TFBGA180
Abstract: 12MHz oscillator LPC2364 LPC2368 LPC2458 LPC2468 TFBGA100 TFBGA208 Future Designs
Text: SAB-TFBGAxxx SAB-TFBGAxxx Socket Adapter Boards for USB-ICP-LPC2K The SAB-TFBGAxxx Socket Adapter Boards extend the capability of our popular USB In-Circuit Programmer for NXP Semiconductors LPC2xx devices to allow the user to program and test these devices outside of their
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TFBGA100,
TFBGA180
TFBGA208.
12MHz
SAB-TFBGA180
SAB-TFBGA100
SAB-TFBGA208
30-day
TFBGA180
12MHz oscillator
LPC2364
LPC2368
LPC2458
LPC2468
TFBGA100
TFBGA208
Future Designs
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT746-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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TFBGA64
OT746-1
OT746-1
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA100 package SOT598-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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TFBGA100
OT598-1
OT598-1
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 4 x 4 x 0.8 mm A B D SOT969-1 ball A1 index area E A A2 A1 detail X e1 1/2 e ∅v ∅w b e C C A B C M M y y1 C H G F e E e2 D C 1/2 e B A ball A1 index area 1 2 3 4 5 6 7 8
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TFBGA64:
OT969-1
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Untitled
Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT962-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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TFBGA64
OT962-1
OT962-1
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Untitled
Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA56 package SOT911-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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TFBGA56
OT911-1
OT911-1
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm B D SOT950-1 A ball A1 index area E A A2 A1 detail X e1 ∅v ∅w b e M M C C A B C y y1 C U T R P N M L K J H G F E D C B A e e2 ball A1 index area
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TFBGA208:
OT950-1
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Untitled
Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT1073-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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TFBGA64
OT1073-1
OT1073-1
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Untitled
Abstract: No abstract text available
Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10
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MBL179
BGA156
OT472-1
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA316
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls A B D SOT999-1 ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b W V U T R P N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9
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TFBGA256:
OT999-1
MO-195
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA144 package SOT569-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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TFBGA144
OT569-1
OT569-1
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PU86
Abstract: No abstract text available
Text: QuickLogic PolarPro Device Data Sheet — 86-Pin TFBGA QL1P100 •••••• Combining Low Power, Performance, Density, and Embedded RAM • Quadrant-based segmentable clock networks Device Highlights 16 quad clock networks per device Low Power Programmable Logic
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86-Pin
QL1P100
PU86
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA112: plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.8 mm D SOT630-1 A B ball A1 index area A A2 E A1 detail X C e1 e y1 C ∅v M C A B b 1/2 e y ∅w M C M L K e J H G e2 F E 1/2 e D C B A ball A1 index area
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TFBGA112:
OT630-1
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TFBGA-296
Abstract: No abstract text available
Text: Package outline TFBGA296: plastic thin low profile fine-pitch ball grid array package; 296 balls A B D SOT1107-1 ball A1 index area E A2 A A1 detail X e1 e Y V T P M K H F D B 1/2 e ∅v ∅w b M M C C A B C y1 C y W U R e N L e2 J 1/2 e G E C A ball A1 index area
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TFBGA296:
OT1107-1
TFBGA-296
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA240: plastic thin fine-pitch ball grid array package; 240 balls; body 12 x 12 x 0.7 mm D B SOT868-1 A ball A1 index area A E A2 A1 detail X C e1 ∅v ∅w b e M M y y1 C C A B C U T R P N e M L K e2 J H G F E D C B A ball A1 index area
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TFBGA240:
OT868-1
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA160: plastic thin fine-pitch ball grid array package; 160 balls; body 9 x 13 x 0.8 mm D B SOT802-1 A ball A1 index area E A2 A A1 detail X C e1 e ∅v M C A B b y y1 C ∅w M C 1/2e V U T R e P N M L K J H G F E D C B A ball A1 index area
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TFBGA160:
OT802-1
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA128: plastic thin fine-pitch ball grid array package; 128 balls; body 9 x 9 x 0.8 mm D B SOT857-1 A ball A1 index area E A A2 A1 C e1 e T detail X 1/2 e ∅v ∅w b M M y y1 C C A B C R P e N M L K J H G F E D C B A e2 1/2 e ball A1 index area
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TFBGA128:
OT857-1
MO-195
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA84: plastic thin fine-pitch ball grid array package; 84 balls; body 7 x 7 x 0.8 mm B D SOT904-1 A ball A1 index area A E A2 A1 detail X e1 ∅v ∅w b e C M M C A B C y y1 C N M L e K J H e2 G F E D C B A ball A1 index area 1 2 3 4 5 6
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TFBGA84:
OT904-1
MO-195
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Untitled
Abstract: No abstract text available
Text: P-TFBGA48-0608-0.75BZ Uniti mm Jan.2004
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OCR Scan
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P-TFBGA48-0608-0
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Untitled
Abstract: No abstract text available
Text: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA280: plastic thin fine-pitch ball grid array package; 280 balls; body 16 x 16 x 0.8 mm D SOT601-1 B D1 A ball A1 index area A2 A E1 E A1 detail X C e1 V ∅v M C A B b e y1 C y ∅w M C W U T e R
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TFBGA280:
OT601-1
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P-TFBGA224-1218-0
Abstract: 121-80
Text: P-TFBGA224~lgl8-0,80BZ Uniti nn CO o cu Ö 18, 0 MO. 20ISIBH + INDEX - jo l O . 1 5 1 jH //|0 . 10 E l h q io . io is I o +1 n •m le i 00, INDEX *0,2 A in ö 1 2 3 4 5 6 7 8 9 10 11 12 13 14 B C D E F 08 M STÄBl °' 45±0, G H J K L M N 05 H H R T U V
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OCR Scan
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P-TFBGA224-1218-0
10ISI
2006QQOOOOOOO
121-80
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d811
Abstract: No abstract text available
Text: P-TFBGA48-0811-0.75BZ Uniti mm May 2004
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OCR Scan
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P-TFBGA48-0811-0
d811
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PDF
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Untitled
Abstract: No abstract text available
Text: U n it nn Feb,2005
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OCR Scan
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0-eifrI-00IVDEJl-dï
0-eifrI-00IVDEJl-d
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Untitled
Abstract: No abstract text available
Text: LY62L51316 512K X 16 BIT LOW POWER CMOS SRAM Rev. 1.1 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Description Initial Issue Revised 48-ball 6mm x 8mm TFBGA Package Outline Dimension Lyontek Inc. reserves the rights to change the specifications and products without notice.
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LY62L51316
48-ball
LY62L51316
608-bit
48-pin
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