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    TSOP 54 PACKAGE Search Results

    TSOP 54 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    TSOP 54 PACKAGE Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    TSOP 54 Package Unknown Scan PDF

    TSOP 54 PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    54-pin

    Abstract: TSOP 54 Package TSOP 54 II
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 500 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54-M01) 54-pin plastic TSOP (II) (FPT-54P-M01)


    Original     		FPT-54P-M01 54-pin FPT-54-M01) FPT-54P-M01) F54001S-2C-1 TSOP 54 Package TSOP 54 II PDF

    TSOP 86 Package

    Abstract: A11E 128MB PC266 TSOP 54 Package 4mx32 TSOP 400 86 TSOP 54 PIN tsop 66 TSOP 66 Package ddr 240 pin
    Text: 1999 DRAM Design Guidelines Options Package Width Data Rate Voltage I/O 16Mb 64Mb 128Mb 256Mb Clock MHz 1 54 TSOP x4 SDR 3.3V LVTTL na 16Mx4 32Mx4 64Mx4 PC100/133 2 54 TSOP x8 SDR 3.3V LVTTL na 8Mx8 16Mx8 32Mx8 PC100/133 3 54 TSOP x16 SDR 3.3V LVTTL na 4Mx16 8Mx16 16Mx16


    Original     		128Mb 256Mb 16Mx4 32Mx4 64Mx4 PC100/133 16Mx8 32Mx8 4Mx16 TSOP 86 Package A11E 128MB PC266 TSOP 54 Package 4mx32 TSOP 400 86 TSOP 54 PIN tsop 66 TSOP 66 Package ddr 240 pin PDF

    TSOP 54 Package

    Abstract: TSOP 54 PIN 54-PIN TSOP II 54 Package
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE 54 PIN PLASTIC FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80mm Package width 500mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M01) * : Resin protrusion. (Each side : 0.15 (.006) Max) 54-pin plastic TSOP (II)


    Original     		FPT-54P-M01 500mil 54-pin FPT-54P-M01) F54001S-2C-1 TSOP 54 Package TSOP 54 PIN TSOP II 54 Package PDF

    54-PIN

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC FPT-54P-M02 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M02) 54-pin plastic TSOP (II) (FPT-54P-M02)


    Original     		FPT-54P-M02 54-pin FPT-54P-M02) F54003S-1C-1 PDF

    MT48LC16M8A2BB

    Abstract: No abstract text available
    Text: 128Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC32M4A2 – 8 Meg x 4 x 4 Banks MT48LC16M8A2 – 4 Meg x 8 x 4 Banks MT48LC8M16A2 – 2 Meg x 16 x 4 Banks Features Options • Plastic package – OCPL2 – 54-pin TSOP II 400 mil – 54-pin TSOP II (400 mil) Pb-free


    Original     		128Mb: MT48LC32M4A2 MT48LC16M8A2 MT48LC8M16A2 54-pin 60-ball 54-ball MT48LC16M8A2BB PDF

    MT48LC16M8A2BB

    Abstract: No abstract text available
    Text: 128Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC32M4A2 – 8 Meg x 4 x 4 Banks MT48LC16M8A2 – 4 Meg x 8 x 4 Banks MT48LC8M16A2 – 2 Meg x 16 x 4 Banks Features Options • Plastic package – OCPL2 – 54-pin TSOP II 400 mil – 54-pin TSOP II (400 mil) Pb-free


    Original     		128Mb: MT48LC32M4A2 MT48LC16M8A2 MT48LC8M16A2 PC100- PC133-compliant 4096-cycle 09005aef8091e66d x4x8x16 MT48LC16M8A2BB PDF

    TSOP 54 Package

    Abstract: TSOP 54 Package used in where TSOP 54 PIN TSOP II 54 Package TSOP 54 II 54-PIN
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC To Top / Package Lineup / Package Index FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 500 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54-M01)


    Original     		FPT-54P-M01 54-pin FPT-54-M01) FPT-54P-M01) F54001S-2C-1 TSOP 54 Package TSOP 54 Package used in where TSOP 54 PIN TSOP II 54 Package TSOP 54 II PDF

    TSOP II 54

    Abstract: TSOP II 54 Package 54PIN 54P3G-C
    Text: 54P3G-C Plastic 54pin 400mil TSOP II (LOC) EIAJ Package Code TSOP II 54-P-400-0.80 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 F 54 E Recommended Mount Pad Symbol 1 A 27 D e L c L1 HE ME l2 28 y b A2 Detail F A A1 A2 b c D E e HE L L1 y A1 ME I2


    Original     		54P3G-C 54pin 400mil 54-P-400-0 TSOP II 54 TSOP II 54 Package 54P3G-C PDF

    TSOP 54 Package

    Abstract: TSOP 54 Package used in where 54-PIN TSOP 54 PIN
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC To Top / Package Lineup / Package Index FPT-54P-M02 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M02)


    Original     		FPT-54P-M02 54-pin FPT-54P-M02) F54003S-1C-1 TSOP 54 Package TSOP 54 Package used in where TSOP 54 PIN PDF

    TSOP 86 Package

    Abstract: TSOP 54 tray TSOP package tray TSOP 54 Package TSOP 54 PIN TSOP 66 Package JEDEC tray standard tsop TSOP II 54 Package tsop 66 tsop package
    Text: TRAY CONTAINER UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. A' 11.8 14.00 12.00 TSOP 2 400MIL22 135.9 9¥12=108 A 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 7.62 (6.35) 21.80 16.50 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)


    Original     		400MIL22 54-pin 66-pin 86-pin SSD-A-H6023-4 TSOP 86 Package TSOP 54 tray TSOP package tray TSOP 54 Package TSOP 54 PIN TSOP 66 Package JEDEC tray standard tsop TSOP II 54 Package tsop 66 tsop package PDF

    TSOP 86 Package

    Abstract: TSOP 54 tray TSOP 54 Package TSOP 66 Package TSOP II 54 Package TSOP 62 Package JEDEC tray standard tsop TSOP package tray
    Text: UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. 14.00 12.00 TSOP 2 400MIL22 135.9 9x12=108 A A' 11.8 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 (6.35) 7.62 21.8 16.5 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)(400mil)


    Original     		400MIL22 54-pin 400mil) 66-pin 86-pin TSOP 86 Package TSOP 54 tray TSOP 54 Package TSOP 66 Package TSOP II 54 Package TSOP 62 Package JEDEC tray standard tsop TSOP package tray PDF

    54-P-400-0

    Abstract: No abstract text available
    Text: TSOP 2 54-P-400-0.80-K Mirror finish Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating( 5 m) 0.55 TYP. 2/Aug.14,1997


    Original     		54-P-400-0 PDF

    Untitled

    Abstract: No abstract text available
    Text: TSOP 2 54-P-400-0.80-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.55 TYP. 1/Aug. 14, 1997


    Original     		54-P-400-0 PDF

    TSOP 54 Package

    Abstract: No abstract text available
    Text: EDS1216AGTA Package Drawing 54-pin Plastic TSOP ll Unit: mm 22.22 ± 0.10 A 10.16 28 PIN#1 ID 1 11.76 ± 0.20 54 27 B 0.80 0.25 to 0.45 0.16 M S A B 0.80 Nom 0.91 max. 0.25 0.10 +0.08 −0.05 0.10 S 0.09 to 0.21 S 1.2 max. 1.0 ± 0.05 0 to 8° 0.40 to 0.75


    Original     		EDS1216AGTA 54-pin ECA-TS2-0168-01 E0847E10 TSOP 54 Package PDF

    70-pin

    Abstract: No abstract text available
    Text: 70P3S-M Plastic 70pin 400mil TSOP EIAJ Package Code TSOP II 70/68-P-400-0.65 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 1 17 35 Recommended Mount Pad E Symbol 54 70 52 36 A c L D L1 HE ME 19 I2 F e y b A2 Detail F A1 A A1 A2 b c D E e HE L L1


    Original     		70P3S-M 70pin 400mil 70/68-P-400-0 70-pin PDF

    TSOP II 54

    Abstract: TSOP 54 Package tsop-54 54P3G-C 54PIN TSOP 54PIN
    Text: E HE 1 54 e EIAJ Package Code TSOP II 54-P-400-0.80 D JEDEC Code – y Weight g b 27 28 F Lead Material Alloy 42 L1 Detail F A2 A c A1 b2 ME I2 b2 A A1 A2 b c D E e HE L L1 y Symbol Mar.’98 Dimension in Millimeters Min Nom Max – – 1.2 0.125 0.2 0.05


    Original     		54-P-400-0 54pin 400mil 54P3G-C TSOP II 54 TSOP 54 Package tsop-54 54P3G-C TSOP 54PIN PDF

    Untitled

    Abstract: No abstract text available
    Text: GMM26417233ATG 16,777,216 WORDS x64bit LG Semicon Co.,Ltd. Description The GMM26417233ATG is a 16M x 64bits Synchronous Dynamic RAM MODULE which is assembled 8 pieces of 16M x 8bits Synchronous DRAMs in 54 pin TSOP II package and one 2048 bit EEPROM in 8pin


    OCR Scan     		GMM26417233ATG x64bit GMM26417233ATG 64bits M26417233AT PDF

    Untitled

    Abstract: No abstract text available
    Text: GMM27317233ATG 16,777,216 WORDS x72BIT LG Semicon Co.,Ltd. Description The GMM27317233ATG is a 16M x 72bits Synchronous Dynamic RAM MODULE which is assembled 9 pieces of 16M x 8bits Synchronous DRAMs in 54 pin TSOP II package and one 2048 bit EEPROM in 8pin


    OCR Scan     		GMM27317233ATG x72BIT GMM27317233ATG 72bits GMM27317233AT PDF

    Untitled

    Abstract: No abstract text available
    Text: GMM27317230ATG LG Semicon Co.,Ltd. Description 16,777,216 WORDS x72BIT SYNCHRONOUS DYNAMIC RAM MODULE Features The GMM27317230ATG is a 16M x 72bits Synchronous Dynamic RAM MODULE which is assembled 9 pieces of 16M x 8bits Synchronous DRAMs in 54 pin TSOP II


    OCR Scan     		GMM27317230ATG 72bits 7317230A GMM27317230ATG PDF

    EDS2516APTA-75TI-E

    Abstract: EDS2516APTA-TI-E
    Text: DATA SHEET 256M bits SDRAM WTR Wide Temperature Range EDS2516APTA-TI-E (16M words x 16 bits) Specifications Pin Configurations • Density: 256M bits • Organization ⎯ 4M words × 16 bits × 4 banks • Package: 54-pin plastic TSOP (II) ⎯ Lead-free (RoHS compliant)


    Original     		EDS2516APTA-TI-E 54-pin 133MHz cycles/64ms M01E0107 E0677E20 EDS2516APTA-75TI-E EDS2516APTA-TI-E PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET 64M bits SDRAM WTR Wide Temperature Range EDS6416AJTA-TI (4M words x 16 bits) Specifications Pin Configurations • Density: 64M bits • Organization ⎯ 1M words × 16 bits × 4 banks • Package: 54-pin plastic TSOP (II) ⎯ Lead-free (RoHS compliant)


    Original     		EDS6416AJTA-TI 54-pin 133MHz cycles/64ms M01E0107 E0885E10 PDF

    Untitled

    Abstract: No abstract text available
    Text: GMM26433233ANTG 33,554,432 WORDS x64bit SYNCHRONOUS DYNAMIC RAM MODULE LG Sem icon Co.,Ltd. Description The GMM26433233ANTG is a 32M x 64bits Synchronous Dynamic RAM MODULE which is assembled 16 pieces of 16M x 8bits Synchronous DRAMs in 54 pin TSOP II package and one 2048 bit EEPROM


    OCR Scan     		x64bit GMM26433233ANTG GMM26433233ANTG 64bits 133/PC 100/PC66 PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET 64M bits SDRAM WTR Wide Temperature Range EDS6416AJTA-TI (4M words x 16 bits) Specifications Pin Configurations • Density: 64M bits • Organization  1M words × 16 bits × 4 banks • Package: 54-pin plastic TSOP (II)  Lead-free (RoHS compliant)


    Original     		EDS6416AJTA-TI 54-pin 133MHz cycles/64ms M01E0107 E0885E10 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATA SHEET 128M bits SDRAM WTR Wide Temperature Range EDS1216AHTA-LI (8M words x 16 bits) Specifications Pin Configurations • Density: 128M bits • Organization  2M words × 16 bits × 4 banks • Package: 54-pin plastic TSOP (II)  Lead-free (RoHS compliant)


    Original     		EDS1216AHTA-LI 54-pin 133MHz cycles/64ms M01E0706 E1161E20 PDF