Untitled
Abstract: No abstract text available
Text: TgardTM 200 Series Thermally Conductive Insulators HIGH PERFORMANCE THERMAL INTERFACE PRODUCTS The Tgard 200 is a high performance interface pad. Consisting of a silicone/boron nitride composite, these fiberglass-reinforced pads are used when the lowest thermal resistance and highest dielectric
|
Original
|
PDF
|
A13514-00
|
a13514
Abstract: D149 D150 D2240 D257 D412 E595
Text: TgardTM 200 Series Thermally Conductive Insulators Innovative Technology for a Connected World High Performance Thermal Interface Products The Tgard 200 is a high performance interface pad. Consisting of a silicone/boron nitride composite, these fiberglass-reinforced pads are used when the lowest thermal resistance and highest dielectric
|
Original
|
PDF
|
A13514-00
a13514
D149
D150
D2240
D257
D412
E595
|
a13514
Abstract: D149 D150 D2240 D257 D412 E595 ASTM D2240, D412 ASTM-D257 Dielectric Constant Silicon Nitride
Text: T-gardTM 200 Series global solutions : local support TM T-gard 200 Series Features and Benefits: High Performance Thermal Interface Products • High thermal Conductivity of 5.0 W/mK The T-gard™ 200 is a high performance interface pad. Consisting of silicon/
|
Original
|
PDF
|
|
ASTM D2240, D412
Abstract: A1556 D149 D150 D2240 D257 D412 E595 A15561-00
Text: T-gardTM 200 Series Thermally Conductive Insulators Innovative Technology for a Connected World High Performance Thermal Interface Products The T-gard 200 is a high performance interface pad. Consisting of silicon/boron composites, these fiberglass-reinforced pads are used when the lowest thermal resistance and highest dielectric strength
|
Original
|
PDF
|
A15561-00
ASTM D2240, D412
A1556
D149
D150
D2240
D257
D412
E595
|