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    TECHNICAL DS56 Search Results

    TECHNICAL DS56 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DS560MB410ZASR Texas Instruments 56-Gbps, 4-channel redriver with 2x2 crosspoint 101-NFBGA -40 to 85 Visit Texas Instruments
    DS560DF410AMNT Texas Instruments 56 Gbps multi-rate 4-channel retimer with crosspoint 81-FCCSP -40 to 85 Visit Texas Instruments
    DS560MB410ZAST Texas Instruments 56-Gbps, 4-channel redriver with 2x2 crosspoint 101-NFBGA -40 to 85 Visit Texas Instruments
    DS560DF810ALUR Texas Instruments 56-Gbps, eight-channel retimer with 2x2 crosspoint 135-FCCSP -40 to 85 Visit Texas Instruments
    DS560DF810ALUT Texas Instruments 56-Gbps, eight-channel retimer with 2x2 crosspoint 135-FCCSP -40 to 85 Visit Texas Instruments

    TECHNICAL DS56 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    LUXEON Rebel Cyan Green LED

    Abstract: ph01 LUXEON Rebel LED DS56 IEC825 JESD22 PM01 PR01 LED rebel PWN1
    Text: Technical Datasheet DS56 power light source LUXEON Rebel Introduction LUXEON® Rebel is an ultra compact, surface mount, high power LED that delivers elevated standards for light output, flux density and manufacturability. Offering industry leading flux density, lumens per


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    Technical DS56

    Abstract: DS56 JESD22 PH01 PM01 PR01
    Text: Technical Datasheet DS56 power light source LUXEON Rebel Introduction LUXEON® Rebel is an ultra compact, surface mount, high power LED that delivers elevated standards for light output, flux density and manufacturability. Offering industry leading flux density, lumens per


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    LUXEON Rebel LED

    Abstract: LUXEON Rebel Cyan Green LED Technical Datasheet DS56 Aluminum Base 3 LED emitters PCB luxeon Rebel PC Amber pulse 0030 DS56 IEC825 JESD22 PH01
    Text: Technical Datasheet DS56 power light source LUXEON Rebel Introduction LUXEON® Rebel is an ultra compact, surface mount, high power LED that delivers elevated standards for light output, flux density and manufacturability. Offering industry leading flux density, lumens per


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    ML610Q431

    Abstract: ML8511 t3d6 diode 8002 AUDIO amplifier diode t2d7 5 t2d7 diode Q431 L610Q43 t3d7 diode ML610Q432
    Text: FEUL610Q431-01 ML610Q431/ML610Q432 User’s Manual Issue Date: July 5, 2010 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date.


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    PDF FEUL610Q431-01 ML610Q431/ML610Q432 30kHz 36kHz: 625kHz: ML610Q431/ML610Q432 ML610Q431 ML8511 t3d6 diode 8002 AUDIO amplifier diode t2d7 5 t2d7 diode Q431 L610Q43 t3d7 diode ML610Q432

    ml8511

    Abstract: t3d6 diode ML610Q421 ML610Q421 user manual 7447 3 TO 8 DECODER IC filter adaptor connector 61pin SAR01 0f653 diode t2d7 FEUL610Q421-03
    Text: FEUL610Q421-03 ML610Q421/ML610Q422 User’s Manual Issue Date: May 27, 2010 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date.


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    PDF FEUL610Q421-03 ML610Q421/ML610Q422 oper-13, FEUL610Q421-02 ml8511 t3d6 diode ML610Q421 ML610Q421 user manual 7447 3 TO 8 DECODER IC filter adaptor connector 61pin SAR01 0f653 diode t2d7 FEUL610Q421-03

    nx-U8 assembler

    Abstract: No abstract text available
    Text: PEUL610Q431-06 Preliminary ML610Q431/ML610Q432 User’s Manual Issue Date: Feburary 26, 2009 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date.


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    PDF PEUL610Q431-06 ML610Q431/ML610Q432 nx-U8 assembler

    1K30A

    Abstract: K1N5
    Text: Technical Data DSP56301/D Rev. 5, 1/2002 24-Bit Digital Signal Processor 52 6 6 3 Memory Expansion Area Triple Timer Host Interface ESSI X Data Program RAM RAM 4096 x 24 bits 2048 × 24 bits Default (Default) SCI Y Data RAM 2048 × 24 bits (Default) Peripheral


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    PDF DSP56301/D 24-Bit DSP56301 DSP56300 32-Bit 208-lead SPAKDSP301PW100 1K30A K1N5

    DIM800NSM33-F000

    Abstract: DIM800NSM33-F
    Text: DIM800NSM33-F000 Single Switch IGBT Module Replaces DS5615-6 DS5615-7 September 2012 LN29760 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)


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    PDF DIM800NSM33-F000 DS5615-6 DS5615-7 LN29760) DIM800NSM33-F000 DIM800NSM33-F

    Untitled

    Abstract: No abstract text available
    Text: DIM800NSM33-F000 Single Switch IGBT Module Replaces DS5615-6 DS5615-7 September 2012 LN29760 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)


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    PDF DIM800NSM33-F000 DS5615-6 DS5615-7 LN29760)

    DIM800NSM33-F000

    Abstract: chop ds5615
    Text: DIM800NSM33-F000 Single Switch IGBT Module Replaces DS5615-5 DS5615-6 October 2011 LN28810 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)


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    PDF DIM800NSM33-F000 DS5615-5 DS5615-6 LN28810) DIM800NSM33-F000 chop ds5615

    DIM200PHM33-F000

    Abstract: DIM200PHM33-F
    Text: DIM200PHM33-F000 Half Bridge IGBT Module Replaces DS5606-4 DS5606-5 October 2011 LN28814 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)


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    PDF DIM200PHM33-F000 DS5606-4 DS5606-5 LN28814) DIM200PHM33-F000 DIM200PHM33-F

    Untitled

    Abstract: No abstract text available
    Text: DIM200PHM33-F000 Half Bridge IGBT Module Replaces DS5606-4 DS5606-5 October 2011 LN28814 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)


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    PDF DIM200PHM33-F000 DS5606-4 DS5606-5 LN28814)

    DIM600BSS17-A000

    Abstract: DIM600BSS17 dim600bss
    Text: DIM600BSS17-A000 Single Switch IGBT Module Replaces DS5695-1.4 DS5695-2 October 2010 LN27625 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  Non Punch Through Silicon  Isolated Cu Base with Al2O3 Substrates VCES VCE(sat) * (typ) IC (max)


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    PDF DIM600BSS17-A000 DS5695-1 DS5695-2 LN27625) DIM600BSS17-A000 DIM600BSS17 dim600bss

    DIM400GDM33-F000

    Abstract: DIM400GDM33-F
    Text: DIM400GDM33-F000 Dual Switch IGBT Module Replaces DS5616-2.1 DS5616-3 February 2014 LN31315 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)


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    PDF DIM400GDM33-F000 DS5616-2 DS5616-3 LN31315) DIM400GDM33-F000 DIM400GDM33-F

    DFM1200FXS12-A000

    Abstract: DFM1200FXS12-A fast recovery diode 600v 1200A mj 13005
    Text: DFM1200FXS12-A000 Fast Recovery Diode Module Replaces DS5645-1.1 FEATURES Low Reverse Recovery Charge High Switching Speed Low Forward Volt Drop DS5845-2 April 2010 LN26743 KEY PARAMETERS VRRM VF IF IFM 1200V 1.9V 1200A 2400A (typ) (max) (max) Isolated Cu Base with Al2O3 Substrates


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    PDF DFM1200FXS12-A000 DS5645-1 DS5845-2 LN26743) DFM1200FXS12-A000 DFM1200FXS12-A fast recovery diode 600v 1200A mj 13005

    Untitled

    Abstract: No abstract text available
    Text: DFM1200FXS12-A000 Fast Recovery Diode Module Replaces DS5645-1.1 FEATURES Low Reverse Recovery Charge High Switching Speed Low Forward Volt Drop DS5845-2 April 2010 LN26743 KEY PARAMETERS VRRM VF IF IFM 1200V 1.9V 1200A 2400A (typ) (max) (max) Isolated Cu Base with Al2O3 Substrates


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    PDF DFM1200FXS12-A000 DS5645-1 DS5845-2 LN26743) DFM1200FXS12-A000

    DFM1200FXS12-A000

    Abstract: No abstract text available
    Text: DFM1200FXS12-A000 Fast Recovery Diode Module DS5645-1.1 June 2007 LN25322 FEATURES • Low Reverse Recovery Charge • High Switching Speed • Low Forward Voltage Drop • Isolated Copper Base plate • Dual Diodes Can be paralleled for 2400A Rating •


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    PDF DFM1200FXS12-A000 DS5645-1 LN25322) DFM1200FXS12-A000

    mii to hdlc

    Abstract: MT92210 LAN switch with HDLC
    Text: MT92210 Carrier Class VoIP Processor Advance Datasheet DS5660 Introduction ISSUE 1.0 December 2001 Features The MT92210 is an assembly and disassembly engine that can convert up to 1023 full-duplex TDM voice channels to IP packets and back, according to the H.225 standard. The device communicates via


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    PDF MT92210 DS5660 MT92210 16-bit mii to hdlc LAN switch with HDLC

    DCR5980A18

    Abstract: DCR5980A12 DCR5980A14 DCR5980A16
    Text: DCR5980A18 Phase Control Thyristor DS5649 1.1 January 2007 LN25138 FEATURES KEY PARAMETERS • Double Side Cooling • High Surge Capability • Low Inductance Internal Construction VDRM IT(AV) ITSM dV/dt* dI/dt 1800V 5985A 98000A 1000V/µs 250A/µs APPLICATIONS


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    PDF DCR5980A18 DS5649 LN25138) 8000A DCR5980A16 DCR5980A14 DCR5980A12 500mA, DCR5980A18 DCR5980A12 DCR5980A14 DCR5980A16

    Untitled

    Abstract: No abstract text available
    Text: MT92210 Carrier Class VoIP Processor Advance Datasheet DS5660 Introduction ISSUE 1.0 December 2001 Features The MT92210 is an assembly and disassembly engine that can convert up to 1023 full-duplex TDM voice channels to IP packets and back, according to the H.225 standard. The device communicates via


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    PDF MT92210 DS5660 MT92210 16-bit

    half bridge circuit diagram

    Abstract: No abstract text available
    Text: DIM100CHS12-H000 DIM100CHS12-H000 Fast Half Bridge IGBT Module Target Infomation DS5632-1.3 August 2003 FEATURES • Non Punch Through Silicon ■ 10µs Short Circuit Withstand ■ fsw for Applications > 20kHz ■ Isolated Copper Baseplate KEY PARAMETERS VCES


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    PDF DIM100CHS12-H000 DS5632-1 20kHz DIM100CHS12-H000 half bridge circuit diagram

    IC LM 2003

    Abstract: No abstract text available
    Text: DIM500BSS12-H000 DIM500BSS12-H000 Fast Single Switch IGBT Module Target Infomation DS5643-2.0 September 2003 FEATURES • Non Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated Copper Baseplate KEY PARAMETERS VCES typ VCE(sat) † (max)


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    PDF DIM500BSS12-H000 DS5643-2 20kHz DIM500BSS12-H000 IC LM 2003

    hep 154 silicon diode

    Abstract: zy 406 transistor motorola HEP 801 hep 154 diode hep R1751 triac zd 607 2sb337 RS5743.3 F82Z hep 230 pnp
    Text: SEMICONDUCTOR This guide has been prepared by the Motorola HEP technical staff to provide a cross-reference for the Hobbyist, Experimenter, and Profes­ sional service technician. The information contained herein is based on an analysis of the published specifications of each device listed. This


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    PDF MY110B Z0206 Z0208 Z0210 Z0211 Z0212 Z0214 Z0215 Z0217 Z0219 hep 154 silicon diode zy 406 transistor motorola HEP 801 hep 154 diode hep R1751 triac zd 607 2sb337 RS5743.3 F82Z hep 230 pnp

    HEDS 7501

    Abstract: HEDS-5500 a6 Encoder HED_ 5540 HEDS-5500 HP PLC6 a ma heel ne HEDS 99 Series
    Text: TfiM HEWLETT mL'KMPACKARD Q uick Assem bly Two and Three Channel O ptical E ncoders Technical Data F e a tu re s • Two Channel Quadrature Output with Optional Index Pulse • Quick and Easy Assembly • No Signal Adjustment Required • External Mounting Ears


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    PDF HEDS-5500/5540 HEDS-5600/5640 EDM-5500/5600 HEDS-5500/5600 HEDM-5500/ HEDS-5540 HEDS-8910 HEDM-550X/560X 5091-7286E HEDS 7501 HEDS-5500 a6 Encoder HED_ 5540 HEDS-5500 HP PLC6 a ma heel ne HEDS 99 Series