JEDEC TRAY DIMENSIONS
Abstract: JEDEC tray standard JEDEC tray standard 13 tsop Shipping Trays 32 jedec tray Shipping Trays jedec tray 32 0925D
Text: TRAY SPECIFICATIONS 32-pin TSOP-I Package Tray Critical Dimensions TEMP. RATING A B NOTES: 1. Surface electric resistivity of tray ranges from: < 1E+7 Ohm/sq. 2. The molded tray’s material shall be rigid enough to avoid damage to the components during handling, loading,
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32-pin
865495TG5
T944G
545-FRAM,
JEDEC TRAY DIMENSIONS
JEDEC tray standard
JEDEC tray standard 13
tsop Shipping Trays
32 jedec tray
Shipping Trays
jedec tray 32
0925D
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JEDEC TRAY DIMENSIONS
Abstract: JEDEC tray standard tsop Shipping Trays tsop-ii tray RAMTRON T944
Text: TRAY SPECIFICATIONS 44-pin TSOP-II Package Tray Critical Dimensions A B NOTES: 1. Surface electric resistivity of tray ranges from: 1E+5 to 1E+12 Ohm/sq. 2. The molded tray’s material shall be rigid enough to avoid damage to the components during handling, loading,
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44-pin
865495TG5
T944G
545-FRAM,
JEDEC TRAY DIMENSIONS
JEDEC tray standard
tsop Shipping Trays
tsop-ii tray
RAMTRON
T944
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DAEWON tray drawing
Abstract: 124-48LD-119 DAEWON JEDEC TRAY daewon 1EC-08LD-919 Kostat tray daewon tray FBGA tray kostat Kostat TSOP Tray KS8503
Text: Chapter 5 Trays CHAPTER 5 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers Tray Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 5-1 Chapter 5 Trays INTRODUCTION Trays are used instead of tubes to protect
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Kostat tray
Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher
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and5-741-9148
Kostat tray
KS-8308
CAMTEX
Kostat
DAEWON tray 48
DAEWON tray drawing
JEDEC Kostat
CERAMIC PIN GRID ARRAY CPGA AMD
daewon
D-12G-56LD-A13
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pd0008
Abstract: tray 8 x 8 TSOP TRAY 40 PIN TSOP package tray N1N213 Package and Packing Information ST
Text: PD0008 Packing information Tray for TSOP packages type 1 Introduction TSOP type-1 packages can be supplied in tray packing. Refer to Table 1 for the list of TSOP type-1 packages supplied in trays. The objective of this document is provide a detailed description of the tray. It applies to all
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PD0008
105cm.
PD0008
tray 8 x 8
TSOP TRAY 40 PIN
TSOP package tray
N1N213
Package and Packing Information ST
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Package tray
Abstract: OT-007TM-01 PPO datasheet jedec Package QFP JEDEC tray JEDEC tray
Text: 77.46 29.22 135.9 OT-007TM-01 UNIT : mm A 50.56 31.10 A' 252.8 315 322.6 <SECTION A - A'> 4.12 7.62 6.35 39.57 48.8 Tray Material Heat Proof Temp. Surface resistance OT-007TM-01 JEDEC Tray Carbon PPO 125°C less than 1x106Ω / Applied Package Quantity(PCS)
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OT-007TM-01
Package tray
OT-007TM-01
PPO datasheet
jedec Package
QFP JEDEC tray
JEDEC tray
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PDF
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JEDEC TRAY DIMENSIONS
Abstract: JEDEC tray standard OT-007TM-01 JEDEC tray QFP JEDEC tray JEDEC tray standard 10 TRAY MATERIAL
Text: 39.57 135°C MAX 77.46 29.22 135.9 OT-007TM-01 UNIT : mm A 50.56 31.10 A' 39.57 252.8 315 322.6 <SECTION A - A'> 4.12 6.35 7.62 39.57 48.8 Tray OT-007TM-01 (JEDEC Tray) Material Carbon PPO Heat Proof Temp. Surface resistance 135°C 12 less than 1 x 10 Ω /
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OT-007TM-01
JEDEC TRAY DIMENSIONS
JEDEC tray standard
OT-007TM-01
JEDEC tray
QFP JEDEC tray
JEDEC tray standard 10
TRAY MATERIAL
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LA-072
Abstract: PGA JEDEC tray 216-0016
Text: Packing Name NEC Tray LA-072 JEDEC Tray PGA 21x21 528 pin Ceramic PGA Seam Weld A D (Bottom View) J I G H Index mark Orientation pin N K L φM E M F NOTE Each lead centerline is located within φ 0.254 mm (φ 0.010 inch) of its true position (T.P.) at maximum material condition.
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LA-072
X528R-50A1
LA-072
PGA JEDEC tray
216-0016
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PGA weight
Abstract: jedec bottom LA-072 PGA JEDEC tray
Text: Packing Name NEC Tray LA-072 JEDEC Tray PGA 21x21 528 pin Ceramic PGA Seam Weld (Bottom View) A D Index mark Index mark I V W L φM M F E G J NOTE Each lead centerline is located within φ 0.254 mm (φ 0.01 inch) of its true position (T.P.) at maximum material condition.
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LA-072
X528R-50A-1
PGA weight
jedec bottom
LA-072
PGA JEDEC tray
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PGA weight
Abstract: PGA JEDEC tray
Text: Packing Name NEC Tray LA-A76 JEDEC Tray PGA 20x20 447 pin Ceramic PGA Seam Weld A B D P C Q (Bottom View) R H G S T J I Index mark K L φM N E M F NOTE Each lead centerline is located within φ 0.254 mm (φ 0.010 inch) of its true position (T.P.) at maximum material condition.
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LA-A76
061MAX.
X447RJ-50A
PGA weight
PGA JEDEC tray
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QFP JEDEC tray
Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A68A-1 ST-TQ242414TJ-1 160 pin QFP 24 x 24 Terminal Spacing Linear = 0.5 A B 81 80 120 121 detail of lead end C D S Q 41 40 160 1 F G H I M J P K N NOTE S160GM-50-8ED-2 EIAJ CODE Weight (Reference Value)
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LA-3A68A-1
ST-TQ242414TJ-1
00nch)
S160GM-50-8ED-2
QFP JEDEC tray
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240-pin
Abstract: LA-3522A-1
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3522A-1 MQFP 32x32 3.2mm 240 pin QFP 32 × 32 Terminal Spacing Linear = 0.5 A B 180 181 121 120 detail of lead end S C D R Q 240 1 F G 61 60 H I J M P K M N S L NOTE ITEM 1. Controlling dimention millimeter.
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LA-3522A-1
P240GN-50-LMU,
240-pin
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PDF
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13x13
Abstract: nec 13A JEDEC tray standard SSD-A-H7551-1 FBGA13x13A JEDEC TRAY 10 X 10 TRAY DIMENSIONS JEDEC TRAY DIMENSIONS
Text: TRAY CONTAINER UNIT : mm 8x19=152 135.9 112.0 PPE A A 11.95 13.50 16.00 135°CMAX NEC FBGA13×13A 16.15 13.50 290.7 315.0 322.6 12.15 <SECTION A-A> 13.5±0.05 (6.03) 7.62 5.62 13.00 Applied Package Quantity(pcs) 144-pin Plastic FBGA(13x13) Tray Material
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FBGA13
144-pin
13x13)
152MAX.
456-pin
FBGA13x13A
SSD-A-H7551-1
13x13
nec 13A
JEDEC tray standard
SSD-A-H7551-1
FBGA13x13A
JEDEC TRAY 10 X 10
TRAY DIMENSIONS
JEDEC TRAY DIMENSIONS
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nec 2565
Abstract: NEC C 324 C 2565 nec nec 1026 JEDEC TRAY DIMENSIONS BGA package tray tray bga
Text: TRAY CONTAINER 135°C MAX 19.65 NEC 102.6 A' 16.65 25.65 FBGA 19x19A A 19.65 22.00 286.0 14.50 315.0 322.6 SECTION A-A' (5.62) (5.80) 19.65 19.00 7.62 135.9 PPE 5×14=70 UNIT : mm Applied Package Quantity (pcs) 324-pin Plastic BGA (19×19) 70 MAX. Tray
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324-pin
BGA19
SSD-A-H7599
nec 2565
NEC C 324 C
2565 nec
nec 1026
JEDEC TRAY DIMENSIONS
BGA package tray
tray bga
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676 BGA package tray
Abstract: BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray
Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 7 135°C MAX. 27.50 29.20 262.8 315.0 322.6 26.10 Section A – A' 27.50 27.00 (5.95) (6.35) 7.62 27.50 29.20 87.6 BGA27×27ESP A' 24.15 135.9 PPE A Applied Package Quantity (pcs) Tray BGA27×27ESP 225-pin Plastic BGA (27×27)
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BGA27
27ESP
225-pin
256-pin
272-pin
316-pin
320-pin
352-pin
676 BGA package tray
BGA package tray
NEC 2415
tray bga
676-Pin
596-PIN
27ES
jedec tray BGA
tray datasheet bga
BGA JEDEC tray
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fBGA package tray
Abstract: JEDEC FBGA FBGA tray JEDEC TRAY DIMENSIONS FBGA NEC 208pin FBGA JEDEC tray JEDEC tray standard
Text: TRAY CONTAINER 110.1 A A' 7 135°C MAX 15.74 18.35 FBGA15x15ESP 12.90 NEC 135.9 PPE 7×17=119 Unit : mm 15.74 18.10 289.6 12.70 315.0 322.6 SECTION A – A' 15.74 (5.91) 5.62 7.62 15.00 Applied Package Quantity(PCS) Tray FBGA 15×15ESP 176-pin PLASTIC FBGA (15×15)
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FBGA15
15ESP
176-pin
208-pin
273-pin
362-pin
385-pin
SSD-A-H7025-3
fBGA package tray
JEDEC FBGA
FBGA tray
JEDEC TRAY DIMENSIONS FBGA
NEC 208pin
FBGA JEDEC tray
JEDEC tray standard
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fBGA package tray 12
Abstract: JEDEC TRAY DIMENSIONS FBGA JEDEC FBGA 236-PIN fBGA package tray FBGA-10 FBGA10 236PIN 277-PIN
Text: TRAY CONTAINER NEC A' 10.65 7 135°C MAX. 12.80 A FBGA10x10ESP 10.35 135.9 115.2 PPE 10×24=240 UNIT : mm 10.65 12.80 10.30 294.4 315.0 322.6 SECTION A – A' 10.65 (5.95) (5.62) 7.62 10.00 Applied Package Quantity (pcs) FBGA10×10 ESP Tray 113-pin Plastic FBGA (10×10)
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FBGA10
10ESP
113-pin
161-pin
236-pin
277-pin
289-pin
SSD-A-H6961-4
fBGA package tray 12
JEDEC TRAY DIMENSIONS FBGA
JEDEC FBGA
fBGA package tray
FBGA-10
236PIN
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fBGA package tray
Abstract: No abstract text available
Text: TRAY CONTAINER NEC 119.6 7 FBGA8x6ESP 135°C MAX. A' 6.50 9.20 A 8.50 10.60 296.8 9.10 315.0 322.6 8.50 8.00 (5.62) (5.91) Section A – A' 7.62 8.15 135.9 PPE 14×29=406 UNIT : mm Applied Package 48-pin Plastic FBGA (8×6) Quantity (pcs) 406 MAX. Tray
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48-pin
SSD-A-H7792
fBGA package tray
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IC TRAY
Abstract: IC 8898 8641 6 pin ic
Text: M55 Sect 7 p104-115 M 10/15/06 4:09 PM Page 114 ANTI-STATIC IC TRAY CLIP The unique color coded Anti-Static IC Tray Clip, is a patent pending design and can be used for the following applications: .067 [1.70] .394 [10.0] .205 [5.21] .197 [5.00] .185 [4.7]
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8641 6 pin ic
Abstract: ic tray 8641 sot23-6
Text: M60 Section 7 FREV2:11-2011 11/20/11 2:46 PM Page 122 ANTI-STATIC IC TRAY CLIP The unique color coded Anti-Static IC Tray Clip, is a patent pending design and can be used for the following applications: .075 [1.90] .394 [10.0] .205 [5.2] .197 [5.01] .185 [4.7]
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray Name LA-3508A-1 JEDEC Tray OT-001T-01 160 pin QFP 28 x 28 Terminal Spacing Linear = 0.65 A B 120 121 81 80 detail of lead end C S D R Q 41 40 160 1 F G P H I M J K M N NOTE ITEM Each lead centerline is located within 0.13 mm (0.005 inch) of
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LA-3508A-1
OT-001T-01
S160GD-65-LGD,
S160GD-65-LGD
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NEC 2701
Abstract: 144 pin qfp 2701 NEC B108 JEDEC tray dimension NEC 596 S144GJ-50-3EN-3
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3519A-1 LA-0519A-1 MQFP 20x20 2.7mm 144 pin QFP 20 × 20 Terminal Spacing Linear = 0.5 A B 108 109 73 72 detail of lead end S C D R Q 144 1 37 36 F G H I J M K P S N S L NOTE 1. Controlling dimension millimeter.
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LA-3519A-1
LA-0519A-1
S144GJ-50-3EN-3
SC-596-A*
NEC 2701
144 pin qfp
2701 NEC
B108
JEDEC tray dimension
NEC 596
S144GJ-50-3EN-3
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216-pin
Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A68A-1 ST-TQ242414TJ-1 216 pin QFP 24 x 24 Terminal Spacing Linear = 0.4 A B 162 163 109 108 detail of lead end C D S R Q 216 1 F G 55 54 H I M P J K M N L NOTE Each lead centerline is located within 0.07 mm (0.003 inch) of
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LA-3A68A-1
ST-TQ242414TJ-1
S216GM-40-8EV
216-pin
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QFP40
Abstract: P304GL-50-NMU JEDEC TRAY mQFP
Text: Mounting Pad Packing Name NEC Tray LA-A41A JEDEC Tray MQFP 40x40 3.7mm 304 pin QFP 40 × 40 Terminal Spacing Linear = 0.5 A B 228 229 153 152 detail of lead end S C D R Q 77 76 304 1 F G H I J M P K M N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of
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LA-A41A
SC-601-C*
P304GL-50-NMU,
QFP40
P304GL-50-NMU
JEDEC TRAY mQFP
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