TSSOP-16 MOLDING COMPOUND Search Results
TSSOP-16 MOLDING COMPOUND Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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CS-USBAA00000-002 |
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Amphenol CS-USBAA00000-002 Molded USB 2.0 Cable - Type A-A 2m | Datasheet | ||
CS-USBAB00000-001 |
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Amphenol CS-USBAB00000-001 Molded USB 2.0 Cable - Type A-B 1m | Datasheet | ||
CS-USBAB00000-002 |
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Amphenol CS-USBAB00000-002 Molded USB 2.0 Cable - Type A-B 2m | Datasheet | ||
CS-USBAA00000-003 |
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Amphenol CS-USBAA00000-003 Molded USB 2.0 Cable - Type A-A 3m | Datasheet | ||
CS-USBAA00000-005 |
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Amphenol CS-USBAA00000-005 Molded USB 2.0 Cable - Type A-A 5m | Datasheet |
TSSOP-16 MOLDING COMPOUND Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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Untitled
Abstract: No abstract text available
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Original |
TSSOP-16LD-PBY-RS-3 120909HC01 | |
122105-HC
Abstract: No abstract text available
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TSSOP-16LD-GRN-RS-1 122105-HC | |
g28 SOT23
Abstract: weston 461 st 95160 9418 transistor TO-92 9742 9943 so-8 9418 transistor 9806 9928 f56 dd pack m
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S-191 g28 SOT23 weston 461 st 95160 9418 transistor TO-92 9742 9943 so-8 9418 transistor 9806 9928 f56 dd pack m | |
STMicroelectronics smd marking code
Abstract: BGA and QFP Package 14x14 STMICROELECTRONICS MSL STMicroelectronics date code tssop-14 HiQuad package STMicroelectronics pentawatt date code opto mold compound infineon msl TQFP 14X20 ST TSSOP Marking
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CRP/04/744 2002/95/EC) STMicroelectronics smd marking code BGA and QFP Package 14x14 STMICROELECTRONICS MSL STMicroelectronics date code tssop-14 HiQuad package STMicroelectronics pentawatt date code opto mold compound infineon msl TQFP 14X20 ST TSSOP Marking | |
Ablebond 8390
Abstract: ESDA6V2HPRL CLP190ERL LM358DT ESDA6V2HP CLP190 LM324DT M74HC14RM13TR LM2904DT 16 g700
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DSG/03/380 24-Feb-2004 28-Nov-2003 Ablebond 8390 ESDA6V2HPRL CLP190ERL LM358DT ESDA6V2HP CLP190 LM324DT M74HC14RM13TR LM2904DT 16 g700 | |
MAX6809
Abstract: ST 9727 st 9635 st 9548 12x12 bga thermal resistance MAX232CWE 9846B MAX232 integrated chips 9836 maxim iso 9717
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1-888-MAXIM-IC MAX6809 ST 9727 st 9635 st 9548 12x12 bga thermal resistance MAX232CWE 9846B MAX232 integrated chips 9836 maxim iso 9717 | |
STMicroelectronics smd marking code
Abstract: smd marking code stmicroelectronics BGA bga 10x13 BGA 15X15 BGA 23X23 HEPTAWATT SMD Marking STMicroelectronics tqfp INFINEON package tqfp PART MARKING PLCC Part Marking STMicroelectronics Date Code Marking STMicroelectronics PACKAGE DPAK
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MLD-MIC/05/943 MLD-MIC/05/943 STMicroelectronics smd marking code smd marking code stmicroelectronics BGA bga 10x13 BGA 15X15 BGA 23X23 HEPTAWATT SMD Marking STMicroelectronics tqfp INFINEON package tqfp PART MARKING PLCC Part Marking STMicroelectronics Date Code Marking STMicroelectronics PACKAGE DPAK | |
PHD64
Abstract: land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14
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100MHz PHD64 land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14 | |
ISL6406IBZ
Abstract: ISL6406IR ISL6406IRZ ISL6406IV ISL6406IVZ MO-220 ISL6406 ISL6406IB
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ISL6406 ISL6406 15MHz FN9073 ISL6406IBZ ISL6406IR ISL6406IRZ ISL6406IV ISL6406IVZ MO-220 ISL6406IB | |
CFC-211
Abstract: No abstract text available
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BRD8022/D r14525 BRD8022/D CFC-211 | |
Untitled
Abstract: No abstract text available
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DEI1046, DEI1047, DEI1148 DO-160D DEI1046. DEI1046/1047) DEI1148) DEI1046/1047 IN84L MO-112 | |
Untitled
Abstract: No abstract text available
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DEI1046, DEI1047, DEI1148 DO-160 DEI1046. DEI1046/1047) DEI1148) DEI1046/1047 DEI1046FINISH MO-153-BD-1 | |
WD2010
Abstract: X5083
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X5083 FN8127 WD2010 X5083 | |
VSC7132YB-01
Abstract: VSC7132-01 VSC7123 G524
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VSC7132-01 0625Gb/s IEEE802 25Gb/s SMPTE-292M 485Gb/s 28-pin, VSC7132-01 0625Gb/s) 25Gb/s) VSC7132YB-01 VSC7123 G524 | |
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X25169
Abstract: X5168 X5169
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X5168, X5169 X25268, X25169) FN8130 16Kbit X25169 X5168 X5169 | |
SMD CODE 9Z
Abstract: 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products
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300mm SMD CODE 9Z 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products | |
X5043
Abstract: X5043P X5045 marking AFB MSOP-8 X5043AP X5045P-2.7A
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X5043, X5045 X5043 X5043) X5045) FN8126 20iption X5043 X5043P X5045 marking AFB MSOP-8 X5043AP X5045P-2.7A | |
X5163zf
Abstract: No abstract text available
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X5163, X5165 FN8128 16Kbit X5163zf | |
SP3232EUCY-L
Abstract: SPX432M SP3220EBCY-L/TR SP3220EBEY-L SP3232ECY-L SP6213EC5-L-3.3/TR SP6214EC5-L-3-0 SP6214EC5-L-3-3 SPX2431AM-L sp336ee
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SP332CT-L/TR SP332ET-L SP332ET-L/TR SP211EHCT-L SP211EHCT-L/TR SP336ECT-L SP336ECT-L/TR SP336EET-L SP336EET-L/TR SP3232EUCY-L SPX432M SP3220EBCY-L/TR SP3220EBEY-L SP3232ECY-L SP6213EC5-L-3.3/TR SP6214EC5-L-3-0 SP6214EC5-L-3-3 SPX2431AM-L sp336ee | |
X25328
Abstract: X25329 X5328 X5329 X5328V14IZ
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X5328, X5329 X25328, X25329) 32Kbit 32Kbits --32-bytetion FN8132 X25328 X25329 X5328 X5329 X5328V14IZ | |
DEI1046-TMS-G
Abstract: DEI1148 ARINC DEI1048 DEI1046 DEI1148-QES-G DEI1046-TES-G
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DEI1046, DEI1047, DEI1148 DO-160D DEI1046. DEI1046/1047) DEI1148) DEI1046/1047 MO-112 DS-MW-01046-01 DEI1046-TMS-G ARINC DEI1048 DEI1046 DEI1148-QES-G DEI1046-TES-G | |
ckvb
Abstract: RCS-500 stv-3 diode EL5000A EL5000AER EL5000AER-T13 EL5000AER-T7 EL5000AERZ EL5000AERZT13 EL5000AERZ-T7
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EL5000A EL5000A 100mA FN6167 TSSOP-16 40ription ckvb RCS-500 stv-3 diode EL5000AER EL5000AER-T13 EL5000AER-T7 EL5000AERZ EL5000AERZT13 EL5000AERZ-T7 | |
X9410
Abstract: X9410WP24 X9410YS24 X9410YS24I X9410YV24 X9410YV24I X9410YV24IZ X9410YV24Z
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X9410 FN8193 X9410 X9410WP24 X9410YS24 X9410YS24I X9410YV24 X9410YV24I X9410YV24IZ X9410YV24Z | |
ic 741 application
Abstract: CA600
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VSC7132 IEEE802 SMPTE-292M 28-pin, VSC7132 0625Gb/s) VSC7123, G52243-0, ic 741 application CA600 |