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LRIS64K Abstract: DSASW003741 Text: TN0193 Technical note LRIS64K bumped die description Product information • Product name: LRIS64K Wafer and die features July 2010 Wafer diameter: 8 inches Wafer thickness: 180 µm Die identification: M24RF64A1 Die finishing front side : SiO2 Die finishing (back side):	Original	PDF	TN0193 LRIS64K LRIS64K M24RF64A1 DSASW003741

Catalog Datasheet

MFG & Type

PDF

Document Tags

LRIS64K

Abstract: DSASW003741
Text: TN0193 Technical note LRIS64K bumped die description Product information • Product name: LRIS64K Wafer and die features July 2010 Wafer diameter: 8 inches Wafer thickness: 180 µm Die identification: M24RF64A1 Die finishing front side : SiO2 Die finishing (back side):

Original

PDF

TN0193 LRIS64K LRIS64K M24RF64A1 DSASW003741