RTK7CKA6M5S04001BE
|
|
Renesas Electronics Corporation
|
Cloud Kit Based on RA6M5 MCU Group |
|
|
10129381-904001BLF
|
|
Amphenol Communications Solutions
|
EconoStik™, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 4 Positions, 2.54 mm (0.100in) Pitch. |
|
|
10129379-904001BLF
|
|
Amphenol Communications Solutions
|
EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in) Pitch. |
|
|
10129383-904001BLF
|
|
Amphenol Communications Solutions
|
EconoStik™, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 4 Positions, 2.54 mm (0.100in) Pitch. |
|
|
10129378-904001BLF
|
|
Amphenol Communications Solutions
|
EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Verticl Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in) Pitch. |
|
|