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    TFA9981UK Search Results

    TFA9981UK Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    TFA9981UK NXP Semiconductors Wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm Original PDF

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    Abstract: No abstract text available
    Text: Package outline WLCSP9: wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm A B D TFA9981UK bump A1 index area A2 E A A1 detail X e1 e ∅v ∅w b C C A B C y C e e2 B A bump A1 index area 1 2 3 X 0.5 Dimensions Unit mm max nom min 1 mm scale A 0.6


    Original     		PDF TFA9981UK tfa9981uk