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    TRAY BGA 9X9 Search Results

    TRAY BGA 9X9 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417750RBP240DV Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP240 Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP200V Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    D6417709SHF200BV Renesas Electronics Corporation 32-bit Microcontrollers, HFQFP, /Tray Visit Renesas Electronics Corporation
    7MMV4101S10BGI Renesas Electronics Corporation 128K X 24 MCM BGA 3.3 Visit Renesas Electronics Corporation

    TRAY BGA 9X9 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    tray 20 x 14

    Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
    Text: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type


    Original     		E04102 tray 20 x 14 BGA 31 x 31 tray bga trays tray bga 17 bga tray PDF

    smd transistor mark E13

    Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4 PDF

    LGA 1156 PIN OUT diagram

    Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9 PDF

    "0.4mm" bga "ball collapse" height

    Abstract: Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST
    Text: Application Report SPRAA99 – March 2008 nFBGA Packaging Robert Furtaw . ABSTRACT This application report gives you technical background on nFBGA packages and


    Original     		SPRAA99 "0.4mm" bga "ball collapse" height Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST PDF

    vqfp100 package

    Abstract: TO220CP-3 TQFP128U SOP8 package tray VSOF5 TQFP176U TSSOP-B8J TSSOP-B14 tl 32 icp VQFP100
    Text: Product Designation Company info Page 1 of 2 Products > LSIs Lineup • LSI Packages > Product Designation Sales Products LSIs ROHM LSI Solution General-purpose LSIs Mobile Phone LSIs Product Designation •When ordering, specify the part number. •Check each code against the tables shown below.


    Original     		copyQFP80V, HTQFP64V UQFP64, UQFP80, UQFP100, TQFP64U, TQFP80U, TQFP100U UQFP120, TQFP128U vqfp100 package TO220CP-3 SOP8 package tray VSOF5 TQFP176U TSSOP-B8J TSSOP-B14 tl 32 icp VQFP100 PDF

    MD300-10A

    Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
    Text: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case


    Original     		P22C-100-300A-1 P8C-100-300B P-DIP8-0300-2 MD300-2A P8CT-100-300B2-1 MD300-1A P8C-100-300A-1 X13769XJ2V0CD00 MD300-10A P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1 PDF

    21x21

    Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
    Text: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。


    Original     		P22C100300A1 P8C-100-300B P8CT-100-300B2-1 P8C-100-300A-1 P-DIP8-0300-2 MD300-2A MD300-1A MD300-09A 21x21 MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1 PDF

    vqfp100 package

    Abstract: TQFP128U SSOP-A20 Contact Image Sensor VQFP100
    Text: Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request


    Original     		descrQFP80V, HTQFP64V UQFP64, UQFP80, UQFP100, TQFP64U, TQFP80U, TQFP100U UQFP120, TQFP128U vqfp100 package SSOP-A20 Contact Image Sensor VQFP100 PDF

    oki qfp tray

    Abstract: 1000H ED-4701 72 ball w-csp SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY wcsp reliability FBGA tray mobile phone
    Text: Oki’s Wafer Level Chip Size Packaging Technology 1 W-CSP 12/02 The Market’s Requirement for a New Packaging Technology • The need for increased functionality, smaller device size and lower costs are major challenges for today’s design engineers < •


    Original     		30min 30min 1000H 100cyc 300cyc 500cyc ED-4701 oki qfp tray 1000H ED-4701 72 ball w-csp SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY wcsp reliability FBGA tray mobile phone PDF

    IS43LR32640

    Abstract: is61wv5128 Product Selector Guide is42s86400 IS46R16160B IS25LD010 IS25LD025 IS25LQ IS62WV5128DALL BGA 168
    Text: To our valued customers, At ISSI we design, develop and market high performance integrated circuits for the following key markets: i automotive, (ii) communications, (iii) digital consumer, and (iv) industrial/medical/military. These key markets all require high quality and reliability, extended temperature ranges, and long-term support. Our primary products are high speed and


    Original     		i1-44-42218428 IS43LR32640 is61wv5128 Product Selector Guide is42s86400 IS46R16160B IS25LD010 IS25LD025 IS25LQ IS62WV5128DALL BGA 168 PDF

    AD5820

    Abstract: ad6548
    Text: Tape and Reel Packaging Introduction Specifications The electronics industry is making a tremendous investment in surfacemount technology. The reasons for this investment include cost savings resulting from automated component placement and increased density


    Original     		T03762-0-1/13 AD5820 ad6548 PDF

    R50-E2Y2-24

    Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
    Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.


    Original     		PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001 PDF

    8609 396 81

    Abstract: box header 2x10 right angle euro connectors 8609 8609 series Receptacle sca-2 40 pin to sata 16 pin 2x25, 2mm pitch header connectors pin pressure polarization controller euro connector 8609 PCI Express Straddle-Mount Card Edge Connector 51721-10002406AALF
    Text: ELECTRONICS CONNECTOR OVERVIEW FCI: SETTING THE STANDARD FOR CONNECTORS With 13,000 employees in 30 countries and sales of 1.25 billion euros in 2008, FCI is a leading manufacturer of connectors for various markets such as automotive, telecommunication infrastructures and consumer


    Original     		BG26100ABTLF 10055262100BBTLF 10056422122BBTLF 1003877422ALF 1004713018ALF 1005560710ALF 1005382700ALF 1005526300BLF 1005642322BLF ELXOVERVIEW0909EA4 8609 396 81 box header 2x10 right angle euro connectors 8609 8609 series Receptacle sca-2 40 pin to sata 16 pin 2x25, 2mm pitch header connectors pin pressure polarization controller euro connector 8609 PCI Express Straddle-Mount Card Edge Connector 51721-10002406AALF PDF

    Untitled

    Abstract: No abstract text available
    Text: AS3517 V17 Data Sheet, Confidential Data Sheet, Confidential AS3517 Stereo Audio Codec with enhanced System Power Management 1 General Description The AS3517 is a low power stereo audio codec and is designed for Portable Digital Audio Applications. It allows


    Original     		AS3517 AS3517 10channel AS3517. PDF

    CTBGA81

    Abstract: No abstract text available
    Text: austriamicrosystems AG is now ams AG The technical content of this austriamicrosystems datasheet is still valid. Contact information: Headquarters: ams AG Tobelbaderstrasse 30 8141 Unterpremstaetten, Austria Tel: +43 0 3136 500 0 e-Mail: ams_sales@ams.com


    Original     		AS3517 AS3517 CTBGA81 PDF

    OMAP5430

    Abstract: OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba
    Text: Version F EL I M Data Manual IN Multimedia Device Engineering Samples 2.0 AR OMAP5430 Public Version PR ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.


    Original     		OMAP5430 SWPS052F OMAP5430 OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba PDF

    SMD LTYN

    Abstract: ic 4440 40w amplifier 12v ltls e3 Weston 2281 thermometer LT3060ITS8 Transistor SR 6863 TO-126 LTC3855EUH-1 LTPG e3 5Dx diode SMD LTABA
    Text: November 2009 Product Selection Guide Amplifiers Data Converters Linear Regulators Switching Regulators µModule DC/DC Converters Battery Chargers LED Drivers Hot Swap Interface Filters RF/Wireless Silicon Oscillators Comparators Supervisory Circuits References


    Original     		D-59387 D-73230 1-800-4-LINEAR SMD LTYN ic 4440 40w amplifier 12v ltls e3 Weston 2281 thermometer LT3060ITS8 Transistor SR 6863 TO-126 LTC3855EUH-1 LTPG e3 5Dx diode SMD LTABA PDF

    Arduino Mega2560

    Abstract: 13001 S 6D TRANSISTOR arduino uno rev 3 agilent optical encoder 9988 MZ 13001 TRANSISTOR arduino mega 2650 skiip 613 gb 123 ct arduino sound sensor module pic arduino nano mc34063l
    Text: ND3% BASE1 XXXX2108-0010-1-P 10 TSQ: 3001 CMS: CMS-USM TS host OP: NN COMP: 15-07-11 Hour: 13:07 TS:TS date TS time MCUS, MPUS, DSPS & DEVELOPMENT TOOLS Find Datasheets Online 8-BIT MCUS & DEVELOPMENT TOOLS 1 PSoC 3 DEVELOPMENT KITS ARDUINO MCU DEVLOPMENT PLATFORM


    Original     		CY8C38 CY8C29 incl795 12T9797 12T9804 12T9803 12T9800 12T9802 12T9801 12T9805 Arduino Mega2560 13001 S 6D TRANSISTOR arduino uno rev 3 agilent optical encoder 9988 MZ 13001 TRANSISTOR arduino mega 2650 skiip 613 gb 123 ct arduino sound sensor module pic arduino nano mc34063l PDF

    220v AC voltage stabilizer schematic diagram

    Abstract: LG color tv Circuit Diagram tda 9370 1000w inverter PURE SINE WAVE schematic diagram schematic diagram atx Power supply 500w TV SHARP IC TDA 9381 PS circuit diagram wireless spy camera 9744 mini mainboard v1.2 sony 279-87 transistor E 13005-2 superpro lx
    Text: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 AD9272 Analog Front End, iMEMS Accelerometers & Gyroscopes . . . . . . 782, 2583 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-528 Acceleration and Pressure Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . Page 2585


    Original     		AD9272 P462-ND LNG295LFCP2U P463-ND LNG395MFTP5U 220v AC voltage stabilizer schematic diagram LG color tv Circuit Diagram tda 9370 1000w inverter PURE SINE WAVE schematic diagram schematic diagram atx Power supply 500w TV SHARP IC TDA 9381 PS circuit diagram wireless spy camera 9744 mini mainboard v1.2 sony 279-87 transistor E 13005-2 superpro lx PDF