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    TF-2-69221-S Search Results

    TF-2-69221-S Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    68692-212HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 12 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    68692-210HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    68692-214H Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    68692-214HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    MSP430FR69221IG56 Texas Instruments MSP430FR69221 16 MHz Ultra-Low-Power MCU featuring 64 KB FRAM, 2 KB SRAM, 52 IO, ADC12, LCD, AES 56-TSSOP -40 to 85 Visit Texas Instruments