744051
Abstract: "MATERIAL DECLARATION SHEET"
Text: MATERIAL DECLARATION SHEET Material # 6657S Product Line Precisions Posted Date Compliance Date Since Inception RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Housing Molded PBT 6.8 2 Bushing Steel Alloy 1.35 3 Hex Nut Brass Alloy
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6657S
744051
"MATERIAL DECLARATION SHEET"
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3545H
Abstract: 3545-H metal oxide grease TUNGSTEN ALLOY SHEET 744051
Text: MATERIAL DECLARATION SHEET Material # 3545H Product Line Precisions Posted Date Compliance Date Ref. 3548 RoHS Compliant No No. Construction element Material group Material weight [g] 1 Shaft Brass Alloy 9.1625 2 C-Ring Stainless Steel Alloy 0.009 3 Bushing
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3545H
3545H
3545-H
metal oxide grease
TUNGSTEN ALLOY SHEET
744051
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744051
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material # 6637S Product Line Precisions Posted Date Compliance Date Since Inception RoHS Compliant Yes No. Construction element Material group Material weight [g] 1 Contact Spring Palmet Alloy 0.00095 2 C-Ring Stainless Steel Alloy
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6637S
7440-5num
744051
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MR301
Abstract: nec mr301 LR46266 MR301H
Text: Document No. ER0046EJAV3SG00 WWW-MR301 MR301 Series 1998 • DIMENSIONS mm(inch) 22.5MAX. (0.89) 0.3 (0.01) 3.5 (0.14) 17MAX. (0.67) 16.5MAX. (0.65) 12.2 2 2.3 (0.48) (0.08) (0.09) Tolerance ±0.2 mm (0.008) 12 2 (0.47) (0.08) ■ RECOMMENDED PCB PAD LAYOUT and
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ER0046EJAV3SG00
WWW-MR301)
MR301
17MAX.
nec mr301
LR46266
MR301H
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Solder Paste, Indium 5.8
Abstract: ABLEBOND 84-1LMIT ro4003 8mil 1295SA cte table epoxy PCB Rogers RO4003 84-1-LMIT cte table RO4003 RO4350
Text: AMMC-XXXX Production Assembly Process Application Note 5409 Description Recommended Collet Drawing This document describes and illustrates the handling and attachment of Avago’s AMMC-XXXX mmWave bare die. Handling Guidelines Avago’s GaAs mmWave ICs vary in size but are typically
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84-1LMIT
-40deg
AV02-1543EN
Solder Paste, Indium 5.8
ABLEBOND 84-1LMIT
ro4003 8mil
1295SA
cte table epoxy
PCB Rogers RO4003
84-1-LMIT
cte table
RO4003
RO4350
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Untitled
Abstract: No abstract text available
Text: Power PCB Relay G2R • Creepage distance of 8.0 mm min. between coil and contact. • Dual-winding latching type available. • Plug-in and quick-connect terminals available see G2R-S(S data sheet). • High sensitivity (360 mW) and high capacity (16 A) types
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G2R-14-DC12)
X301-E-1c
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G2R-217
Abstract: dpdt latching relay omron relay g2r G2R-2 HP125 b300 pilot duty 10a omron g2r 1 e dc12 G2R-1 relay tv3 G2RK OMRON
Text: Power PCB Relay G2R • Creepage distance of 8.0 mm min. between coil and contact. • Dual-winding latching type available. • Plug-in and quick-connect terminals available see G2R-S(S data sheet). • High sensitivity (360 mW) and high capacity (16 A) types
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G2R-14-DC12)
X301-E-1b
G2R-217
dpdt latching relay omron
relay g2r
G2R-2
HP125
b300 pilot duty 10a
omron g2r 1 e dc12
G2R-1
relay tv3
G2RK OMRON
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Untitled
Abstract: No abstract text available
Text: Power PCB Relay G2R • Creepage distance of 8.0 mm min. between coil and contact. • Dual-winding latching type available. • Plug-in and quick-connect terminals available see G2R-S(S data sheet). • High sensitivity (360 mW) and high capacity (16 A) types
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G2R-14-DC12)
X301-E-1c
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Untitled
Abstract: No abstract text available
Text: Issued March 1997 232-4774 Data Pack G Carbide parting off system Data Sheet RS stock numbers 849-243 to 849-394 Introduction Originally developed in the 1950’s, Tungsten Carbide Inserts are preformed shapes made from a mixture of cemented carbides. They are manufactured by a sintering rather than a melting process.
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tokin 108
Abstract: NEC RELAY MR301 NEC Tokin 108 Tokin
Text: DATA SHEET AUTOMOTIVE RELAYS EQ1 SERIES DESCRIPTION The new NEC TOKIN EQI Series automotive relays are designed for motor and lamp control applications that require a high level of quality and performance. The EQ1 has a unique two-piece design for the magnetic circuit,
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MR301
MR301
DE0202
P0188EMDD03VOL01E
tokin 108
NEC RELAY MR301
NEC Tokin 108
Tokin
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EQ1 Series
Abstract: tokin 108 NEC RELAY MR301 NEC Tokin 108 NEC Tokin relay relay nec 31000S catalog
Text: DATA SHEET To be discontinued in July,2014 AUTOMOTIVE RELAYS EQ1 SERIES DESCRIPTION The new NEC TOKIN EQI Series automotive relays are designed for motor and lamp control applications that require a high level of quality and performance. The EQ1 has a unique two-piece design for the magnetic circuit,
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MR301
MR301
DE0202
P0188EMDD03VOL01E
EQ1 Series
tokin 108
NEC RELAY MR301
NEC Tokin 108
NEC Tokin relay
relay nec 31000S
catalog
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Dupont 9476
Abstract: No abstract text available
Text: ASIC FLIP CHIPS Application Note ASIC Flip Chips: Manufacture and Use By Barbara L. Gibson, Applications Engineer plastic encapsulated device: wire bonds and wire damage during assembly, are avoided. By attaching directly to the substrate without being mounted on a lead frame or
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MRF286
Abstract: EB211
Text: MOTOROLA Order this EB211 document by EB211/D SEMICONDUCTOR ENGINEERING BULLETIN EB211 Thermal Management and Solder Mounting Method for the MRF286, 60 Watt Power Device in a CuW Copper Tungsten Base Package Prepared by: Jeanne Pavio, Jerry Mason, Bill Adams, Wendi Stemmons, Craig Johnson, Bob Wentworth,
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EB211
EB211/D
MRF286,
MRF286
EB211
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Model 3M
Abstract: No abstract text available
Text: 980/980E Ionized Air Gun Data Sheet The 3M 980 Ionized Air Gun is an excellent tool for blowing particulate contamination off of any surface, even from the most static-sensitive products. It releases a constantly balanced stream of compressed ionized air or gas that neutralizes static charge that
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980/980E
Model 3M
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V10686
Abstract: v1068 ABB P6 C276 MR-01-75 UNSN06600ASME Welding Hastelloy MR0175 en10204 600Lb hastelloy corrosion
Text: Data Sheet Heavy Duty Thermowell SS/HDT_1 for the Oil & Gas Industry Constructed from durable, high-quality materials – for use in heavy duty applications Low cost of ownership – exchangeability of inserts while line or vessel is in service Wide range of applications covered
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MRF286
Abstract: EB211
Text: Freescale Semiconductor, Inc. MOTOROLA SEMICONDUCTOR ENGINEERING BULLETIN ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Order this EB211 document by EB211/D EB211 Thermal Management and Solder Mounting Method for the MRF286, 60 Watt Power Device in a CuW
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EB211
EB211/D
MRF286,
MRF286
EB211
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latching relay G2R
Abstract: omron g2r-2 Datasheet OMRON G2R-24 A300 B300 E41643 G2R-14 G2R-14-DC12 G2R-24
Text: Power PCB Relay G2R • Creepage distance of 8.0 mm 0.31 min. between coil and contact. • Dual-winding latching type available. • Plug-in and quick-connect terminals available (see G2R-S(S) data sheet). • High sensitivity (360 mW) and high capacity (16 A) types
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G2R-14-DC12)
JB301-E3-01
latching relay G2R
omron g2r-2 Datasheet
OMRON G2R-24
A300
B300
E41643
G2R-14
G2R-14-DC12
G2R-24
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pyrometer
Abstract: 55-FE optical pyrometer 80ni
Text: Issued July 1990 A10625 Infra-red temperature indicator pyrometer Stocknumber 254-112 The RS low cost, non-contact temperature indicator is ideal for applications where objects to be measured are of low thermal mass or are inappropriate for contact measurement, ie. moving parts.
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A10625
pyrometer
55-FE
optical pyrometer
80ni
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SOT333
Abstract: SOT423 sot468 thermal compound wps II TO metal package aluminum kovar SOT439 Transistor Packages sot262 SOT443 rf transistor smd pages
Text: Philips Semiconductors RF transmitting transistor and power amplifier fundamentals 4 RF and microwave transistor packages RF AND MICROWAVE TRANSISTOR PACKAGES handbook, halfpage The packages of electronic devices are, in general, designed to: metal cap – Protect the electronics from mechanical damage
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Untitled
Abstract: No abstract text available
Text: G5RL-U/-K PCB Power Relay 16 A High Switching Current, General-purpose Latching Relay • Creepage distance 8 mm between coil and contacts. • 10 kV Impulse withstand voltage. • Ambient Operating Temperature 85°C • Suitable for TV-8 rating. SPST-NO (1a
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K265-E1-01
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KR207
Abstract: KR310 HEIDENHAIN rod
Text: Model THP Tweezer Handpiece A successful resistance spot welding process generally requires a welding power supply, a spot welding head, and a weld monitor or weld checker. Selecting the right accessories for these critical components can enhance and improve your results, and provide
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ET0402
EP0402
EP0802
DE-82178
KR207
KR310
HEIDENHAIN rod
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240-W
Abstract: G2R-14-DC12 16A 250VAC 16A 30VDC omron relays DATASHEET G2R-14 G2R-24 G2RK2A 8A DPDT RELAY 220 omron g2r-2 G2RK
Text: Power PCB Relay G2R • Creepage distance of 8.0 mm min. between coil and contact. • Dual-winding latching type available. • Plug-in and quick-connect terminals available see G2R-S(S data sheet). • High sensitivity (360 mW) and high capacity (16 A) types
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G2R-14-DC12)
X301-E-1
240-W
G2R-14-DC12
16A 250VAC 16A 30VDC omron relays DATASHEET
G2R-14
G2R-24
G2RK2A
8A DPDT RELAY 220
omron g2r-2
G2RK
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it1338
Abstract: Solder Paste Dupont
Text: ASIC Flip Chips: Manufacture and Use fôv H . i r b t i r a I . i i h s o n , A p p l i c a t i o n s F n i» i iu 't * i Introduction plastic encapsulated device: wire bonds and wire damage during assembly, are avoided. By attaching directly to the substrate without being mounted on a lead frame or
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Flip Chip Substrate
Abstract: Dupont 9476
Text: ASIC Flip Chips: Manufacture and Use ! ir i v i t : ì I>mmi . Introduction Application specific integrated circuits ASICs have been available and widely used for almost two decades. On the other hand, the surface mount technology known as "Flip Chip” has been available, but not widely known outside of
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17ces
Flip Chip Substrate
Dupont 9476
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