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    THROUGH-HOLE NETWORK PACKAGING Search Results

    THROUGH-HOLE NETWORK PACKAGING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    NFM15PC755R0G3D Murata Manufacturing Co Ltd Feed Through Capacitor, Visit Murata Manufacturing Co Ltd
    NFM15PC435R0G3D Murata Manufacturing Co Ltd Feed Through Capacitor, Visit Murata Manufacturing Co Ltd
    NFM15PC915R0G3D Murata Manufacturing Co Ltd Feed Through Capacitor, Visit Murata Manufacturing Co Ltd
    TPD4164K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4163K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=1A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation

    THROUGH-HOLE NETWORK PACKAGING Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Through-Hole Network Packaging

    Abstract: No abstract text available
    Text: Through-Hole Network Packaging Vishay Network Packaging NETWORK FILM TUBE PACKAGING SIP C DIP D A B D B Typ. A Typ. PACKAGING CODE MODEL SIZE DIMENSIONS IN INCHES mm LEAD (Pb)BEARING LEAD (Pb)-FREE TYPE A B C D PACKAGING UNIT (Pieces) MDM (Military M83401)


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    M83401) 09-Mar-11 Through-Hole Network Packaging PDF

    rn01

    Abstract: No abstract text available
    Text: Precision Resistor Network RN01 Series This is a precision resistor network that includes 2 resistors in a 3-pin through hole package. This resistor network is designed to provide excellent resistance ratio and TCR tracking. dimensions in mm Resistance range:


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    RN02M701 RN01TQ1001/2001YRA RN01QQ50R0/1001EM5 rn01 PDF

    vishay packaging codes

    Abstract: CS201 CS206 M83401
    Text: Through-Hole Network Packaging Vishay Network Packaging NETWORK FILM TUBE PACKAGING SIP C DIP D A B D B Typ. A Typ. PACKAGING CODE MODEL SIZE DIMENSIONS IN INCHES mm LEAD (Pb)BEARING LEAD (Pb)-FREE TYPE A B C D PACKAGING UNIT (Pieces) MDM (Military M83401)


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    M83401) 15-Feb-10 vishay packaging codes CS201 CS206 M83401 PDF

    rn01

    Abstract: No abstract text available
    Text: Thin Film Precision Resistor Network RN01 Series Specification subject to change - Please call factory. 1.0 Description This is a precision resistor network that includes 2 resistors in a 3-pin through hole package. This resistor network is designed to provide excellent resistance ratio and TCR tracking.


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    PDF

    rn01

    Abstract: No abstract text available
    Text: Thin Film Precision Resistor Network RN01 Series Specification subject to change - Please call factory. 1.0 Description This is a precision resistor network that includes 2 resistors in a 3-pin through hole package. This resistor network is designed to provide excellent resistance ratio and TCR tracking.


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: Bothhandusa.com 10 BASE-T NETWORK COMPONENTS P/N:TS7022DM DATA SHEET Feature ! ! ! ! ! ! Designed for use with 10 Base-T PHY transceivers. Conforms to IEEE 802.3 standards. Single port designs available with and without common mode chokes. Through-hole and surface mount packaging.


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    TS7022DM TS7022DM 1-10MHz 5-10MHz 10-30MHzceivers. PDF

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    Abstract: No abstract text available
    Text: defining a degree of excellence 10BASE-T NETWORK COMPONENTS 960061B • Designed for use with National Semiconductor DP83907 Atlantic II 10Base-T PHY transceiver • Available in both surface mount and through-hole packaging • Conforms to IEEE 802.3 10Base-T specifications


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    10BASE-T 960061B DP83907 1-10MHz 5MHz-10MHz 1MHz-10MHz 10-30MHz 100MHz PDF

    Untitled

    Abstract: No abstract text available
    Text: Leaded Resistor Networks THROUGH-HOLE Conformal Coated SIP 770 SERIES Termination Leads/Pins Type Dimensions: Inches mm Center Length Width Height Resistance: Range, Ohms Tolerance Temperature Coefficient,ppm/°C Maximum Operating Voltage Power Rating (Total Network Power)


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    100ppm/Â 770103103P PDF

    Untitled

    Abstract: No abstract text available
    Text: TSP www.vishay.com Vishay Dale Thin Film Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network Standard FEATURES • Lead (Pb)-free gold plated terminals standard • Gold to gold terminations (no internal solder) Actual Size Available


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    MIL-PRF-83401 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 PDF

    resistivity wire nichrome

    Abstract: tantalum nitride
    Text: CSD Vishay Thin Film Ceramic Sandwich, Dual-In-Line Resistor, Through Hole Network Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)


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    2002/95/EC 18-Jul-08 resistivity wire nichrome tantalum nitride PDF

    VTF215BX

    Abstract: resistor through hole vtf220bx VTF225BX
    Text: VTF Standard www.vishay.com Vishay Dale Thin Film Conformal, Single In-Line Thin Film Resistor, Through Hole Network (Standard) FEATURES • Off-the-shelf delivery Actual Size • Wide variety of standards • Small size (SIP) • Standard designs - no NRE


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    2002/95/EC 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 VTF215BX resistor through hole vtf220bx VTF225BX PDF

    Untitled

    Abstract: No abstract text available
    Text: HVPS www.vishay.com Vishay Dale Thin Film High Value, High Voltage Precision SIP Thin Film Resistor, Through Hole Network FEATURES • High nominal precision resistors value range 50K to 10M Available • Highly accurate resistance tolerance (up to ± 0.01 %)


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    2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 PDF

    Untitled

    Abstract: No abstract text available
    Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor, Through Hole Network Low Profile 0.20 Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no


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    2002/95/EC 11-Mar-11 PDF

    Untitled

    Abstract: No abstract text available
    Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor, Through Hole Network Low Profile 0.20 Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no


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    18-Jul-08 PDF

    Untitled

    Abstract: No abstract text available
    Text: VTF Standard www.vishay.com Vishay Dale Thin Film Conformal, Single In-Line Thin Film Resistor, Through Hole Network (Standard) FEATURES • Off-the-shelf delivery Actual Size • Wide variety of standards • Small size (SIP) • Standard designs - no NRE


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    2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 PDF

    resistor through hole

    Abstract: vishay 108 resistor
    Text: VTF Custom Vishay Thin Film Conformal, Single In-Line Resistor, Through Hole Network (Custom) FEATURES • Minimal PC board space • Standard 100 mil centers • Exceptional ratio stability over time and temperature (ΔR ± 0.015 % at + 70 °C at 2000 h)


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    11-Mar-11 resistor through hole vishay 108 resistor PDF

    Untitled

    Abstract: No abstract text available
    Text: CTSP www.vishay.com Vishay Dale Thin Film Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network Custom FEATURES • Lead (Pb)-free gold plated terminals standard • Gold to gold terminations (no internal solder) • Exceptional ratio stability over time and


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    2002/95/EC MIL-PRF-83401 11-Mar-11 PDF

    VTF211BX

    Abstract: VTF Custom
    Text: VTF Custom Vishay Thin Film Conformal, Single In-Line Resistor, Through Hole Network (Custom) FEATURES • Minimal PC board space • Standard 100 mil centers • Exceptional ratio stability over time and temperature (ΔR ± 0.015 % at + 70 °C at 2000 h)


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    2002/95/EC 18-Jul-08 VTF211BX VTF Custom PDF

    Untitled

    Abstract: No abstract text available
    Text: CTSP www.vishay.com Vishay Dale Thin Film Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network Custom FEATURES • Lead (Pb)-free gold plated terminals standard • Gold to gold terminations (no internal solder) • Exceptional ratio stability over time and


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    2002/95/EC MIL-PRF-83401 MIL-PRF-83401 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 PDF

    Untitled

    Abstract: No abstract text available
    Text: VTF Standard Vishay Thin Film Conformal, Single In-Line Resistor, Through Hole Network (Standard) FEATURES • Off-the-shelf delivery Actual Size • Wide variety of standards • Small size (SIP) • Standard designs - no NRE • Low capacitance < 0.1 pF/PIN


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    11-Mar-11 PDF

    Untitled

    Abstract: No abstract text available
    Text: CSD www.vishay.com Vishay Dale Thin Film Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network Custom FEATURES A dual-in-line monolithic ceramic package in a variety of sizes and configurations. A rugged, low cost packaging technique with 4 leads to 20 leads that allows higher


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    2002/95/EC 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 PDF

    Untitled

    Abstract: No abstract text available
    Text: CTSP www.vishay.com Vishay Dale Thin Film Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network Custom FEATURES • Lead (Pb)-free gold plated terminals standard • Gold to gold terminations (no internal solder) • Exceptional ratio stability over time and


    Original
    2002/95/EC MIL-PRF-83401 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 PDF

    Untitled

    Abstract: No abstract text available
    Text: CSD www.vishay.com Vishay Dale Thin Film Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network Custom FEATURES A dual-in-line monolithic ceramic package in a variety of sizes and configurations. A rugged, low cost packaging technique with 4 leads to 20 leads that allows higher


    Original
    2002/95/EC 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 PDF

    Untitled

    Abstract: No abstract text available
    Text: CSD www.vishay.com Vishay Dale Thin Film Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network Custom FEATURES A dual-in-line monolithic ceramic package in a variety of sizes and configurations. A rugged, low cost packaging technique with 4 leads to 20 leads that allows higher


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    2002/95/EC 11-Mar-11 PDF