68604-401HLF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100in) Pitch.
93944-401HLF
Amphenol Communications Solutions
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 1 Positions, 2.54mm (0.100in) Pitch.
68004-401HLF
Amphenol Communications Solutions
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
TLV5633IDW
Texas Instruments
12-Bit DAC Parallel Voltage Out Pgrmable Int Ref Settling Time, Pwr Consumption, 8-bit uC Comp Int 20-SOIC -40 to 85
