Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    TQFP-44 TRAY Search Results

    TQFP-44 TRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    ELANSC300-33VC Rochester Electronics LLC Microcontroller, 32-Bit, 33MHz, CMOS, PQFP208, TQFP-208 Visit Rochester Electronics LLC Buy
    CY7C4285-15ASC Rochester Electronics LLC FIFO, 64KX18, 10ns, Synchronous, CMOS, PQFP64, 10 X 10 MM, TQFP-64 Visit Rochester Electronics LLC Buy
    ML6431CH Rochester Electronics LLC Consumer Circuit, BICMOS, PQFP32, 7 X 7 MM, 1 MM HEIGHT, TQFP-32 Visit Rochester Electronics LLC Buy
    ML6430CH Rochester Electronics LLC Consumer Circuit, BICMOS, PQFP32, 7 X 7 MM, 1 MM HEIGHT, TQFP-32 Visit Rochester Electronics LLC Buy
    RAA230403GFT Renesas Electronics Corporation ICs for Microcontroller Power Supply System, TQFP-32, /Tray Visit Renesas Electronics Corporation

    TQFP-44 TRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A68A-1 ST-TQ242414TJ-1 TQFP 20x20 1.4mm 176 pin LQFP 24 × 24 Terminal Spacing Linear = 0.5 A B 132 133 89 88 detail of lead end C D S Q 176 1 R 45 44 F G H I M J P K M N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of


    Original     		PDF LA-3A68A-1 ST-TQ242414TJ-1 S176GM-50-8EU-2

    is62c51216al

    Abstract: IS43LR16320B IS66WVE4M16BLL is66wve2m16 IS43DR16640A BGA60 IS66WVE4M16ALL TSOP2-44 IS42SM16400G is45vs16160d
    Text: To our valued customers, At ISSI we design, develop and market high performance integrated circuits for the following key markets: i automotive electronics (ii) networking/telecommunications infrastructure, (iii) industrial/military/medical electronics (iv) mobile communications and digital


    Original     		PDF

    IS43LR32640

    Abstract: is61wv5128 Product Selector Guide is42s86400 IS46R16160B IS25LD010 IS25LD025 IS25LQ IS62WV5128DALL BGA 168
    Text: To our valued customers, At ISSI we design, develop and market high performance integrated circuits for the following key markets: i automotive, (ii) communications, (iii) digital consumer, and (iv) industrial/medical/military. These key markets all require high quality and reliability, extended temperature ranges, and long-term support. Our primary products are high speed and


    Original     		PDF i1-44-42218428 IS43LR32640 is61wv5128 Product Selector Guide is42s86400 IS46R16160B IS25LD010 IS25LD025 IS25LQ IS62WV5128DALL BGA 168

    Automotive Product Selector Guide

    Abstract: products automotive IS61WV51216 IS61WV512 DDR RAM 512M is66wve2m16 IS61LPS2048 IS61WV25632 BGA165 VFBGA package tray
    Text: Automotive Market Support Introduction ISSI has been supporting the Automotive Market since 1999. In 2001, ISSI began to broaden its support of the market by introducing the Automotive Business Unit. The purpose of this business unit is to provide cross-functional unit support within ISSI to continually enhance the Automotive Infrastructure from


    Original     		PDF

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		PDF 60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9

    UM61256FK-15

    Abstract: YD 6409 philips diode PH 33J um61256 um61256ak-15 PZ 5805 PHILIPS UM6164 KM6264BLS-7 UM61256ak sram IDT8M624
    Text: QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH QUAD 2:1 MUX/DEMUX QS3257 QS32257 FEATURES/BENEFITS DESCRIPTION • • • • • • • • The QS3257 is a high-speed CMOS LVTTL-compatible Quad 2:1 multiplexer/demultiplexer. The QS3257 is a function and pinout compatible QuickSwitch


    Original     		PDF 74F257, 74FCT257, 74FCT257T QS32257 QS3257 QS32257 UM61256FK-15 YD 6409 philips diode PH 33J um61256 um61256ak-15 PZ 5805 PHILIPS UM6164 KM6264BLS-7 UM61256ak sram IDT8M624

    philips diode PH 33J

    Abstract: UM61256FK-15 sem 2106 inverter diagram IDT7024L70GB um61256 UM61256ak sram um61256fk15 HIGH VOLTAGE ISOLATION DZ 2101 C5584 IDT74LVC1G07ADY
    Text: QUICKSWITCH PRODUCTS HIGH-SPEED LOW POWER CMOS 10-BIT BUS SWITCHES QS3L384 QS3L2384 FEATURES/BENEFITS DESCRIPTION • • • • • • • • • The QS3L384 and QS3L2384 provide a set of ten high-speed CMOS TTL-compatible bus switches. The low ON resistance of the QS3L384 allows inputs to be connected to outputs without


    Original     		PDF 10-BIT QS3L384) QS3L2384 QS3L384 QS3L2384 philips diode PH 33J UM61256FK-15 sem 2106 inverter diagram IDT7024L70GB um61256 UM61256ak sram um61256fk15 HIGH VOLTAGE ISOLATION DZ 2101 C5584 IDT74LVC1G07ADY

    mips r5000

    Abstract: ti32k Motorola Master Selection Guide mcm6249 48-pin TSOP package tray XCM f MCM69L818A M28F800A2BA12 MCM69L820A MCM69R736A
    Text: Memory Products In Brief . . . Motorola’s memory product portfolio has been expanded to support a broad range of engineering applications. Included in this portfolio are asynchronous devices with access times of 6 ns at 256K–bit density, 6 ns at 5 V 1


    Original     		PDF

    TQFP Shipping Trays

    Abstract: MQFP Shipping Trays PB1083 Lattice PLSI
    Text: Product Bulletin November, 1997 #PB1083 Lattice OEM Customer Ordering Guidelines For Standard Products Introduction Lattice has instituted new OEM ordering guidelines aimed at providing further enhancements to the quality of our products and services. These new guidelines will


    Original     		PDF PB1083 1-888-ISP-PLDS TQFP Shipping Trays MQFP Shipping Trays PB1083 Lattice PLSI

    TQFP Shipping Trays

    Abstract: LATTICE plsi 3000 PB1084 lattice semiconductor tape and reel
    Text: Product Bulletin June, 1998 Updated #PB1084 Lattice Pre-Patterned and Tape and Reel Ordering Guidelines Introduction After reviewing customer ordering patterns and costs associated with providing prepatterned and/or tape and reel PLDs, Lattice has modified its minimum ordering quantity


    Original     		PDF PB1084 1-888-ISP-PLDS TQFP Shipping Trays LATTICE plsi 3000 PB1084 lattice semiconductor tape and reel

    SMD CODE 9Z

    Abstract: 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products
    Text: Information about SMD Plastic Packages Prepared by: Elisabeth Lamarti Pierre Houzé Quality Department SMD Packaging Contents 1. INTRODUCTION -2 2. GENERALITIES -2


    Original     		PDF 300mm SMD CODE 9Z 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products

    transistor fn 1016

    Abstract: SN74HC1G00 SCAD001D sn74154 SN74ALVC1G32 JK flip flop IC SDFD001B philips 18504 FB 3306 CMOS Data Book Texas Instruments Incorporated
    Text: W O R L D L Logic Selection Guide August 1998 E A D E R I N L O G I C P R O D U C T S LOGIC OVERVIEW 1 FUNCTIONAL INDEX 2 FUNCTIONAL CROSSĆREFERENCE 3 DEVICE SELECTION GUIDE 4 3 LOGIC SELECTION GUIDE AUGUST 1998 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or


    Original     		PDF

    28 TSSOP JEDEC Thin Matrix Tray outlines

    Abstract: tsop tray matrix outline Shipping Trays ATMEL Packing Methods and Quantities ATMEL EIA-481-x Packing ATMEL 234 tsop Shipping Trays atmel tape and reel JEDEC Matrix Tray outlines EIA-481-x
    Text: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three


    Original     		PDF 0637D 09/99/xM 28 TSSOP JEDEC Thin Matrix Tray outlines tsop tray matrix outline Shipping Trays ATMEL Packing Methods and Quantities ATMEL EIA-481-x Packing ATMEL 234 tsop Shipping Trays atmel tape and reel JEDEC Matrix Tray outlines EIA-481-x

    44-pin plcc pcb mount footprint

    Abstract: PIC16C71SO pic16c57 PCB Circuit 27C64SO PIC16C74P adaptor 32 pin dil to 32 pin plcc pic16c57 codes data programmers DIP PLCC Enplas PIC17C76X
    Text: 7 Logic Analyzers and Accessories 7 Logic Analyzers and Accessories Logic Analyzers and Accessories Logic Analyzers and Accessories DS00104F-page 7-1  2001 Microchip Technology Inc. Logic Analyzers and Accessories Section 7 Logic Analyzers and Accessories


    Original     		PDF DS00104F-page PIC12CXXX, PIC14C000, PIC16CXXX PIC17CXXX 28C64ASO 28C64AK PIC16C55SW W9711 44-pin plcc pcb mount footprint PIC16C71SO pic16c57 PCB Circuit 27C64SO PIC16C74P adaptor 32 pin dil to 32 pin plcc pic16c57 codes data programmers DIP PLCC Enplas PIC17C76X

    LQFP-48 thermal pad

    Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
    Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /


    Original     		PDF

    TQFP 100 pin ic

    Abstract: 208ld
    Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /


    Original     		PDF

    JESD51-8

    Abstract: JESD51-2 JEDEC JESD51-8 qfn 44 PACKAGE footprint 9mm surface mount package dimensions FREESCALE PACKING jesd51 8 JEDEC-STD-020 JEDEC-STD020 tqfp 44 PACKAGE footprint
    Text: Freescale Semiconductor, Inc. ANALOG ICs INTEGRATED SOLUTIONS Freescale Semiconductor, Inc. PACKAGING Robust packaging is a key technology component of Analog Products. Motorola puts solutions together in single packages to accomodate power and high voltages.


    Original     		PDF BR1568/D JESD51-8 JESD51-2 JEDEC JESD51-8 qfn 44 PACKAGE footprint 9mm surface mount package dimensions FREESCALE PACKING jesd51 8 JEDEC-STD-020 JEDEC-STD020 tqfp 44 PACKAGE footprint

    TQFP 100 pin ic

    Abstract: tqfp 7x7 1.4 tray tqfp 7x7 tray MS-026 JEDEC tray standard 17 x 17 tqfp 64 thermal resistance MS-026 TQFP TQFP Package 44 lead tqfp 32 thermal resistance CO-124
    Text: LEADFRAME data sheet TQFP Features: Thin Quad Flat Pack TQFP Packages: Amkor offers a broad line of TQFP IC packages. IC packaging engineers, component specifiers and systems designers will find our TQFPs help to solve issues such as increasing board density, die shrink


    Original     		PDF MS-026 TQFP 100 pin ic tqfp 7x7 1.4 tray tqfp 7x7 tray MS-026 JEDEC tray standard 17 x 17 tqfp 64 thermal resistance MS-026 TQFP TQFP Package 44 lead tqfp 32 thermal resistance CO-124

    jedec MS-026 ABA

    Abstract: ICS83210AYT MS-026 CY2HH8110 ICS83210 ICS83210AY ICS83210AYLF idt cross TQFP JEDEC tray JEDEC tray standard TQFP
    Text: ICS83210 LOW SKEW, 1-TO-10 HSTL FANOUT BUFFER GENERAL DESCRIPTION FEATURES The ICS83210 is a low skew, 1-to-10 HSTL Fanout ICS Buffer and a member of the HiPerClockS Family HiPerClockS™ of High Performance Clock Solutions from IDT. The class II HSTL outputs are balanced push-pull


    Original     		PDF ICS83210 1-TO-10 ICS83210 150MHz 110ps 199707558G jedec MS-026 ABA ICS83210AYT MS-026 CY2HH8110 ICS83210AY ICS83210AYLF idt cross TQFP JEDEC tray JEDEC tray standard TQFP

    ICS84332

    Abstract: ICS844020-45 ICS844020AY-45 ICS844020AY-45LF ICS844020AY-45LFT ICS844020AY-45T
    Text: PRELIMINARY ICS844020-45 FEMTOCLOCK CRYSTAL-TO-LVDS/ LVCMOS FREQUENCY SYNTHESIZER GENERAL DESCRIPTION FEATURES • Sixteen differential LVDS outputs at 125MHz One differential LVDS output at 156.25MHz One LVCMOS/LVTTL single-ended output at 125MHz One LVCMOS/LVTTL single-ended output at 25MHz


    Original     		PDF ICS844020-45 125MHz 25MHz 90625MHz ICS844020-45 25MHz 125MHz, ICS84332 ICS844020AY-45 ICS844020AY-45LF ICS844020AY-45LFT ICS844020AY-45T

    IDT package marking

    Abstract: IDT CODE DATE marking FORMAT IDT package marking tssop IDT marking code soic millipaq80 DTQS338 IDT CODE DATE marking IDT Package ssop-28 Marking format idt 20 PIN SOIC IDT marking TQFP
    Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN 5/1/99 PCN #: L9904-01 DATE: Product Affected: All Quality Semiconductor, Inc. Products Manufacturing Location Affected: See below 6/28/99 Date Effective:


    Original     		PDF L9904-01 QS3384Q QS74FCT16244TPA dtQS74FCT16244TPA QS5991-2JRI dtQS3384Q dtQS5991-2JRI IDT package marking IDT CODE DATE marking FORMAT IDT package marking tssop IDT marking code soic millipaq80 DTQS338 IDT CODE DATE marking IDT Package ssop-28 Marking format idt 20 PIN SOIC IDT marking TQFP

    peb 2091 errata

    Abstract: ITP09426 MS20 PLCC-44 PSB2186 siemens Package Outlines P-LCC NTE list
    Text: ICs for Communications ISDN Echocancellation Circuit for NT and Terminal Applications IEC-Q NTE PSB 21910 Version 5.1 Delta Sheet 01.97 T2191-0V51-L1-7600 PSB 21910 Revision History: Current Version: 01.97 Previous Version: none Page in previous Version


    Original     		PDF T2191-0V51-L1-7600 GPM05247 peb 2091 errata ITP09426 MS20 PLCC-44 PSB2186 siemens Package Outlines P-LCC NTE list

    MT 5388 BGA

    Abstract: Broadcom 7019 BTS 6000 ericsson alcatel 1511 mux mobile switching center msc ericsson bts 6000 2x4 TTL demultiplexer cisco 2801 ericsson bts Technical specification alcatel 1511
    Text: IDT Product Selector Guide Accelerated Thinking SM Table of Contents Integrated Processors Flow-Control Management Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13


    Original     		PDF 12-03/DS/DL/BAY/10K CORP-PSG-00123 MT 5388 BGA Broadcom 7019 BTS 6000 ericsson alcatel 1511 mux mobile switching center msc ericsson bts 6000 2x4 TTL demultiplexer cisco 2801 ericsson bts Technical specification alcatel 1511

    Motorola SMD code

    Abstract: PSB21525-N
    Text: SIEMENS High-Level Serial Communications Controller Extended HSCX-TE PSB 21525 Version 2.1 1 CMOS Features Package Besides P-LCC-44-1 and P-MQFP-44-2, the HSCX-TE PSB 21525 is available also in P-TQFP-64-1 package. Type Ordering Code Package PSB 21525 N Q67100-H6672


    OCR Scan     		PDF P-LCC-44-1 P-MQFP-44-2, P-TQFP-64-1 Q67100-H6672 Q67100-H6671 Q67101-H6733 P-LCC-44-1 P-MQFP-44-2 P-TQFP-64-1 FP-64-1 Motorola SMD code PSB21525-N