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    TRAY BGA 6X6 Search Results

    TRAY BGA 6X6 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202 Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    10022671-102LF Amphenol Communications Solutions 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84501-001LF Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    55714-102LF Amphenol Communications Solutions 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84520-002LF Amphenol Communications Solutions 400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions

    TRAY BGA 6X6 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    tray 20 x 14

    Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
    Text: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type


    Original     		E04102 tray 20 x 14 BGA 31 x 31 tray bga trays tray bga 17 bga tray PDF

    PCB design for very fine pitch csp package

    Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		SSYZ015A PCB design for very fine pitch csp package Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A PDF

    smd transistor mark E13

    Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4 PDF

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9 PDF

    "0.4mm" bga "ball collapse" height

    Abstract: Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST
    Text: Application Report SPRAA99 – March 2008 nFBGA Packaging Robert Furtaw . ABSTRACT This application report gives you technical background on nFBGA packages and


    Original     		SPRAA99 "0.4mm" bga "ball collapse" height Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST PDF

    vqfp100 package

    Abstract: TO220CP-3 TQFP128U SOP8 package tray VSOF5 TQFP176U TSSOP-B8J TSSOP-B14 tl 32 icp VQFP100
    Text: Product Designation Company info Page 1 of 2 Products > LSIs Lineup • LSI Packages > Product Designation Sales Products LSIs ROHM LSI Solution General-purpose LSIs Mobile Phone LSIs Product Designation •When ordering, specify the part number. •Check each code against the tables shown below.


    Original     		copyQFP80V, HTQFP64V UQFP64, UQFP80, UQFP100, TQFP64U, TQFP80U, TQFP100U UQFP120, TQFP128U vqfp100 package TO220CP-3 SOP8 package tray VSOF5 TQFP176U TSSOP-B8J TSSOP-B14 tl 32 icp VQFP100 PDF

    vqfp100 package

    Abstract: TQFP128U SSOP-A20 Contact Image Sensor VQFP100
    Text: Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request


    Original     		descrQFP80V, HTQFP64V UQFP64, UQFP80, UQFP100, TQFP64U, TQFP80U, TQFP100U UQFP120, TQFP128U vqfp100 package SSOP-A20 Contact Image Sensor VQFP100 PDF

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G PDF

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		UG112 UG072, UG075, XAPP427, BFG95 PDF

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 PDF

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga PDF

    JEDEC TRAY DIMENSIONS

    Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
    Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors


    Original     		manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package PDF

    AD5820

    Abstract: ad6548
    Text: Tape and Reel Packaging Introduction Specifications The electronics industry is making a tremendous investment in surfacemount technology. The reasons for this investment include cost savings resulting from automated component placement and increased density


    Original     		T03762-0-1/13 AD5820 ad6548 PDF

    nitto SWT 10

    Abstract: nitto SWT-20 W07 sot 23 w04 transistor sot 23 UE-111AJ W04 sot 23 transistor w07 transistor marking w08 marking W07 transistor marking w04
    Text: PRODUCT CODING SYSTEM QSP0005_WEB.028 1 2.4.2007 Page 1 of 6 GENERAL AND DEFINITIONS This procedure defines the identification system for MAS products. The following abbreviations are used in this document. ESD EWS ID MAS MBB T&R 2 Electrostatic Sensitive Device


    Original     		QSP0005 MAS1234AB3 MAS1234AB3xxxxx) 98AA2 MAS9198AA2xxxxx) nitto SWT 10 nitto SWT-20 W07 sot 23 w04 transistor sot 23 UE-111AJ W04 sot 23 transistor w07 transistor marking w08 marking W07 transistor marking w04 PDF

    R50-E2Y2-24

    Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
    Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.


    Original     		PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001 PDF

    Intel StrataFlash Memory j3

    Abstract: BGA 6x6 tray daewon 273416 Intel 80321
    Text: Intel 80321 I/O Processor Datasheet Product Features • ■ ■ ■ Core Features — Integrated Intel® XScale Core — ARM* V5T Instruction Set — ARM V5E DSP Extensions — 400 MHz and 600 MHz — Write Buffer, Write-back Cache PCI Bus Interface


    Original     		64-bit/66MHz --64-bit/133MHz 32-bit 64-bit --PC200 VCC33 Intel StrataFlash Memory j3 BGA 6x6 tray daewon 273416 Intel 80321 PDF

    S1L50552

    Abstract: tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon
    Text: ASICs Gate Arrays / Embedded Arrays / Standard Cells 2010 Our goal in the Epson Semiconductor Operations Division is to be a true partner for you, by looking to give you an edge in product development through our concept of "+less design". Gate Arrays / Embedded Arrays / Standard Cells


    Original     		S1L60173F00A000 S1L50552 tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon PDF

    intel 80219

    Abstract: 80219 XScale 80219 daewon daewon tray BGA 6x6 tray PAR64 PC200 REQ64 CC2538
    Text: Intel 80219 General Purpose PCI Processor Datasheet Extended Temperature Support Product Features • ■ ■ ■ Core Features — Integrated Intel XScale® Core — ARM* V5T Instruction Set — ARM V5E DSP Extensions — 400 MHz and 600 MHz — Write Buffer, Write-back Cache


    Original     		64-bit/66 --64-bit/133 32-bit 64-bit --PC200 VCC33 intel 80219 80219 XScale 80219 daewon daewon tray BGA 6x6 tray PAR64 PC200 REQ64 CC2538 PDF

    intel 80219

    Abstract: XScale 80219
    Text: Intel 80219 General Purpose PCI Processor Datasheet Extended Temperature Support Product Features • ■ ■ ■ Core Features — Integrated Intel XScale® Core — ARM* V5T Instruction Set — ARM V5E DSP Extensions — 400 MHz and 600 MHz — Write Buffer, Write-back Cache


    Original     		64-bit/66 --64-bit/133 32-bit 64-bit --PC200 VCC33 intel 80219 XScale 80219 PDF

    BGA 6x6 tray

    Abstract: daewon tray tray bga 6x6 PAR64 PC200 REQ64 daewon bga
    Text: Intel 80321 I/O Processor Datasheet Advance Information Product Features • ■ ■ ■ Core Features — Integrated Intel® XScale Core — ARM* V5T Instruction Set — ARM V5E DSP Extensions — 400 MHz and 600 MHz — Write Buffer, Write-back Cache


    Original     		64-bit/66MHz --64-bit/133MHz 32-bit 64-bit --PC200 VCC33 BGA 6x6 tray daewon tray tray bga 6x6 PAR64 PC200 REQ64 daewon bga PDF

    PCE-5

    Abstract: Intel 80321 P5 microarchitecture CC2538 BGA 6x6 tray daewon AE23 PAR64 PC200 544LE
    Text: Intel 80321 I/O Processor Datasheet Product Features • ■ ■ ■ Core Features — Integrated Intel® XScale Core — ARM* V5T Instruction Set — ARM V5E DSP Extensions — 400 MHz and 600 MHz — Write Buffer, Write-back Cache PCI Bus Interface


    Original     		64-bit/66 --64-bit/133 32-bit 64-bit --PC200 VCC33 PCE-5 Intel 80321 P5 microarchitecture CC2538 BGA 6x6 tray daewon AE23 PAR64 PC200 544LE PDF

    16 pin 2x25, 2mm pitch header connectors

    Abstract: 10118072 8609 396 81 VCSEL array HDMI FPC high speed 6G connector 10112633-101LF electronic passive components catalog PCI x16 footprint fingers sfp 2x3 fci round shell connector
    Text: 01-2 + 封底 FCI_G5_Couverture_4p-G1.pdf 1 2012-2-7 11:32:32 C M Y CM MY CY CMY ELXOVERVIEW0112EA4 Printed on recyclable paper K ０２＿ｃｏｎｎｅｃｔｏｒ．ｐｄｆ １ ２０１２－１－２０ １０：３６：００


    Original     		10056265122ABTLF 10047129118ABTLF 10055606110ABTLF 10053826100ABTLF 10055262100BBTLF 10056422122BBTLF ELXOVERVIEW0512EA4 16 pin 2x25, 2mm pitch header connectors 10118072 8609 396 81 VCSEL array HDMI FPC high speed 6G connector 10112633-101LF electronic passive components catalog PCI x16 footprint fingers sfp 2x3 fci round shell connector PDF

    schematic diagram inverter lcd monitor dell

    Abstract: hp laptop charging CIRCUIT diagram dell laptop battery pinout DELL laptop inverter board schematic hp laptop battery pinout testing motherboards using multi meter hp laptop ac adapter schematics diagram circuit diagram of smps dell "full hd" mobile phone camera pinout schematic diagram electrical BIKES USING DC MOTOR
    Text: 2. MDmesh II for lighting 3. STV200N55F3 / STV250N55F3 High-current power MOSFETs 4. 2STCxxx / 2STAxxx High-end audio power bipolars 5. STP03D200 2 kV Darlington 6. 2200 V ESBTs 7. RF power design kits 8. USBULC6-2M6 Protection for USB 2.0 9. EMIF06-AUD01F2


    Original     		STV200N55F3 STV250N55F3 STP03D200 EMIF06-AUD01F2 EMIF10-LCD03F3 CPL-WB-00C2 STCC08 ETP01-1621 STCF06 ST715 schematic diagram inverter lcd monitor dell hp laptop charging CIRCUIT diagram dell laptop battery pinout DELL laptop inverter board schematic hp laptop battery pinout testing motherboards using multi meter hp laptop ac adapter schematics diagram circuit diagram of smps dell "full hd" mobile phone camera pinout schematic diagram electrical BIKES USING DC MOTOR PDF