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    TSOP32 PAD Search Results

    TSOP32 PAD Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    V36BEZ02307000T Amphenol Communications Solutions ExtremePort QSFP-DD 112G stacked SMT connector, Glue pad version Visit Amphenol Communications Solutions
    NDHN3B7 Amphenol Communications Solutions Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 30u\\ Pd Ni with Gold flash plating Visit Amphenol Communications Solutions
    NDHN3B2 Amphenol Communications Solutions Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 8u\\ Gold plating Visit Amphenol Communications Solutions
    NDHN6B2 Amphenol Communications Solutions Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Bulkhead, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 8u\\ Gold plating Visit Amphenol Communications Solutions
    MSPEP6P22A0 Amphenol Communications Solutions SPE IP67 Plug, Push Pull Lock, Solder Pad, 28 to 18 AWG, Cable OD 0.138in to 0.252in, 3 Grommets Visit Amphenol Communications Solutions

    TSOP32 PAD Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    soj16 package

    Abstract: adaptor ssop56 dip48 W9518 W9512 W9514 SOJ-20 W9524 soj16 soj18 package TSOP14 package
    Text: WINSLOW ADAPTICs - SOIC or SOJ Solder Pads to DIP Adapters SOIC or SOJ Solder Pads to DIP ADAPTICs how to order shipping costs terms & conditions These ADAPTICs have an array of SOP solder pads on the top and male pins on the underside to mate with a DIP socket or solder into a


    Original     		PDF W12109 W9594 W9501 DIP08, W9583 TSSOP10, DIP10, SSOP48, DIP48, W9570 soj16 package adaptor ssop56 dip48 W9518 W9512 W9514 SOJ-20 W9524 soj16 soj18 package TSOP14 package

    Untitled

    Abstract: No abstract text available
    Text: Very Low Power CMOS SRAM 512K X 8 bit BS62LV4006 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 30mA Max. at 55ns


    Original     		PDF BS62LV4006 volta62LV4006 R0201-BS62LV4006

    TSOP32 pad

    Abstract: bs62lv1027 R0201-BS62LV1027
    Text: Very Low Power CMOS SRAM 128K X 8 bit BS62LV1027 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 18mA Max. at 55ns


    Original     		PDF BS62LV1027 BS62LVontinued) R0201-BS62LV1027 TSOP32 pad bs62lv1027 R0201-BS62LV1027

    BS62LV2006

    Abstract: BS62LV2006DC BS62LV2006SC BS62LV2006STC BS62LV2006TC TSOP32 pad
    Text: Very Low Power CMOS SRAM 256K X 8 bit BS62LV2006 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 23mA Max. 2mA (Max.)


    Original     		PDF BS62LV2006 BS62LV2006 R0201-BS62LV2006 BS62LV2006DC BS62LV2006SC BS62LV2006STC BS62LV2006TC TSOP32 pad

    375E-1

    Abstract: BS62LV4006 BS62LV4006EC BS62LV4006PC BS62LV4006SC BS62LV4006STC BS62LV4006S stsop32
    Text: Very Low Power CMOS SRAM 512K X 8 bit BS62LV4006 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 30mA Max. at 55ns


    Original     		PDF BS62LV4006 R0201-BS62LV4006 375E-1 BS62LV4006 BS62LV4006EC BS62LV4006PC BS62LV4006SC BS62LV4006STC BS62LV4006S stsop32

    Untitled

    Abstract: No abstract text available
    Text: Very Low Power CMOS SRAM 128K X 8 bit BS62LV1027 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 18mA Max. at 55ns


    Original     		PDF BS62LV1027 supp1027 R0201-BS62LV1027

    Untitled

    Abstract: No abstract text available
    Text: Very Low Power CMOS SRAM 256K X 8 bit BS62LV2006 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 23mA Max. 2mA (Max.)


    Original     		PDF BS62LV2006 BS62LV2006 R0201-BS62LV2006

    BS62LV1027

    Abstract: BS62LV1027DC BS62LV1027PC BS62LV1027SC BS62LV1027STC BS62LV1027TC VDR15
    Text: Very Low Power CMOS SRAM 128K X 8 bit BS62LV1027 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 18mA Max. at 55ns


    Original     		PDF BS62LV1027 R0201-BS62LV1027 BS62LV1027 BS62LV1027DC BS62LV1027PC BS62LV1027SC BS62LV1027STC BS62LV1027TC VDR15

    AN58 NOVRAM Battery Backed SRAM

    Abstract: layout soic28 X20C17 DS1220 pnp array SCR Inverter datasheet TSOP32 pad Unlimited Xicor an58 AN58
    Text: Application Note AN58 NOVRAM vs. Battery Backed SRAM: Latch-up Considerations for Nonvolatile Systems by Gray Creager, September 1994 Nonvolatile memories come in many varieties ROM, PROM, EPROM, etc. , however in-circuit reprogrammable nonvolatile memories are often


    Original     		PDF X20C04 X20C05 X20C16 X20C17 XM20C64 XM20C128 X22C10 X22C12 X25401 X24C44 AN58 NOVRAM Battery Backed SRAM layout soic28 X20C17 DS1220 pnp array SCR Inverter datasheet TSOP32 pad Unlimited Xicor an58 AN58

    sharp laser diodes

    Abstract: TSOP855
    Text: VISHAY INTERTECHNO L O G Y , INC . INTERACTIVE data book ir receiver modules vishay semiconductors vse-db0090-1010 Notes: 1. To navigate: a Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents


    Original     		PDF vse-db0090-1010 sharp laser diodes TSOP855

    marking a9

    Abstract: BS62LV1027 A988
    Text: Very Low Power CMOS SRAM 128K X 8 bit Automotive Grade BS62LV1027 Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 15mA Max. at 70ns


    Original     		PDF BS62LV1027 R0201-BS62LV1027A marking a9 BS62LV1027 A988

    125OC

    Abstract: BS62LV2006
    Text: Very Low Power CMOS SRAM 256K X 8 bit BS62LV2006 Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 18mA Max. 2mA (Max.) Standby current : 0.1uA (Typ.)


    Original     		PDF BS62LV2006 BS62LV2006 R0201-BS62LV2006A 125OC

    Untitled

    Abstract: No abstract text available
    Text: Very Low Power CMOS SRAM 128K X 8 bit Automotive Grade BS62LV1027 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 18mA Max. at 55ns


    Original     		PDF BS62LV1027 R0201-BS62LV1027A

    jedec ms-024

    Abstract: BS62LV4006SA
    Text: Very Low Power CMOS SRAM 512K X 8 bit Automotive Grade BS62LV4006 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 30mA Max. at 55ns


    Original     		PDF BS62LV4006 R0201-BS62LV4006A jedec ms-024 BS62LV4006SA

    BS62LV4006

    Abstract: No abstract text available
    Text: Very Low Power CMOS SRAM 512K X 8 bit Automotive Grade BS62LV4006 Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 5.5V Ÿ Very low power consumption : VCC = 3.0V Operation current : 25mA Max. at 70ns


    Original     		PDF BS62LV4006 BS62LV4006 R0201-BS62LV4006A

    jedec ms-024

    Abstract: BH62UV4000 BH62UV4000DI BH62UV4000SI
    Text: Ultra Low Power/High Speed CMOS SRAM 512K X 8 bit BH62UV4000 Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC low operation voltage : 1.65V ~ 3.6V Ÿ Ultra low power consumption : VCC = 3.6V Operation current : 10mA Max. at 55ns


    Original     		PDF BH62UV4000 V/25OC BH62UV4000 R0201-BH62UV4000 36-ball jedec ms-024 BH62UV4000DI BH62UV4000SI

    PGA68

    Abstract: clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight
    Text: CHEMICAL CONTENT OF SEMICONDUCTOR PACKAGING SEPTEMBER 1998 Corp. Environment Strategies Corp. Package Development USE IN LIFE SUPPORT DEVICES OR SYSTEMS MUST BE EXPRESSLY AUTHORIZED STMicroelectronics PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE


    Original     		PDF GS-150T 102x51x19 GS-100T GS-R1005 PGA68 clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight

    MQFP Shipping Trays

    Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    JEDEC TRAY DIMENSIONS

    Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    TATC-X03

    Abstract: stss-sw1e SOMC-14 smd x17 P440 C 05 MX-500P-21 O M 335 SP440 talon MX-500S
    Text: SmartHeat Technology SmartHeat 22/11/01 2:09 pm Page 8 S mar t He at ® W h e n t h e t e m p e r a t u r e o f t h e he a te r a c o p p e r b a r c o a te d wi th a ma g netized iro n/nickel a llo y r e a c h e s a c e r t a i n l e v e l ( i t s C u r i e Po i nt) , i t s t op s a b s or b i n g e ne r g y an d th e t empera ture becom es


    Original     		PDF MX-500P-11 MX-500P-21 TATC-X03 stss-sw1e SOMC-14 smd x17 P440 C 05 MX-500P-21 O M 335 SP440 talon MX-500S

    FSQ510 Equivalent

    Abstract: BTA12 6008 bta16 6008 ZIGBEE interface with AVR ATmega16 Precision triac control thermostat thyristor t 558 f eupec gw 5819 diode transistor a564 A564 transistor BSM25GP120 b2
    Text: SEMICONDUCTORS MCU/MPU/DSP Atmel. . . . . . . . . 167, 168, 169, 170, 171, 172 Blackhawk. . . . . . . . . . . . . . . . . . . . . . . . . 173 Cyan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 Cypress. . . . . . . . . . . . . . . 175, 176, 177, 178


    Original     		PDF GP-20) FSQ510 Equivalent BTA12 6008 bta16 6008 ZIGBEE interface with AVR ATmega16 Precision triac control thermostat thyristor t 558 f eupec gw 5819 diode transistor a564 A564 transistor BSM25GP120 b2

    METCAL SP200

    Abstract: MX-500P-21 QX2-P-21 SP440 QX2-P-11 SP-PW1-20 ERG IC 1118 NZ-D1113 D1116 MX-500S-11
    Text: Precision Systems for the Electronics Bench SOLDERING, DESOLDERING AND REWORK SYSTEMS SP 44 0 SP440 Desoldering System Since 1982, OK International’s Metcal brand has been the industr y ’s single source of high-per formance, precision systems for the electronics bench.


    Original     		PDF SP440 AC-BP-11 AC-BP-21 AC-PH-11 AC-PH-21 BRO-MET-06 METCAL SP200 MX-500P-21 QX2-P-21 QX2-P-11 SP-PW1-20 ERG IC 1118 NZ-D1113 D1116 MX-500S-11

    Untitled

    Abstract: No abstract text available
    Text: Cover and contents 22/11/01 2:04 pm Page 2 Precision Systems for the Electronics Bench SOLDERING, DESOLDERING AND REWORK SYSTEMS Precision Systems for the Electronics Bench WORLD HEADQUARTERS AND NORTH AMERICAN OFFICE 1530 O’BRIEN DRIVE • MENLO PARK • CA 94025 • USA


    Original     		PDF MET-US-001 MX-500

    enamelled copper wire swg table

    Abstract: RS-274-D for all smd components F585-34 BS4520 BS4584 PART 3 MELF 3514 dimensions jigs and fixtures mini project BS4584 102.5 cuzn40pb2
    Text: 987 Technical portal and online community for Design Engineers - www.element-14.com PCB Prototyping Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bread Boards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CAD Software Systems . . . . . . . . . . . . . . . . . . . . .


    Original     		PDF element-14 127mm 210x297mm) 420x297mm) 33MTR enamelled copper wire swg table RS-274-D for all smd components F585-34 BS4520 BS4584 PART 3 MELF 3514 dimensions jigs and fixtures mini project BS4584 102.5 cuzn40pb2