68692-212HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 12 Positions, 2.54 mm (0.100in) Pitch. |
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68692-210HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch. |
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68692-214H
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch. |
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68692-214HLF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch. |
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MSP430FR69221IG56
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Texas Instruments
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MSP430FR69221 16 MHz Ultra-Low-Power MCU featuring 64 KB FRAM, 2 KB SRAM, 52 IO, ADC12, LCD, AES 56-TSSOP -40 to 85 |
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