backplane design
Abstract: PCI backplane Layout backplane layout GTLP16T1655 Signal Path Designer
Text: Revised March 2002 Section 4 - Backplane Design Considerations Backplane Designer’s Guide This section focuses on designing high-performance parallel backplanes, a task that can be extremely complex. To assure high performance and good signal integrity, many issues must be considered during the design process. To a large extent,
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SIGNAL PATH DESIGNER
Abstract: DSA0050327
Text: Revised March 2002 Section 6 - Noise, Cross-talk, Jitter, Skew, and EMI Backplane Designer’s Guide This section discusses backplane signal integrity, focusing on the phenomena and effects that can disrupt clean signals and high signal integrity. Enemies of signal integrity include noise, cross-talk, jitter, skew, and electromagnetic interference
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SIGNAL PATH DESIGNER
Abstract: No abstract text available
Text: White Paper Basic Principles of Signal Integrity Introduction Digital designs have not traditionally suffered by issues associated with transmission line effects. At lower frequencies the signals remain within data characterization and the system performs as designed. But as system
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SSTL-18
Abstract: No abstract text available
Text: Impact of I/O Settings on Signal Integrity in Stratix III Devices October 2007, ver. 1.0 Application Note 476 Introduction This application note provides information on the effects of the I/O settings on the quality of the signal. Its main focus is on drive strength
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GS8170DW36B
Abstract: CLAMSHELL
Text: HSTL I/O Sync SRAM Board Design Guidelines System designers using high speed Synchronous Static RAM must consider how printed circuit board layout affects signal integrity when designing 100–300 MHz systems. Transmission line effects will affect signals even on short trace runs at these high speeds.
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S1M A3
Abstract: S1M a4 pin model spice
Text: Simulation of the signal integrity of the ERNI ERmet 10Row 2mm H.M. connectors This application note is a demonstration for the use of the SPICE simulation models of the ERNI ERmet connector family. The goal of this simulation is to predict the crosstalk on a single connector pin issued by
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10Row
S1M A3
S1M a4
pin model spice
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Untitled
Abstract: No abstract text available
Text: DataSource CD-ROM Q4-01: techXclusives techXclusives techXclusives Signal Integrity: Tips and Tricks By Austin Lesea Principal Engineer - Xilinx San Jose Signal Integrity SI engineering has become a necessary requirement for today's high-speed logic signals. Having control of cross-talk, ground
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Q4-01:
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TN-46-06
Abstract: FR4 substrate with dielectric constant 4.4 transmission lines in signal integrity TN4606 micron power resistor FR4 substrate with dielectric constant 4 MICRON 63 micron resistor Signal Integrity transmission line theory
Text: TN-46-06 TERMINATON FOR POINT-TO-POINT SYSTEMS TECHNICAL NOTE TERMINATION FOR POINTTO-POINT SYSTEMS INTRODUCTION TRANSMISSION LINE THEORY Because digital signal rates in computing systems are increasing at an astonishing rate, signal integrity issues have become far more important to designers. At higher
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TN-46-06
TN-46-06:
TN4606
TN-46-06
FR4 substrate with dielectric constant 4.4
transmission lines in signal integrity
micron power resistor
FR4 substrate with dielectric constant 4
MICRON 63
micron resistor
Signal Integrity
transmission line theory
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CY7C038
Abstract: SIGNAL PATH designer
Text: Input Signal Integrity for CMOS Dual-Port Products Memory arrays are typically sensitive to noise and glitches at the input. Excessive undershoot or line noise may cause memory upset and data loss. When designing a circuit board, a good termination scheme is needed to maintain signal integrity. For details about the kinds of termination and transmission lines, please refer to the application notes “System
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CY7C038or
CY7C038
SIGNAL PATH designer
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DS3662
Abstract: AN-337
Text: INTRODUCTION As the microcomputer bus bandwidth is extended to handle ever increasing clock rates, the noise susceptibility of a single-ended bus poses a serious threat to the overall system integrity. Thus, it is mandatory that the various noise contributions be taken into account in the design of the bus
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an005281
DS3662
AN-337
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DPRAM
Abstract: CY7C038 Signal Path Designer
Text: Input Signal Integrity for CMOS Dual-Port Products AN1142 Introduction Ground and Power Supply Bounce Memory arrays are typically sensitive to noise and glitches at the input. Excessive undershoot or line noise may cause memory upset and data loss. When designing a circuit board,
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AN1142
DPRAM
CY7C038
Signal Path Designer
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DSLAM drawing
Abstract: DSLAM board layout hyperlynx SIGNAL INTEGRITY AND TIMING SIMULATION PC3T04 IDT74FCT3807 PMC-1990815 PC3B01 74LCX244MCT
Text: VORTEX CHIPSET RELEASED DSLAM APPS NOTE PMC-1990816 ISSUE 1 SIGNAL INTEGRITY AND TIMING SIMULATION DSLAM DSLAM APPS NOTE: SIGNAL INTEGRITY AND TIMING SIMULATION FOR THE VORTEX CHIPSET S/UNI-DUPLEX, S/UNI-VORTEX, S/UNI-APEX AND S/UNI-ATLAS Released Issue 1
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PMC-1990816
DSLAM drawing
DSLAM board layout
hyperlynx
SIGNAL INTEGRITY AND TIMING SIMULATION
PC3T04
IDT74FCT3807
PMC-1990815
PC3B01
74LCX244MCT
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alan 100 plus
Abstract: Microwave PIN diode spice power supply diagram
Text: DesignCon 2007 FPGA Design for Signal and Power Integrity Larry Smith, Altera Corporation Hong Shi, Altera Corporation CP-01023-1.0 January 2007 Abstract FPGAs have traditionally been optimized for low-cost environments where signal and power integrity are minor considerations. With today’s requirements for high-speed
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CP-01023-1
alan 100 plus
Microwave PIN diode spice
power supply diagram
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buffer driver ic SPICE MODEL S
Abstract: hyperlynx what is the drawback of operating system SN65LVDS31 SN65LVDS32 ic 4145B converter spice model 4145B
Text: Generating Accurate Behavioral Models of I/O Buffers Thomas Fisher Texas Instruments Abstract As data rates continue to rise the need for Signal Integrity simulation grows in importance. With this new interest in SI simulation comes the need to simulate accurately down to the device level. Silicon manufacturers are being asked with
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ANSI/EIA-656)
accuraNSI/EIA656)
buffer driver ic SPICE MODEL S
hyperlynx
what is the drawback of operating system
SN65LVDS31
SN65LVDS32
ic 4145B
converter spice model
4145B
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Fairchild Switching power supply Technologies
Abstract: AN-5017 EIA-644 TR30 RS-644 Signal path designer
Text: Fairchild Semiconductor Application Note December 2000 Revised December 2000 LVDS Fundamentals Introduction What is LVDS? With the recent developments in the communications market, the demand for throughput is becoming increasingly more crucial. Although older differential technologies provide significant signal integrity benefits compared to singleended technologies, many of them consume much more
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AN-5017
Fairchild Switching power supply Technologies
EIA-644
TR30
RS-644
Signal path designer
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AN1051
Abstract: AN2127 MPC5500 MPC5553 MPC5554 MPC5554 evb AN2705
Text: Freescale Semiconductor Application Note Signal Integrity Considerations with MPC5500-based Systems by: Stevan Dobrasevic and John Phillippe MCD Design 1 Introduction As external bus interfaces increase in operating frequency, signal integrity becomes a major concern for
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MPC5500
AN2705
MPC5553
MPC5554
AN1051
AN2127
MPC5554 evb
AN2705
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of 1000 microfarad electrolytic capacitor
Abstract: JTAG series termination resistors
Text: R Printed Circuit Board Considerations Layout Considerations The PC board is no longer just a means to hold ICs in place. At today’s high clock rates and fast signal transitions, the PC board performs a vital function in feeding stable supply voltages to the IC and in maintaining signal integrity between devices.
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UG002
of 1000 microfarad electrolytic capacitor
JTAG series termination resistors
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Untitled
Abstract: No abstract text available
Text: RFSeries High-performance RF Pyramid Probe cards DATA SHEET Cascade Microtech’s high-performance RF Pyramid Probe cards provide state-of-the-art signal integrity for wireless RF and microwave production test. Microstrip transmission lines maintain impedance control all the way to the bond pad. Patented ground and power planes
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Tektronix P6056
Abstract: microstrip antenna mf AN-831 C1995 SUMITOMO F2 AN-831 national
Text: National Semiconductor Application Note 831 Michael L Gilbert James W Davison William M Hall July 1992 INTRODUCTION Electromagnetic Interference EMI has long been an issue in the integrity and certification of electronic systems Until recently design and measurement of electromagnetic compatibility (EMC) has predominantly been the focus of the
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Tektronix P6056
microstrip antenna mf
AN-831
C1995
SUMITOMO F2
AN-831 national
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Signal Integrity Handbook
Abstract: Signal Integrity edge rate processing microwave products TWISTED SHIELDED PAIR SPICE MODEL transmission line model orcad pspice samtec PCIE 1-800-SAMTEC-9 samtec PCIE design
Text: INTERCONNECT SIGNAL INTEGRITY HANDBOOK AUGUST 2007 INTERCONNECT SIGNAL INTEGRITY HANDBOOK 2007 by Samtec, Inc. All rights reserved. Table of Contents Introduction . 4
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1-800-SAMTEC-9
Signal Integrity Handbook
Signal Integrity
edge rate
processing
microwave products
TWISTED SHIELDED PAIR SPICE MODEL
transmission line model orcad pspice
samtec PCIE
1-800-SAMTEC-9
samtec PCIE design
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FF1136
Abstract: SSTL18I thevenin DDR2 sstl_18 class magic eye ML461 ML561 UG190 UG199 XAPP863
Text: Application Note: Virtex-5, Virtex-4, and Spartan-3 Generation Devices R XAPP863 v1.0 June 1, 2007 Using Digitally Controlled Impedance: Signal Integrity vs. Power Dissipation Considerations Author: David Banas Summary On-die termination (ODT) promises higher signaling rates for printed circuit board (PCB) interchip interfaces through improved signal integrity. However, when using ODT, there is
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org/download/search/JESD8-15a
UG190,
com/bvdocs/userguides/ug190
UG079,
ML461
com/bvdocs/userguides/ug079
UG199,
ML561
com/bvdocs/userguides/ug199
FF1136
SSTL18I
thevenin
DDR2 sstl_18 class
magic eye
UG190
UG199
XAPP863
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N3215B
Abstract: EESof
Text: Agilent EEsof EDA Designing for Signal Integrity with Advanced Design System Course Overview Course Numbers Agilent-Training Center: N3215A Onsite-Training: N3215B Length What you will learn Prerequisites 3 Days • A brief introduction to ADS is presented, showing schematic capture,
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N3215B
5989-2890EN
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transmission lines Twisted Pair spice model
Abstract: transmission lines Twisted Pair characteristics of twisted pair cable LVDS 30 pin connector cable slla053 twisted pair cable with parameter XAPP230 idc 20 pin data ribbon connector receiver LVDS XAPP231
Text: Application Note: Virtex-E Family The LVDS I/O Standard R XAPP230 v1.1 November 16, 1999 Application Note: Jon Brunetti & Brian Von Herzen Ph.D. Summary This application note describes the LVDS I/O standard. LVDS provides higher noise immunity than single-ended techniques, allowing for higher transmission speeds, smaller signal swings,
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XAPP230
transmission lines Twisted Pair spice model
transmission lines Twisted Pair
characteristics of twisted pair cable
LVDS 30 pin connector cable
slla053
twisted pair cable with parameter
XAPP230
idc 20 pin data ribbon connector
receiver LVDS
XAPP231
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GA9012
Abstract: GA22V10
Text: GA9011/GA9012 Hoi Rod Update The following changes have been made to the Hot Rod data sheet, dated July, 1991: Figure I.Chip Set Data Flow Communications Protocol Unidirectional Link HOT ROD TRANSMITTER 40 • The maximum transmit strobe interval requirement for guaranteed data integrity
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GA9011/GA9012
GA9011,
GA9012
28-Pin
GA9101,
GA9102
GA9102
68-Pin
GA9012
GA22V10
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