WESTINGHOUSE transistor
Abstract: Westinghouse CO 8 westinghouse relay westinghouse transistors westinghouse semiconductor westinghouse power transistor 2N2761 2N2771 2N2770 westinghouse
Text: Westinghouse Therm al Characteristics Thermal resistance, 0 jc , #C /w a tt, max. .0.5 Power dissipation, P j at T c = 7 5 °C w atts, max. 200 Typical thermal drop, case to heat sink, ° C /w a tt.0.3
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2N2757-78+
30-ampere
for2N2760,
2N2766,
2N2772
2N2778.
C/2116/DB;
C/2117
WESTINGHOUSE transistor
Westinghouse CO 8
westinghouse relay
westinghouse transistors
westinghouse semiconductor
westinghouse power transistor
2N2761
2N2771
2N2770
westinghouse
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sot23 theta jc value
Abstract: DS18S201-Wire Theta JB 8-Pin TSSOP theta jc value an3930 DS1621 DS1624 TSSOP173 DS1822 DS1825
Text: Maxim > App Notes > 1-Wire DEVICES GENERAL ENGINEERING TOPICS TEMPERATURE SENSORS and THERMAL MANAGEMENT MEASUREMENT CIRCUITS Keywords: Theta JA, Theta JC, theta-ja, theta-jc, self heating, thermal dissipation, heat dissipation, power dissipation, thermal resistance, junction to case, junction to ambient, temperature, sensor, temperature
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DS18B20:
DS18B20-PAR:
DS18S20:
DS18S20-PAR:
DS600:
DS620:
DS75LV:
AN3930,
APP3930,
Appnote3930,
sot23 theta jc value
DS18S201-Wire
Theta JB
8-Pin TSSOP theta jc value
an3930
DS1621
DS1624
TSSOP173
DS1822
DS1825
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Untitled
Abstract: No abstract text available
Text: GBPC 12, 15, 25, 35 SERIES Bridge Rectifiers Glass Passivated Features • Integrally molded heat-sink provided very low thermal resistance for maximum heat dissipation. • Surge Overload Ratings from 300 A to 400 A. • Isolated voltage from case to lead over 2500 V.
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E258596
MIL-STD-202,
GBPC35005W
GBPC35005
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Untitled
Abstract: No abstract text available
Text: GBPC 12, 15, 25, 35 SERIES Bridge Rectifiers Glass Passivated Features • Integrally molded heat-sink provided very low thermal resistance for maximum heat dissipation. • Surge Overload Ratings from 300 A to 400 A. • Isolated voltage from case to lead over 2500 V.
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E258596
MIL-STD-202,
GBPC35005W
GBPC35005
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2K40
Abstract: MIL-R-39009 TAH20
Text: FEATURES • 20 Watt Power Rating at 25°C Case Temperature • High Pulse Tolerant Design • Quick-snap Molded Package • Very Low Inductance Design • Resistor Package Electrically Isolated from Heat Sink • Low Thermal Resistance to Heat Sink @ RTH<6.25°C/W
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TCH35
1-866-9-OHMITE
2K40
MIL-R-39009
TAH20
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Untitled
Abstract: No abstract text available
Text: FEATURES • 20 Watt Power Rating at 25°C Case Temperature • High Pulse Tolerant Design • Quick-snap Molded Package • Very Low Inductance Design • Resistor Package Electrically Isolated from Heat Sink • Low Thermal Resistance to Heat Sink @ RTH<6.25°C/W
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TAH20
100ppm
TCH35
TAH20
1-866-9-OHMITE
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heat sink to220
Abstract: 680 ohms resistor 5 watt datasheet power resistor 0,25 ohms encapsulated 2K40 MIL-R-39009 TAH20
Text: FEATURES • 20 Watt Power Rating at 25°C Case Temperature • High Pulse Tolerant Design • Quick-snap Molded Package • Very Low Inductance Design • Resistor Package Electrically Isolated from Heat Sink • Low Thermal Resistance to Heat Sink @ RTH<6.25°C/W
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TCH35
O-220
1-866-9-OHMITE
heat sink to220
680 ohms resistor 5 watt datasheet
power resistor 0,25 ohms encapsulated
2K40
MIL-R-39009
TAH20
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Untitled
Abstract: No abstract text available
Text: GBPC 12, 15, 25, 35 SERIES Bridge Rectifiers Glass Passivated Features • Integrally molded heat-sink provided very low thermal resistance for maximum heat dissipation. • Surge Overload Ratings from 300 A to 400 A. • Isolated voltage from case to lead over 2500 V.
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E258596
MIL-STD-202,
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TR35
Abstract: TR-35 2R20 MIL-R-39009 tr3502 TR35-02
Text: SYNTON-TECH CORPORATION POWER RESISTORS File No. : Version : Page : Date : TR35-02 A 1/7 2008.01.01 FEATURES z 35 Watt @25℃ Case Temperature Heat Sink Mounted. z TO-220 Style Power Package. z Single Screw Mounting to Heat Sink. z Low Thermal Resistance to Heat Sink @Rth<4.28 ℃/W.
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TR35-02
O-220
TR35
TR-35
2R20
MIL-R-39009
tr3502
TR35-02
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FPIR
Abstract: MINIBRIDGE MPIR 4040 FPIR32 KPIR50 MPIR40 MPIR4040 MPIR 40100 KPIR5005
Text: FPIR32 MPIR40 KPIR50 MINIBRIDGE FAST RECOVERY, 32, 40 and 50 AMPERES INTEGRALLY MOLDED HEAT SINKS PROVIDE VERY LOW THERMAL RESISTANCE This mark indicates recognition under the component program of Underwriters Laboratories, inc. Our unique case construction enables the closer molding of integrated heat sink to the
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FPIR32
MPIR40
KPIR50
FPIR
MINIBRIDGE
MPIR 4040
KPIR50
MPIR4040
MPIR 40100
KPIR5005
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SO10 package
Abstract: 573300D00010G 7106DG MO-184 7109DG 4040 footprint 573400D00010G heat sink 7106D 7109D
Text: SMT Surface mount heat sink for D-PAK TO-252 package semiconductors 80 20 60 15 40 10 Case Temp Rise Rise Above Ambient—°C 20 5 0.0 0.5 1.0 1.5 2.0 Heat Dissipated—Watts 8.00 (0.315) Thermal Resistance From MTG Surface to Ambient—°C/Watt 1000 25
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O-252)
7109D/TRG
573100D00010G
573300D00010G
573400D00010G
SO10 package
573300D00010G
7106DG
MO-184
7109DG
4040 footprint
573400D00010G
heat sink
7106D
7109D
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Untitled
Abstract: No abstract text available
Text: FEATURES SPECIFICATIONS • 85 Watt power rating at 25°C case temperature • Non-inductive performance • Low thermal resistance • RoHS compliant design • Two or three terminals versions available • Heat sink can be grounded through middle terminal P style
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2-10K
100ppm
10-10K:
50ppm
TFH85P2R00JE
TFH85P5R10JE
TFH85P7R50JE
TFH85P10R0JE
TFH85P15R0JE
TFH85P39R0JE
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Untitled
Abstract: No abstract text available
Text: FEATURES SPECIFICATIONS • 85 Watt power rating at 25°C case temperature • Non-inductive performance • Low thermal resistance • RoHS compliant design • Two or three terminals versions available • Heat sink can be grounded through middle terminal P style
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2-10K
100ppm
10-10K:
50ppm
TFH85P2R00JE
TFH85P5R10JE
TFH85P7R50JE
TFH85P10R0JE
TFH85P15R0JE
TFH85P39R0JE
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Untitled
Abstract: No abstract text available
Text: FEATURES SPECIFICATIONS • 70 Watt power rating at 25°C case temperature • Non-inductive performance • Low thermal resistance • RoHS compliant design • Two or three terminals versions available • Heat sink can be grounded through middle terminal P style
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2-10K
100ppm
10-10K:
50ppm
ResisH70M100RJE
TEH70M150RJE
TEH70M270RJE
TEH70M470RJE
TEH70M680RJE
TEH70M750RJE
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2N1016
Abstract: 1LQ1 2N1015 Westinghouse westinghouse transistors westinghouse semiconductor 2N1016E zru 2 2N1015C 2n1016b
Text: W e stin g h o u s e Therm al C h a ra cteristics •Thermal resistance, 0jc» ‘ C/w att, max. Derating factor, W a tts / 'C . *Typical thermal drop, case to heat sink, ° C /w a tt. T O 54-661 Page 1 -u I ru \
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2W1015,
2IM1016
2N1015
2N1016
2N1015B)
2N1016B)
SM40AG02G12
C/2116/DB;
1LQ1
Westinghouse
westinghouse transistors
westinghouse semiconductor
2N1016E
zru 2
2N1015C
2n1016b
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Thick Film
Abstract: No abstract text available
Text: Features Sp e c i f i c a t i o n s • 85 Watt power rating at 25°C case temperature • Non-inductive performance • Low thermal resistance • RoHS compliant design • Two or three terminals versions available • Heat sink can be grounded through middle terminal P style
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2-10K
100ppm
10-10K:
50ppm
2x5P7K50JE
TFH85P10K0JE
TFH85M470RJE
TFH85M1K00JE
TFH85M2K70JE
TFH85M4K70JE
Thick Film
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10R2
Abstract: 400M
Text: Features Sp e c i f i c a t i o n s • 85 Watt power rating at 25°C case temperature • Non-inductive performance • Low thermal resistance • RoHS compliant design • Two or three terminals versions available • Heat sink can be grounded through middle terminal P style
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2-10K
100ppm
10-10K:
50ppm
TFH85P6K80JE
MIL-STD-202,
TFH85P7K50JE
TFH85P10K0JE
TFH85M3R00JE
TFH85M6R80JE
10R2
400M
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Untitled
Abstract: No abstract text available
Text: Features Sp e c i f i c a t i o n s • 85 Watt power rating at 25°C case temperature • Non-inductive performance • Low thermal resistance • RoHS compliant design • Two or three terminals versions available • Heat sink can be grounded through middle terminal P style
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Original
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2-10K
100ppm
10-10K:
50ppm
TFH85M100RJE
TFH85M150RJE
TFH85P2R00JE
TFH85P5R10JE
TFH85P7R50JE
TFH85P10R0JE
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TEH70 Series
Abstract: Thick Film
Text: TEH70 Series 70 Watt TO247 Package Thick Film Power F e a t u r es • 70 Watt power rating at 25°C case temperature • Non-inductive performance • Low thermal resistance • RoHS compliant design • Two or three terminal versions available • Heat sink can be grounded through middle terminal P style
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TEH70
TEH70P1K00JE
TEH70P1K50JE
TEH70P2K00JE
TEH70P5K00JE
TEH70M1K00JE
TEH70M1K50JE
TEH70M2K00JE
TEH70M3K00JE
TEH70M5K00JE
TEH70 Series
Thick Film
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TMS320
Abstract: TX75243
Text: TMS320 DSP Number 91 DESIGNER’S NOTEBOOK TMS320C6x Thermal Design Considerations Contributed by David Bell April 29, 1998 Design Problem Thermal analysis and heat sink selection for the TMS320C6x. Solution Like most high-performance processors, the ‘C6x dissipates some thermal energy during
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TMS320
TMS320C6x
TMS320C6x.
045A-17
TX75243
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lineal
Abstract: 6299B thermalloy to-3
Text: Thermal Management JSA A Thermal Primer Thermal resistance, heat sink to ambient free air Ambient temperature Micrel low dropout (LDO) regulators are very easy to use. Only one external filter capacitor is nec essary for operation, so the electrical design effort is
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300mV-often
lineal
6299B
thermalloy to-3
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In-Sil-8
Abstract: 658-25AB 658-35AB
Text: Using Heat Sinks with Larger CPLDs Introduction Increasing operating frequencies and decreasing sizes of semiconductor devices have made heat dissipation and thermal management an important issue. Both the life expectancy and reliability of a device are inversely proportional to its operating temperature. Therefore, it is essential that the operating temperature of a device is kept within the limits set by the
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32-PIN
Abstract: ADS-117 HS-24 TCA 290
Text: Application Note AN-8 ® Heat Sinks for Data Converters Design engineers constantly look for ways to reduce the effects of high operating temperatures in hybrid data converters Heat sinks provide a proven solution By Joe Coupal, DATEL, Inc. Electrical performance of high precision electronic components, such as hybrid type Data Converters, is very temperature sensitive. These devices generally operate much more
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Untitled
Abstract: No abstract text available
Text: SSR Thermal Considerations One of the major considerations when using a SSR, which cannot be stressed too strongly, is that an effective method of removing heat from the SSR package must be employed. The most common method is to employ a heat sink. SSR’s have a relatively high
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Z-121
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