEK Standard Precision Resistor Networks Dual-ln-Line Non-Hermetic ▼ Models: TDP1401 and TDP1601 13 or 15 resistors with one pin common TDP1403 and TDP1603 7 or 8 isolated resistors Features ▲ Rugged, molded case construction
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OCR Scan
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PDF
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TDP1401
TDP1601
TDP1403
TDP1603
TDP01
TDP03
Resista70Â
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Untitled
Abstract: No abstract text available
Text: p R b C I S I N T H I N F I L M T F H M o ld ed , Dual-Hn-Line R e s is to r N e tw o rk s N O L O G v T h in F ilm TOP Series F eatures T H R O U G H HOLE Standard Rugged, molded case construction 14 and 16 Pin Highly stable thin film Low temperature coefficient
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PDF
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LDP14031001F:
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