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    JEDEC-51-2

    Abstract: x23-7783D 82801DB MM2K JEDEC51 37.5x37.5 Shinetsu X23 855GME Al grade 6063 mmx black anodized aluminum plate
    Text: White Paper Chun Howe Sim Thermal Mechanical Application Engineer Jason Loh Thermal Mechanical Application Engineer Fanless Cooling for Embedded Applications Intel Corporation January 2009 321057 Fan-less Cooling for Embedded Application Executive Summary


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