Untitled
Abstract: No abstract text available
Text: b http://www.tekcon.com http://www.tekcon.com.tw 1131 Series 2.54 mm Box Header Low Profile, 4 Walls, Right Angle Ordering Information 1131 - X X X - XX R Contact Plating 0 - Gold Flash/Tin 100 µ" 1 - 10 µ" Gold/Tin 100 µ" 2 - 20 µ" Gold/Tin 100 µ" 3 - 30 µ" Gold/Tin 100 µ"
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UL94V-0.
-558C
1258C
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Untitled
Abstract: No abstract text available
Text: b http://www.tekcon.com http://www.tekcon.com.tw 1131 Series 2.54 mm Box Header Low Profile, 4 Walls, Straight Ordering Information 1131 - X X X - XX S - XX Contact Plating 0 - Gold Flash/Tin 100 µ" 1 - 10 µ" Gold/Tin 100 µ" 2 - 20 µ" Gold/Tin 100 µ"
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UL94V-0.
-558C
1258C
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JEDEC Code e3
Abstract: IEC-60068-2 J-STD-020B E3 SOT MILITARY QUALIFIED DIP SWITCHES SSOT-23 IEC600682-58 QFN-16 SC-75A SC-89
Text: 100% Matte Tin Sn -Plated Family of Products Released with “–E3” suffix New Vishay Siliconix Matte Tin-Plated Packages Meet Requirements for Both Lead-Based and Lead-Free Solders Highlights: • 100% Matte Tin (Sn) plating replaces standard Tin/Lead (Sn/Pb) plating on Vishay Siliconix
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J-STD-020B)
QFN-16
SC-70
SC-89
O-100
OT-23
TSOT-23
SQFP-48
JEDEC Code e3
IEC-60068-2
J-STD-020B
E3 SOT
MILITARY QUALIFIED DIP SWITCHES
SSOT-23
IEC600682-58
QFN-16
SC-75A
SC-89
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Untitled
Abstract: No abstract text available
Text: MMS-1XX-02-XXX-XX-XX-XXX REVISION CC 02 PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -T: MATTE TIN OVER ENTIRE CONTACT
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MMS-1XX-02-XXX-XX-XX-XXX
WG\MISC\MKTG\MMS-1XX-02-XXX-XX-XX-XXX-MKT
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Untitled
Abstract: No abstract text available
Text: MMS-1XX-02-XXX-XX-XX-XXX REVISION BY 02 PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -T: MATTE TIN OVER ENTIRE CONTACT
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MMS-1XX-02-XXX-XX-XX-XXX
LC-06-TM,
WG\MISC\MKTG\MMS-1XX-02-XXX-XX-XX-XXX-MKT
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Untitled
Abstract: No abstract text available
Text: MMS-1XX-02-XXX-XX-XX-XXX REVISION CJ 02 PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -T: MATTE TIN OVER ENTIRE CONTACT
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MMS-1XX-02-XXX-XX-XX-XXX
LC-06-TM,
WG\MISC\Mktg\MMS-1XX-02-XXX-XX-XX-XXX-MKT
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L 146 CB
Abstract: L 146 CB Equivalent F9037 EB 202 D HB Electronic Components marking EB 202 diode marking HB diode C0402 C0805 C1206
Text: New Product Bulletin Tin/Lead “L” Termination Ceramic Chip Capacitors KEMET's line of Tin/Lead termination commercial MLCC surface mount capacitors is designed to meet the needs of commercial, high reliability, and military customer applications where Tin/Lead plating is required. As the
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22-25L
Abstract: No abstract text available
Text: New Product Bulletin Tin/Lead “L” Termination Ceramic Chip Capacitors KEMET's line of Tin/Lead termination commercial MLCC surface mount capacitors is designed to meet the needs of commercial, high reliability, and military customer applications where Tin/Lead plating is required. As the
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Untitled
Abstract: No abstract text available
Text: CERAMIC CHIP/CAPACITORS Tin Lead L Termination FEATURES KEMET’s line of Tin/Lead termination commercial MLCC surface mount capacitors are designed to meet the needs of the commercial, high reliability, and military customer applications where Tin/Lead plating is required. KEMET’s Tin/Lead electroplating process is designed to meet a 5% minimum lead content in the termination of the component. As the bulk of the
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capaci00
EIA-198
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Untitled
Abstract: No abstract text available
Text: CERAMIC CHIP/CAPACITORS Tin Lead L Termination FEATURES KEMET’s line of Tin/Lead termination commercial MLCC surface mount capacitors are designed to meet the needs of the commercial, high reliability, and military customer applications where Tin/Lead plating is required. KEMET’s Tin/Lead electroplating process is designed to meet a 5% minimum lead content in the termination of the component. As the bulk of the
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capaci00
EIA-198
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C0805C103K5RAL
Abstract: transistor DJ marking 2JS marking
Text: CERAMIC CHIP/CAPACITORS Tin Lead L Termination FEATURES KEMET’s line of Tin/Lead termination commercial MLCC surface mount capacitors are designed to meet the needs of the commercial, high reliability, and military customer applications where Tin/Lead plating is required. KEMET’s Tin/Lead electroplating process is designed to meet a 5% minimum lead content in the termination of the component. As the bulk of the
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EIA-198
C0805C103K5RAL
transistor DJ marking
2JS marking
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Untitled
Abstract: No abstract text available
Text: CERAMIC CHIP/CAPACITORS Tin Lead L Termination FEATURES KEMET’s line of Tin/Lead termination commercial MLCC surface mount capacitors are designed to meet the needs of the commercial, high reliability, and military customer applications where Tin/Lead plating is required. KEMET’s Tin/Lead electroplating process is designed to meet a 5% minimum lead content in the termination of the component. As the bulk of the
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EIA-198
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smema
Abstract: STR22 smema wiring smema control technical of tamura solder paste Cu6Sn5 telcon Schloetter NASA Group TND311
Text: TND311 Tin Whisker Info “Brief” http://onsemi.com APPLICATION NOTE Tin whiskers are a potential concern with high-tin Sn content lead finishes (this includes alloys such as SnBi, and SnCu). SnPb alloys introduced in the 1950's have been the most successful in controlling whiskers. It is widely
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TND311
TND311/D
smema
STR22
smema wiring
smema control
technical of tamura solder paste
Cu6Sn5
telcon
Schloetter
NASA Group
TND311
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bellcore GR-78
Abstract: J-STD-006 SAC305
Text: Lead Free Solder SAC305 Page 1 of 2 Lead Free Solder Sn96 SAC 305 4900 96.3% tin, 0.7% copper and 3% silver M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder.
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SAC305
J-Std-006
J-Std-006
4900-35G
4900-112G
4900-227G
4900-454G
com/products/4900
bellcore GR-78
J-STD-006 SAC305
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Untitled
Abstract: No abstract text available
Text: BCS-1XX-XXX-X-XX-XXX REVISION BV DO NOT SCALE FROM THIS PRINT PLATING SPECIFICATIONS SEE TABLE 1 -T: MATTE TIN CONTACT AND TAIL -L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT AREA, MATTE TIN ON TAIL -F: 3µ" FLASH SELECTIVE GOLD CONTACT AREA, MATTE TIN ON TAIL
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PT-1-24-01-22
PT-1-24-20-09
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Untitled
Abstract: No abstract text available
Text: MMS-1XX-02-XXX-XX-XX-XXX REVISION CH 02 DO NOT SCALE FROM THIS PRINT PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL
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MMS-1XX-02-XXX-XX-XX-XXX
WG\MISC\MKTG\MMS-1XX-02-XXX-XX-XX-XXX-MKT
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Untitled
Abstract: No abstract text available
Text: 3012 SER IES □upi in BOX HEADER 2.54m m 0.100" Material: H ousing: 30% Glass filled C o n tac ts: Brass P la tin g : Gold plated: 5/T PBT U L 9 4 V - 0 . over 5 0 /i' nickel. Tin plated: 1 50/z over ( ' nickel. Selective gold plated: S tandard gold on m a tin g 'area and tin plated on
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5000M
100mA
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Untitled
Abstract: No abstract text available
Text: 3112 SERIES □upi in BOX HEADER 2.0m m 0.079" Material: Housing: 30% Glass filled PBT UL94V —0. Contacts: Brass Plating: Gold plated: 5pi' over 5 0 /T nickel. Selective gold plated: gold plated on m a tin g area and tin plated on solder tail. Tin plated: 150/z
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UL94V
150/z
5000M
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Untitled
Abstract: No abstract text available
Text: 3011 SERIES □up* in BOX HEADER WITH EJECTORS 2 .5 4 m m 0 .1 0 0 " Material: Housing: 30% Glass filled PBT U L94V ^0. C ontacts: Brass P lating: Gold plated: ( ' over ( ' nickel. Tin plated: 1 ( ' over 70 nickel. Selective gold plated: Standard gold on m a tin g area and tin plated on
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5000M
100mA
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A109
Abstract: No abstract text available
Text: 3214 Series □upun Box Header 1.27mmX2.54mm 0.050”X0.100” Material: Housing: 30% Glass filled PBT UL94V-0. Contacts: Brass. Plating: Gold plated over nickel. Tin plated over nickel. Selective gold plated: Gold plated on mating area and tin plated on solder tail.
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27mmX2
UL94V-0.
5000MQmin.
20mQmax.
100mA.
A109
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A116
Abstract: u 3842
Text: 3012 Series □upnn Box Header 2.54m m 0.100” Material: Housing: 30% Glass filled PBT UL94V-0. Contacts: Brass. Plating:Gold plated over nickel. Tin plated over nickel. Selective gold plated: Gold plated on mating area and tin plated on solder tail. Electrical Characteristics:
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UL94V-0.
5000MQmin.
20mQmax.
100mA.
A116
u 3842
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A111
Abstract: No abstract text available
Text: 3215 Series □upiin Box Header 1.27mmX2.54mm 0.050”X0.100” Material: Housing: 30% Gloss filled PBT UL94V-0. Contacts: Brass. Plating: Gold plated over nickel. Tin plated over nickel. Selective gold plated: Gold plated on mating area and tin plated on solder tail.
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27mmX2
UL94V-0.
5000MOmin.
20mQmax.
100mA.
15-ti'
30/tf"
A111
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A110
Abstract: No abstract text available
Text: 3214 Series □upun Box Header 1.27mmX2.54mm 0.050”X0.100” Material: Housing: 3 0 % Glass filled PBT U L94V-0. Contacts: Brass. Plating: Gold plated over nickel. Tin plated over nickel. Selective gold plated: Gold plated on mating area and tin plated on solder tail.
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27mmX2
UL94V-0.
5000MQmin.
20mQmax.
100mA.
A110
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A105
Abstract: No abstract text available
Text: 3212 Series □upi in Box Header With Ejectors 1.27mmX2.54mm 0.050"X0.100" M aterial: Housing: 30% Glass filled PBT UL94V-0. Contacts: Brass. Plating: Gold plated over nickel. Tin plated over nickel. Selective gold plated: Gold plated on mating area and tin plated on solder tail.
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27mmX2
UL94V-0.
5000MQ
100mA.
A105
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