Untitled
Abstract: No abstract text available
Text: c Mounting pad of TSOP (type I) The nominal dimensions of the TSOP (thin small outline package) (type I) are determined by the combination of the width of the plastic body (E) and the total length (HD). For example, “32-pin 8 x 20 TSOP (type I)” means that the package width is 8 mm, and that the total
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32-pin
P28GW-55-9JL-1
P28GW-55-9KL-1
S32GX-50-EJA-1
S32GX-50-EKA-1
S32GZ-50-KJH-3
S32GZ-50-KKH-3
P32GU-50-9JH
P32GU-50-9KH
S40GZ-50-LJH-2
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cel-9200
Abstract: Cypress 140C 8361H CEL9200 JESD22 128H copper bond wire
Text: Cypress Semiconductor Qualification Report QTP# 97175 VERSION 1.0 June, 1997 28 Ld TSOP Package Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: TSOP QTP# 97175, V. 1.0 Page 2 of 4 June, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
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CEL9200
8361H
JESD22-A112
30C/60
CY7C199-ZC
cel-9200
Cypress
140C
8361H
CEL9200
JESD22
128H
copper bond wire
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Untitled
Abstract: No abstract text available
Text: Qualification Report October 1993, Version 1.0, QTP# 93275 Thin Small Outline Package 32 Lead TSOP Type 1 Dry packing required CYPRESS SEMICONDUCTOR PAGE 2 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: Lead Frame material: 32 Pins TSOP
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7C185FT
7B181
CY7B180/181)
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TSOP 48 thermal resistance
Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
Text: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate
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MS-024
TSOP 48 thermal resistance
TSOP 48 stacked die package
MS-024
MO-142
TSOP 32 thermal resistance
TSOP 48 package tray
MO-183
marking code 56l
jedec ms-024
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140C
Abstract: 8361H CEL9200 JESD22 copper bond wire
Text: Cypress Semiconductor Qualification Report QTP# 97173 VERSION 2.0 February, 1998 28 Ld TSOP Package 150 x 150 Pad Size Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: TSOP QTP# 97173, V. 2.0 Page 2 of 4 February, 1998
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CEL9200
8361H
JESD22-A112
85C/85
CY7C199-ZC
140C
8361H
CEL9200
JESD22
copper bond wire
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EME-7351
Abstract: 140C 8361H JESD22 sumitomo silver epoxy
Text: Cypress Semiconductor Qualification Report QTP# 97514 VERSION 1.0 July, 1998 28 Ld TSOP Package Sumitomo EME-7351 Molding Compound Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: 28 Ld TSOP QTP# 97514, V. 1.0 Page 2 of 4
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EME-7351
EME-7351
8361H
JESD22-A112
CY7C199-ZC
140C
8361H
JESD22
sumitomo silver epoxy
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NTGS3455T1
Abstract: NTGS3455T1G
Text: NTGS3455T1 MOSFET −3.5 Amps, −30 Volts P−Channel TSOP−6 Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available http://onsemi.com Applications V(BR)DSS
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NTGS3455T1
NTGS3455T1/D
NTGS3455T1
NTGS3455T1G
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NTGS3433T1
Abstract: NTGS3433T1G
Text: NTGS3433T1 MOSFET −3.3 Amps, −12 Volts P−Channel TSOP−6 http://onsemi.com Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available V(BR)DSS RDS(on) TYP
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NTGS3433T1
NTGS3433T1/D
NTGS3433T1
NTGS3433T1G
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Untitled
Abstract: No abstract text available
Text: NTGS3455T1 MOSFET −3.5 Amps, −30 Volts P−Channel TSOP−6 Features • • • • http://onsemi.com Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available V(BR)DSS RDS(on) TYP
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NTGS3455T1
NTGS3455T1/D
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NTGS3455T1
Abstract: NTGS3455T1G
Text: NTGS3455T1 MOSFET −3.5 Amps, −30 Volts P−Channel TSOP−6 Features • • • • http://onsemi.com Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available V(BR)DSS RDS(on) TYP
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NTGS3455T1
NTGS3455T1/D
NTGS3455T1
NTGS3455T1G
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Untitled
Abstract: No abstract text available
Text: NTGS3443T1 Power MOSFET 4.4 Amps, 20 Volts P−Channel TSOP−6 http://onsemi.com Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available 4.4 AMPERES 20 VOLTS
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NTGS3443T1
NTGS3443T1/D
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NTGS4111P
Abstract: No abstract text available
Text: NTGS4111P Power MOSFET −30 V, −4.7 A, Single P−Channel, TSOP−6 Features • • • • • Leading −30 V Trench Process for Low R DS on Low Profile Package Suitable for Portable Applications Surface Mount TSOP−6 Package Saves Board Space Pb−Free Package Available (G Suffix)
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NTGS4111P
NTGS4111P/D
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2fu smd transistor
Abstract: Infrared sensor TSOP 1738 diode ESM 765 tsop Ir sensor smd 1608 TSOP44 Package layout TSOP infrared infrared sensor (TSOP 1738)data sheet Compact High-Current and Low VF Surface Mounting Device SBD TC58V16BFT
Text: Memory MOS Memory Lineup • Static RAM Capacity bits Device TC55V1001ASTI/ASRI 1M Organization Access time (ns) Power supply voltage (V) 128 K X 8 TC55V2001STI/SRI Package Pins TSOP(8 X 13.4) 32 TSOP- (10 X 14) 40 TSOP- (0.4 inch) 44 256 K X 8 TC55V020FT/TR
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TC55V1001ASTI/ASRI
TC55V2001STI/SRI
TC55V020FT/TR
TC55V2161FTI
TC55V200FT/TR
TC55V040FT/TR
TC55V400FT/TR
TC58VT
TC75S55FU
2fu smd transistor
Infrared sensor TSOP 1738
diode ESM 765
tsop Ir sensor
smd 1608
TSOP44 Package layout
TSOP infrared
infrared sensor (TSOP 1738)data sheet
Compact High-Current and Low VF Surface Mounting Device SBD
TC58V16BFT
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T-944
Abstract: No abstract text available
Text: TAPE & REEL SPECIFICATIONS 32-pin TSOP Package Carrier Tape Critical Dimensions 2.0±0.1 Ø1.55±0.05 0.3±0.05 4.0±0.1 Y E F Ø1.6 ±0.1 W B2 B0 R 0.3 Typical Y K1 K0 P1 K B1 SECTION Y-Y Lead Count Package 32 TSOP Carrier Tape Dimensions mm W F E B0 B1
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32-pin
3502ASTR
3404ASTR
545-FRAM,
T-944
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Untitled
Abstract: No abstract text available
Text: NTGS3455T1 MOSFET −3.5 Amps, −30 Volts P−Channel TSOP−6 Features • • • • http://onsemi.com Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available V(BR)DSS RDS(on) TYP
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NTGS3455T1
NTGS3455T1/D
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Untitled
Abstract: No abstract text available
Text: NTGS3433T1 MOSFET −3.3 Amps, −12 Volts P−Channel TSOP−6 http://onsemi.com Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available V(BR)DSS RDS(on) TYP
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NTGS3433T1
NTGS3433T1/D
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m14 transistor
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC FPT-28P-M14 28-pin plastic TSOP II Lead pitch 50mil Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-28P-M14) * : Resin protrusion. (Each side : 0.15 (.006) Max) 28-pin plastic TSOP (II)
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FPT-28P-M14
50mil
400mil
28-pin
FPT-28P-M14)
F28040S-2C-1
m14 transistor
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Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 50 PIN PLASTIC FPT-50P-M06 50-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M06) * : Resin protrusion. (Each side : 0.15 (.006) Max) 50-pin plastic TSOP (II)
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FPT-50P-M06
400mil
50-pin
FPT-50P-M06)
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400MIL
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 50 PIN PLASTIC FPT-50P-M05 50-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M05) * : Resin protrusion. (Each side : 0.15 (.006) Max) 50-pin plastic TSOP (II)
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FPT-50P-M05
400mil
50-pin
FPT-50P-M05)
F50005S-2C-1
400MIL
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A37 diode
Abstract: No abstract text available
Text: NTGS4111P, NVGS4111P Power MOSFET −30 V, −4.7 A, Single P−Channel, TSOP−6 Features • • • • • • Leading −30 V Trench Process for Low RDS on Low Profile Package Suitable for Portable Applications Surface Mount TSOP−6 Package Saves Board Space
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NTGS4111P,
NVGS4111P
NTGS4111P/D
A37 diode
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BGA and QFP Package mounting
Abstract: THIN QUAD FLAT L-LEADED PACKAGE PLASTIC BGA and QFP Package 70SOP BGA 256 PACKAGE power dissipation ceramic QFP Package 100 lead
Text: 1. PACKAGE CLASSIFICATIONS 2 Surface mounting type package Type Package Types Package Symbol Pin count MS 8, 16 GS 24, 28, 32, 40, 44 MS 20 GS 28, 30, 32, 60, 64, 70 SOP SSOP GS-B TSOP TypeI) TSOP (TypeII) TS QFP GS-2 Plastic GS-B 26/20, 26/24, 28/24, 28, 44/40, 44, 48,
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Untitled
Abstract: No abstract text available
Text: NVGS4111P Product Preview Power MOSFET −30 V, −6.2 A, Single P−Channel, TSOP−6 Features • • • • • • Leading −30 V Trench Process for Low RDS on Low Profile Package Suitable for Portable Applications Surface Mount TSOP−6 Package Saves Board Space
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NVGS4111P
NVGS4111P/D
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TSOP 54 Package
Abstract: TSOP 54 PIN 54-PIN TSOP II 54 Package
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 54 PIN PLASTIC FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80mm Package width 500mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M01) * : Resin protrusion. (Each side : 0.15 (.006) Max) 54-pin plastic TSOP (II)
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FPT-54P-M01
500mil
54-pin
FPT-54P-M01)
F54001S-2C-1
TSOP 54 Package
TSOP 54 PIN
TSOP II 54 Package
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TSOP 44 Package
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M18 44-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M18) * : Resin protrusion. (Each side : 0.15 (.006) Max) 44-pin plastic TSOP (II)
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FPT-44P-M18
400mil
44-pin
FPT-44P-M18)
F44025S-1C-1
120mil
TSOP 44 Package
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