PCN0515
Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
Text: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently
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PCN0515
HC-100
UL-94
1x1011
PCN0515
sumitomo G770
G770* sumitomo
G770 mold compound
G770 sumitomo
Unbiased HAST 130, 85 RH, 100 Hrs
G770
G770* G770 mold compound Sumitomo 1000
thermal conductivity of sumitomo g770
G770 HC
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Mark W4
Abstract: SM-0202-02 7133W
Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: SM-0202-02 Product Affected: Date: February 25, 2002 7132, 7133 and 7134 Families Manufacturing Location Affected: Salinas, California Date Effective: May 25, 2002
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SM-0202-02
IDT7130
IDT7132
IDT71321
IDT7140
IDT7142
IDT71421
Mark W4
7133W
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DO-160G
Abstract: JESD22-A102 DPM 659 44PTQS JESD22-A110 11Q2 JESD22-A104 - TEST CONDITION K 92691 Unbiased HAST 130, 85 RH, 100 Hrs 64PTQS
Text: Holt Integrated Circuits Device Reliability Report For Second Quarter 2012 9/30/2012 Document Number: QR-1222, Revision 1.0 Approved by: Scott Paladichuk Director of Quality 23351 Madero Mission Viejo, CA 92691Tel: 949.859.8800 The Reliability and Quality Program
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QR-1222,
92691Tel:
32PQS,
64PQS,
DO-160G
JESD22-A102
DPM 659
44PTQS
JESD22-A110
11Q2
JESD22-A104 - TEST CONDITION K
92691
Unbiased HAST 130, 85 RH, 100 Hrs
64PTQS
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68HC11L6
Abstract: 68hc11ka4 68HC11PH8 68HC11a1 527 MOSFET TRANSISTOR motorola D65C 68HC05N4 nippon denso 68HC05B6 128 QFP 14x20
Text: CMRQS/D REV 10 MOTOROLA MICROCONTROLLER TECHNOLOGIES GROUP RELIABILITY AND QUALITY MONITOR REPORT Quarter 1, 1997 Semiconductor Product Sector Test results contained herein are for information only. This report does not alter MotorolaÕs standard warranty or product speciÞcations.
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68hc11pa8
Abstract: 68hc11kg4 68B09E 68HC11PH8 HC711KG4 68HC11KA4 68HC57 68HC11L6 HC705B16 motorola 68hc11kg4
Text: MCTG RELIABILITY AND QUALITY 1996 ANNUAL REPORT MRQSY96/D Microcontroller Technologies Group Reliability and Quality 1996 Annual Report To Our Valued Customers: Thank you for selecting Motorola as your preferred supplier of Microcontroller products. We in Motorola’s
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MRQSY96/D
68hc11pa8
68hc11kg4
68B09E
68HC11PH8
HC711KG4
68HC11KA4
68HC57
68HC11L6
HC705B16
motorola 68hc11kg4
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68hc26
Abstract: 68HC05C4 68hc705p9 68HC05B6 JPC3400 68hc805b6 68705r3 68HC05C12 68HC705B5 68HC68SE
Text: CSIC Microcontroller Division Reliability and Quality Quarter 2, 1996 Report MOTOROLA INC., 1996 CSIC MICROCONTROLLER DIVISION RELIABILITY AND QUALITY REPORT TECHNICAL INFORMATION . 1-1 RELIABILITY DATA BY TECHNOLOGY. 2-1
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PCN0516
Abstract: G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo
Text: PROCESS CHANGE NOTIFICATION PCN0516 MOLD COMPOUND CHANGE FOR PBGA PACKAGES Change Description: Altera is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic ball-grid array PBGA packaged devices. Devices in 225, 256, and 672 pin PBGA
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PCN0516
x10-5/C
x102N/mm2
UL-94
1X10E12
PCN0516
G770* G770 mold compound Sumitomo 1000
sumitomo g770
G770* sumitomo
thermal conductivity of sumitomo g770
G770 mold compound
G770
plaskon
G770 mold compound data sheet
G770 sumitomo
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Virtex-6 reflow
Abstract: WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320
Text: Device Reliability Report First Quarter 2010 UG116 v5.9 May 4, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, p∅ost, or transmit the
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UG116
611GU
FGG676
FFG1152
Virtex-6 reflow
WS609
xc3s3400a
xcv400e-b
UG116
XCS20XL pqg208
UG-116
XC1702L
XCE4VSX25
xc3s500e fg320
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CY93L422PC
Abstract: cy9122 cy93l422 cy7c122 sumitomo epoxy am-113 7C122 EME-6300H UL-94V0 CY93422 22 CDIP DIMENSIONS
Text: Qualification Report January 1992 QTP 90172 256 x 4 Static RAM MARKETING PART NBR DEVICE DESCRIPTION CY7C122 SIO Version 1.1 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part
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CY7C122
7C122A
200mA
CY93L422PC
cy9122
cy93l422
cy7c122
sumitomo epoxy am-113
7C122
EME-6300H
UL-94V0
CY93422
22 CDIP DIMENSIONS
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XC6SLX45t-fgg484
Abstract: XC6SLX16-CSG324 XC6SLX100-FGG676 XC6SLX45 FGG484 x2 type ac capacitor XC6SLX16 FIT rate xc3s3400a UG116 XC95288 Virtex-6 reflow
Text: Device Reliability Report Third Quarter 2010 UG116 v5.11 November 1, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the “Documentation”) to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG116
611GU
FGG676
FFG1152
XC6SLX45t-fgg484
XC6SLX16-CSG324
XC6SLX100-FGG676
XC6SLX45 FGG484
x2 type ac capacitor
XC6SLX16 FIT rate
xc3s3400a
UG116
XC95288
Virtex-6 reflow
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ADV1005
Abstract: EP2AGX45DF29C6N rh 115-2 EP2AGX95EF35I5N EP2AGX45DF29I5N EP2AGX65DF29I5N EP2AGX125EF29I3N EP2AGX65 EP2AGX45DF25C6N EP2AGX260FF35C4N
Text: Revision: 1.0.0 CUSTOMER ADVISORY ADV1005 ADDITIONAL ASSEMBLY SITE FOR THE ARRIA A II GX FBGA PACKAGE Change Description Altera will be introducing Amkor, Korea ATK as an additional assembly source for the Arria® II GX FBGA packagess. The Arria II GX family is currently manufactured out of Amkor,
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ADV1005
ADV1005
EP2AGX45DF29C6N
rh 115-2
EP2AGX95EF35I5N
EP2AGX45DF29I5N
EP2AGX65DF29I5N
EP2AGX125EF29I3N
EP2AGX65
EP2AGX45DF25C6N
EP2AGX260FF35C4N
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PCN0902
Abstract: HC220F780NAK HC220F672nan HC210F484NAC XZ-092 HC230F1020BN HC240F1020NBC HC230F1020AW EP2S60F1020C4N EP2SGXF1152AA
Text: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0902 ADDITIONAL ASSEMBLY SOURCE AND BILL OF MATERIAL CHANGE FOR ALTERA FLIP CHIP PRODUCTS Change Description This is an update to PCN0902; please see the revision history table for information specific to this
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PCN0902
PCN0902;
PCN0902
HC220F780NAK
HC220F672nan
HC210F484NAC
XZ-092
HC230F1020BN
HC240F1020NBC
HC230F1020AW
EP2S60F1020C4N
EP2SGXF1152AA
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LCMXO2-1200
Abstract: CEL-9750ZHF CEL-9750ZHF10
Text: MachXO2 Product Family Qualification Summary Lattice Document # 25 – 106923 July 2013 Lattice Semiconductor Corporation Doc. #25-106923 Rev. G 1 Dear Customer, Enclosed is Lattice Semiconductor‟s MachXO2 Product Family Qualification Report. This report was created to assist you in the decision making process of selecting and using our products. The
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LCMXO2-1200-25WLCSP
LCMXO2-1200
CEL-9750ZHF
CEL-9750ZHF10
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Reliability
Abstract: No abstract text available
Text: Quality/Reliability Certifications ANSI/ESD S.20.20 As an industry leader, Skyworks has demonstrated its quality leadership and strengthened its commitment to customer satisfaction through formal, third-party registration to ISO 9001, ISO/TS 16949 and ANSI/ESD S.20.20.
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JESD22A111
Abstract: JESD22-A111 JESD22A-111 J-STD-22A111 J-STD-020D
Text: Application Report SCEA041 – September 2008 Wave Solder Exposure of SMT Packages James Huckabee, Steven Kummerl, Dominic Nguyen, Douglas W. Romm, and Larry Ting. ABSTRACT Attaching surface mount components to the bottomside of a printed circuit board PCB
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SCEA041
JESD22A111
JESD22-A111
JESD22A-111
J-STD-22A111
J-STD-020D
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71016s
Abstract: No abstract text available
Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: SR0011-04 DATE: Product Affected: 71016S, 71124S, 71128S Manufacturing Location Affected: N/A Date Effective: Contact: Title: Phone #: Fax #:
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SR0011-04
71016S,
71124S,
71128S
71016s
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QS001
Abstract: 71V124SA
Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN 11/30/00 PCN #: SR0011-05 DATE: Product Affected: 71V016SA , 71V124SA Manufacturing Location Affected: N/A Date Effective: Contact: Title: Phone #:
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SR0011-05
71V016SA
71V124SA
QS001
71V124SA
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N20X DIODE
Abstract: A35355 TA8923 ta8872 ta8903 TA8782 ta7833 transistor 123 TA7811 ta8825
Text: Reliability Update Table of Contents Overview . 1 Organization of the Update . 1
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100LPQFP
160LPQFP
28LSOIC
N20X DIODE
A35355
TA8923
ta8872
ta8903
TA8782
ta7833
transistor 123
TA7811
ta8825
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Sumitomo 6730B
Abstract: JESD22-A114 transistor A114 XR5488EID-F JESD22-78 100PF A114 JESD22 07eV
Text: RELIABILITY REPORT # 09-138 FOR XR5486EID-F XR5488EID-F October 21, 2009 EXAR CORPORATION 48720 Kato Road, Fremont, CA 94538 Phone # 510 668-7000/ Fax # (510) 668-7022 Report #: 09-138 XR5486EID-F GENERAL INFORMATION CHIP DATA PACKAGE DATA FAB: EPISIL ASSEMBLY:
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XR5486EID-F
XR5488EID-F
XR5486EID-F
14Lds
epi-5X-sc12
/-8000V*
/-15000V*
Mil-Std-883
JESD22
Sumitomo 6730B
JESD22-A114
transistor A114
XR5488EID-F
JESD22-78
100PF
A114
JESD22
07eV
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CY7C190
Abstract: cy7c189 sumitomo silver epoxy 7C189 EME-6300H UL-94V0 lc 245a CY27S07 dynamic ram cmos 16pin 7C190
Text: Qualification Report January 1992 QTP 90313 64 Bit Static RAM Family MARKETING PART NBR DEVICE DESCRIPTION CY7C189 Inverted R/W CY7C190 R/W Version 1.1 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part
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CY7C189
CY7C190
7C189B
200mA
64-bit
CY7C190
cy7c189
sumitomo silver epoxy
7C189
EME-6300H
UL-94V0
lc 245a
CY27S07
dynamic ram cmos 16pin
7C190
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86171
Abstract: EME-6300H CY7C123 CY7C150 UL-94V0 94v-0 dynamic RAM EME6300H
Text: Qualification Report January 1992 QTP 90151 1K x 4 Static RAM MARKETING PART NBR DEVICE DESCRIPTION CY7C150 SIO Version 1.1 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part
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CY7C150
7C150A
200mA
86171
EME-6300H
CY7C123
CY7C150
UL-94V0
94v-0 dynamic RAM
EME6300H
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39SF512
Abstract: 39vf020 39SF010 37vf040 39VF512 39VF010 A114 transistor 39VF040 transistor A114 27SF020
Text: SST Product Reliability SST Product Reliability INTRODUCTION The SST quality policy is: To satisfy customer requirements by providing products and services that are cost effective, on schedule, and with zero nonconformances to specifications. SST is developing a quality system in accordance with the
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ISO-9001
S72023-00-000
SF3-33A
39VF040/39VF020/39VF010/39VF512
39SF512
39vf020
39SF010
37vf040
39VF512
39VF010
A114 transistor
39VF040
transistor A114
27SF020
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QCA-1795
Abstract: CMOS 7 CMOS7 1509-01 idt6116la IDT7164 6116L4
Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: SR-0203-02 DATE: March 15, 2002 IDT7164 and IDT6116 Family Product Affected: Date Effective: June 15, 2002 Contact: George Snell Quality Assurance Manager
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SR-0203-02
IDT7164
IDT6116
FRA-1509-01
QCA-1795
SR-0203-02
IDT6116LA
IDT6116SA
QCA-1795
CMOS 7
CMOS7
1509-01
6116L4
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74ALVCH162830DF
Abstract: 74ALVCHS162830 Moisture Sensitivity Level change L0302
Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN L-0302-04 2/18/03 PCN #: DATE: Product Affected: TVSOP 80 package type (DF80) 74ALVCHS162830DF & 74ALVCH162830DF Date Effective: February 18, 2003
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L-0302-04
74ALVCHS162830DF
74ALVCH162830DF
10-20sec,
J-STD-020
74ALVCH162830DF
74ALVCHS162830
Moisture Sensitivity Level change
L0302
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